DE3362914D1 - Magnetic apparatus for reducing substrate warpage - Google Patents

Magnetic apparatus for reducing substrate warpage

Info

Publication number
DE3362914D1
DE3362914D1 DE8383303993T DE3362914T DE3362914D1 DE 3362914 D1 DE3362914 D1 DE 3362914D1 DE 8383303993 T DE8383303993 T DE 8383303993T DE 3362914 T DE3362914 T DE 3362914T DE 3362914 D1 DE3362914 D1 DE 3362914D1
Authority
DE
Germany
Prior art keywords
web
travel
path
substrate material
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383303993T
Other languages
English (en)
Inventor
Joachim Doehler
Vincent Cannella
Richard Owen Gray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Energy Conversion Devices Inc
Original Assignee
Energy Conversion Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Energy Conversion Devices Inc filed Critical Energy Conversion Devices Inc
Application granted granted Critical
Publication of DE3362914D1 publication Critical patent/DE3362914D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photovoltaic Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
  • Magnetic Record Carriers (AREA)
DE8383303993T 1982-07-12 1983-07-08 Magnetic apparatus for reducing substrate warpage Expired DE3362914D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/397,190 US4440107A (en) 1982-07-12 1982-07-12 Magnetic apparatus for reducing substrate warpage

Publications (1)

Publication Number Publication Date
DE3362914D1 true DE3362914D1 (en) 1986-05-15

Family

ID=23570183

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383303993T Expired DE3362914D1 (en) 1982-07-12 1983-07-08 Magnetic apparatus for reducing substrate warpage

Country Status (13)

Country Link
US (1) US4440107A (de)
EP (1) EP0099708B1 (de)
JP (1) JPS5923573A (de)
AT (1) ATE19101T1 (de)
AU (1) AU556673B2 (de)
CA (1) CA1189174A (de)
DE (1) DE3362914D1 (de)
IE (1) IE54608B1 (de)
IL (1) IL69153A (de)
IN (1) IN158687B (de)
MX (1) MX153562A (de)
PH (1) PH19759A (de)
ZA (1) ZA835032B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512284A (en) * 1983-12-19 1985-04-23 Rca Corporation Glow discharge apparatus for use in coating a disc-shaped substrate
DE3427057A1 (de) * 1984-07-23 1986-01-23 Standard Elektrik Lorenz Ag, 7000 Stuttgart Anlage zum herstellen von halbleiter-schichtstrukturen durch epitaktisches wachstum
US4664951A (en) * 1985-07-31 1987-05-12 Energy Conversion Devices, Inc. Method provided for corrective lateral displacement of a longitudinally moving web held in a planar configuration
DE4324320B4 (de) * 1992-07-24 2006-08-31 Fuji Electric Co., Ltd., Kawasaki Verfahren und Vorrichtung zur Herstellung einer als dünne Schicht ausgebildeten fotovoltaischen Umwandlungsvorrichtung
JPH06280026A (ja) * 1993-03-24 1994-10-04 Semiconductor Energy Lab Co Ltd 成膜装置及び成膜方法
FR2703073B1 (fr) * 1993-03-26 1995-05-05 Lorraine Laminage Procédé et dispositif pour le revêtement en continu d'un matériau métallique en défilement par un dépôt de polymère à gradient de composition, et produit obtenu par ce procédé.
JP3332700B2 (ja) 1995-12-22 2002-10-07 キヤノン株式会社 堆積膜形成方法及び堆積膜形成装置
TW303480B (en) * 1996-01-24 1997-04-21 Applied Materials Inc Magnetically confined plasma reactor for processing a semiconductor wafer
DE19830402C2 (de) * 1998-07-08 2001-02-22 Ardenne Anlagentech Gmbh Verfahren und Vorrichtung zur Abscheidung von Funktionsschichten auf bewegten Substraten in einem PECVD-Prozeß
US6863835B1 (en) 2000-04-25 2005-03-08 James D. Carducci Magnetic barrier for plasma in chamber exhaust
US20060278163A1 (en) * 2002-08-27 2006-12-14 Ovshinsky Stanford R High throughput deposition apparatus with magnetic support
JP2008520103A (ja) * 2004-11-10 2008-06-12 デイスター テクノロジーズ，インコーポレイティド 連続プロセスを用いて薄膜太陽電池を形成するための方法及び装置
WO2006053218A2 (en) * 2004-11-10 2006-05-18 Daystar Technologies, Inc. Pressure control system in a photovoltaic substrate deposition
US20100028533A1 (en) * 2008-03-04 2010-02-04 Brent Bollman Methods and Devices for Processing a Precursor Layer in a Group VIA Environment
US9252318B2 (en) * 2008-03-05 2016-02-02 Hanergy Hi-Tech Power (Hk) Limited Solution containment during buffer layer deposition
US20110081487A1 (en) * 2009-03-04 2011-04-07 Brent Bollman Methods and devices for processing a precursor layer in a group via environment
US9105778B2 (en) * 2009-06-12 2015-08-11 Apollo Precision (Kunming) Yuanhong Limited Systems methods and apparatuses for magnetic processing of solar modules
US8062384B2 (en) * 2009-06-12 2011-11-22 Miasole Systems, methods and apparatuses for magnetic processing of solar modules
JP6261967B2 (ja) * 2013-12-03 2018-01-17 株式会社ディスコ 加工装置
CN104862650B (zh) * 2015-05-15 2017-04-19 京东方科技集团股份有限公司 一种柔性基板蒸镀装置及蒸镀方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2731212A (en) * 1953-02-13 1956-01-17 Richard S Baker Polyphase electromagnet strip guiding and tension device
US2925062A (en) * 1953-05-15 1960-02-16 Heraeus Gmbh W C Coating apparatus
GB1157120A (en) * 1966-08-15 1969-07-02 Templeborough Rolling Mills Lt Methods of and apparatus for Treating Steel Rod or Wire
FR2043492A7 (en) * 1970-03-26 1971-02-19 Nivelet Et Barbier Metallic strip unwinding and shearing - apparatus
US3661116A (en) * 1970-11-23 1972-05-09 Bethlehem Steel Corp Magnetic stabilizing means for strip
LU69013A1 (de) * 1973-03-07 1974-02-22
JPS5642054B2 (de) * 1973-07-25 1981-10-02
US4410558A (en) * 1980-05-19 1983-10-18 Energy Conversion Devices, Inc. Continuous amorphous solar cell production system
JPS5736437A (en) * 1980-08-14 1982-02-27 Fuji Photo Film Co Ltd Producing device of magnetic recording medium
US4389970A (en) * 1981-03-16 1983-06-28 Energy Conversion Devices, Inc. Apparatus for regulating substrate temperature in a continuous plasma deposition process
US4369730A (en) * 1981-03-16 1983-01-25 Energy Conversion Devices, Inc. Cathode for generating a plasma

Also Published As

Publication number Publication date
JPS5923573A (ja) 1984-02-07
MX153562A (es) 1986-11-14
EP0099708B1 (de) 1986-04-09
EP0099708A1 (de) 1984-02-01
IL69153A (en) 1986-10-31
IE54608B1 (en) 1989-12-06
AU1665883A (en) 1984-01-19
PH19759A (en) 1986-06-26
IN158687B (de) 1987-01-03
CA1189174A (en) 1985-06-18
IE831602L (en) 1984-01-12
ATE19101T1 (de) 1986-04-15
AU556673B2 (en) 1986-11-13
US4440107A (en) 1984-04-03
ZA835032B (en) 1984-04-25
IL69153A0 (en) 1983-11-30
JPH0376595B2 (de) 1991-12-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee