DE3343082A1 - Platinenanordnung - Google Patents

Platinenanordnung

Info

Publication number
DE3343082A1
DE3343082A1 DE19833343082 DE3343082A DE3343082A1 DE 3343082 A1 DE3343082 A1 DE 3343082A1 DE 19833343082 DE19833343082 DE 19833343082 DE 3343082 A DE3343082 A DE 3343082A DE 3343082 A1 DE3343082 A1 DE 3343082A1
Authority
DE
Germany
Prior art keywords
thick
components
layer
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19833343082
Other languages
English (en)
Inventor
Franz Dipl.-Ing. 7180 Crailsheim Weinzierl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19833343082 priority Critical patent/DE3343082A1/de
Publication of DE3343082A1 publication Critical patent/DE3343082A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

  • P latinenanordnung
  • Gegenstand der Erfindung: Gegenstand der Erfindung ist eine Platinenanordnung für elektronische Geräte, wo es insbesondere auf - kleinstes Volumen, - kürzeste Verbindungen zwischen elektrischen Bauelementen, z.b. Chipkondensatoren mit Spulen bei hoher Frequenz sowie, - rationellster Fertigung ankommt.
  • Bisher Bekanntes: Beliebig bestückte starre und flexible Leiterbahnen.
  • Erfindungsgedanke: Erfindungsgedanke ist eine Leiterplatte für elektronische Schaltungen in gemischter Bestückung für nicht-dickschichtfähige Baulemente (Bauelemente mit Drahtanschlüssen, Bauelemente und Halbleiter in DIL-Gehäuse, u.ä.) und dickschichtfähige Elemente (insbesondere "Chip-Bauelemente"), wobei die Platine in Längszonen aufgeteilt ist, die Längszonen abwechselnd mit dickschichtfähigen und nicht-dickschichtfähigen Bauelementen bestückt sind, daß die nicht-dickschichtfähigen Elemente abwechselnd auf Ober- und Unterseite bestückt sind, die Platine mäanderförmig abwinkelbar ist, so daß ein ausgefüllter Raum mit Rechteckprofil entsteht, in dem alle Bauelemente -dickschichtfähig und nicht-dickschichtfähig - mit bester Raumausnützung einfach montierbar sind Beispiel: In Abb. 1 ist ein Beispiel der Erfindung im Herstellungszustand dargestellt: Die Platine besteht aus den Zonen 1, 3, 5..., die abwechselnd auf Ober- und Unterseite mit nicht-dickschichtfähigen Elementen 21, 22, 23..., bestückt sind und den Zonen 2, 4, 6,..., die mit dickschichtfähigen Elementen 31...34...bestückt sind.
  • Die Platine ist wie üblich mit leitenden Oberflächen und Leiterbahnen, z.B.
  • #us Cu- Kaschierung versehen, die an den Faltstellen 11.. .15... flexibel ist.
  • [n Abb. 2 ist die Platine zusammengefaltet.
  • Vbb. 3 zeigt, daß die Technologie des Erfindungsgedankens bereits bei einer ~einfachen L-förmigen Abwinkelung sinnvoll ist.
  • - Leerseite -

Claims (1)

  1. Anspruch, Leiterplatte für elektroniche Schaltungen in gemischter Bestückung für nichtdickschichtfähige Baulemente (Bauelemente mit Drahtanschlüssen, Bauelemente und Halbleiter in DIL-Gehäuse, u.ä.) und dickschichtfähige Elemente (insbesondere ~Chip-Bauelemente"), dadurch gekennzeichnet, daß die Platine in Längszonen aufgeteilt ist, die Längszonen abwechselnd mit dickschichtfähigen und nicht-dickschichtfähigen Bauelementen bestückt sind, daß die nicht-dickschichtfähigen Elemente abwechselnd auf Ober- und Unterseite bestückt sind, die Platine mäanderförmig abwinkelbar ist.
DE19833343082 1983-11-29 1983-11-29 Platinenanordnung Ceased DE3343082A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833343082 DE3343082A1 (de) 1983-11-29 1983-11-29 Platinenanordnung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833343082 DE3343082A1 (de) 1983-11-29 1983-11-29 Platinenanordnung

Publications (1)

Publication Number Publication Date
DE3343082A1 true DE3343082A1 (de) 1985-06-05

Family

ID=6215518

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833343082 Ceased DE3343082A1 (de) 1983-11-29 1983-11-29 Platinenanordnung

Country Status (1)

Country Link
DE (1) DE3343082A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3836033A1 (de) * 1988-10-22 1990-04-26 Hella Kg Hueck & Co Elektrisches geraet, insbesondere fuer kraftfahrzeuge
EP1983489A3 (de) * 2007-04-18 2011-09-07 Dr. Ing. h.c. F. Porsche AG Elektrische Bedieneinheit, insbesondere Funkschlüssel für ein Kraftfahrzeug

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3836033A1 (de) * 1988-10-22 1990-04-26 Hella Kg Hueck & Co Elektrisches geraet, insbesondere fuer kraftfahrzeuge
EP1983489A3 (de) * 2007-04-18 2011-09-07 Dr. Ing. h.c. F. Porsche AG Elektrische Bedieneinheit, insbesondere Funkschlüssel für ein Kraftfahrzeug

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Legal Events

Date Code Title Description
8131 Rejection