DE3334921A1 - Process for producing an embossed multi-layer material - Google Patents

Process for producing an embossed multi-layer material

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Publication number
DE3334921A1
DE3334921A1 DE19833334921 DE3334921A DE3334921A1 DE 3334921 A1 DE3334921 A1 DE 3334921A1 DE 19833334921 DE19833334921 DE 19833334921 DE 3334921 A DE3334921 A DE 3334921A DE 3334921 A1 DE3334921 A1 DE 3334921A1
Authority
DE
Germany
Prior art keywords
adhesive
glue
board
laminate board
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833334921
Other languages
German (de)
Other versions
DE3334921C2 (en
Inventor
Heinz 7979 Leutkirch Maslock
Dieter 4650 Gelsenkirchen Wolfrum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metzeler Schaum GmbH
Original Assignee
Metzeler Schaum GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metzeler Schaum GmbH filed Critical Metzeler Schaum GmbH
Priority to DE3334921A priority Critical patent/DE3334921C2/en
Priority to AT0253984A priority patent/AT385232B/en
Priority to ES535699A priority patent/ES8507383A1/en
Publication of DE3334921A1 publication Critical patent/DE3334921A1/en
Application granted granted Critical
Publication of DE3334921C2 publication Critical patent/DE3334921C2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43C—FASTENINGS OR ATTACHMENTS OF FOOTWEAR; LACES IN GENERAL
    • A43C1/00—Shoe lacing fastenings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B32B2037/1223—Hot-melt adhesive film-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/12—Paper, e.g. cardboard
    • B32B2317/125—Paper, e.g. cardboard impregnated with thermosetting resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2317/00—Animal or vegetable based
    • B32B2317/16—Wood, e.g. woodboard, fibreboard, woodchips

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a process for producing an embossed multi-layer board, consisting of a carrier board, especially a chipboard, and a coating on at least one side made of a laminate board consisting of paper webs impregnated with cured resins. For relatively light embossing with low pressure, it is provided according to the invention to apply a layer of at least 80-200 g/m<2> of an adhesive to the carrier board, to lay the laminate board thereon and to compression-mould the composite thus produced by means of an embossing die acting on the laminate board in a heat-curing manner with the application of heat. <IMAGE>

Description

Verfahren zur Herstellung einer geprägtenMethod of making an embossed

Mehrschichtplatte Die Erfindung betrifft ein Verfahren zur Herstellung einer geprägten Mehrschichtplatte, bestehend aus einer Trägerplatte, insbesondere einer Spanplatte, und einer mindestens einseitigen Beschichtung aus einer - Schichtstoffplatte, die aus mit ausgehärteten Harzen getränkten Papierbahnen besteht.Multi-layer board The invention relates to a method of manufacture an embossed multilayer plate, consisting of a carrier plate, in particular a chipboard, and at least one-sided coating made of a - laminate board, which consists of paper webs impregnated with hardened resins.

Ein derartiges Verfahren ist aus der DE-OS 3105731 bekannt. Dabei wird zwischen die Trägerplatte und die Schichtstoffplatte eine Bahn aus einer weichelastischen Zwischenschicht aus Schaumstoff eingelegt, die Schaumstoffbahn mit einem aushärtenden Kleber mehr oder weniger getränkt und anschließend der Verbund unter einem Prägestempel verpresst, so daß sich die Tiefe der Prägungen der Schichtstoffplatte zumindest über eine Teilhöhe der weichelastischen Zwischenschicht erstrecken. Bei einem derartigen Verfahren lassen sich Prägungen relativ großer Tiefe erreichen. Das Verfahren ist jedoch sehr aufwendig, da es mehrere Schritte umfaßt und stets ein entsprechender Schaumstoff zur Verfügung stehen muß.Such a method is known from DE-OS 3105731. Included between the carrier plate and the laminate plate, a sheet made of a soft elastic Intermediate layer of foam inserted, the foam sheet with a hardening More or less soaked in glue and then the composite under an embossing stamp pressed, so that the depth of the embossing of the laminate board at least Extend over part of the height of the flexible intermediate layer. With such a Processes can be embossed with a relatively great depth. The procedure is but very complex, since it comprises several steps and always a corresponding one Foam must be available.

Demgegenüber liegt der Erfindung die Aufgabe zugrunde, ein Verfahren zur Herstellung einer derartigen geprägten Mehrschichtplatte anzugeben, die bei gleichem optischen Erscheinungsbild erheblich einfacher hergestellt werden kann. Dabei soll auch hier eine Prägung mit einem relativ geringen Druck möglich sein, der weit unter den 2 bisher üblichen Drücken von 1,5 - 2,0 N/mm2 liegt, der für eine direkte Verprägung von Schichtstoffplatte und Trägerplatte erforderlich ist.In contrast, the invention is based on the object of a method specify for the production of such an embossed multilayer board, which at the same visual appearance can be produced much more easily. Embossing with a relatively low pressure should also be possible here, which is far below the 2 previously usual pressures of 1.5 - 2.0 N / mm2, which is for direct embossing of the laminate board and carrier board is required.

Zur Lösung dieser Aufgabe ist erfindungsgemäß vorgesehen, daß auf die Trägerplatte eine Schicht von mindestens 80 - 200 g/m - eines Klebers aufgetragen, die Schichtstoffplatte aufgelegt und der so geschaffene Verbund durch einen auf die Schichtstoffplatte einwirkenden Prägestempel unter Wärmezufuhr heißhärtend verpreßt wird.To solve this problem, the invention provides that on a layer of at least 80 - 200 g / m - of an adhesive is applied to the carrier board, the laminate board is placed and the composite created in this way by a the die acting on the laminate plate is pressed in a hot-curing manner with the supply of heat will.

überraschenderweise hat sich nämlich gezeigt, daß bei einem Kleberauftrag hinreichender Stärke von etwa mindestens 0,5 - 1 mm eine Verprägung mit geringem Druck möglich ist, da dann bei einem Wegdrücken des Klebers unter den eingedrückten Bereichen der Schichtstoffplatte dieser Kleber in die dazwischenliegenden Bereiche dringt und diese zusätzlich nach oben aufwölbt, so daß damit auch eine Prägung relativ großer Tiefe erreicht werden kann.Surprisingly, it has been shown that when an adhesive is applied sufficient thickness of about at least 0.5 - 1 mm an embossing with a slight Pressure is possible because then when the adhesive is pushed away under the impressed Areas of the laminate board this glue in the areas in between penetrates and this also bulges upwards, so that an embossing is also relative great depth can be achieved.

Zweckmäßigerweise erfolgt das heißhärtende Verpressen bei einer Temperatur von 60 - 1400c und einem Druck 2 von 0,1 - 0,5 N/mm Als Kleber können dabei thermoplastische Leime, aushärtbare Harzleime oder Leime auf Isocyanatbasis verwendet werden. Zweckmäßigerweise wird dem Kleber dabei ein Füllstoffanteil von bis zu 20 % zugesetzt, wobei dieser Füllstoff aus Leichtspat, Calziumcarbonat oder -Sulfat, Caolin, Holzmehl, Stärkemehl oder Leichtmetallpulver oder aus einer Mischung von 2 oder mehreren dieser Stoffe bestehen kann.The hot-curing pressing is expediently carried out at one temperature of 60 - 1400c and a pressure 2 of 0.1 - 0.5 N / mm. Thermoplastic Glues, curable resin glues or isocyanate-based glues can be used. Appropriately a filler content of up to 20% is added to the adhesive, whereby this Filler made from light spar, calcium carbonate or sulfate, caolin, wood flour, starch flour or light metal powder or a mixture of 2 or more of these substances can exist.

Darüber hinaus ist es auch möglich, als Kleber eine Schmelzkleberfolie zu verwenden.In addition, it is also possible to use a hot-melt adhesive film as the adhesive to use.

Anhand einer shematischen Zeichnung sind Aufbau und Wirkungsweise eines Ausführungsbeispiels in Form einer nach dem Verfahren hergestellten Platte näher erläutert. Dabei zeigen: Fig. 1 einen Längsschnitt durch eine Mehrschichtplatte im unverpreßten Zustand; Fig. 2 einen Längsschnitt durch diese Platte im vorgeprägten Zustand und Fig. 3 eine Aufsicht auf eine derartige geprägte Platte.A schematic drawing shows the structure and mode of operation of an embodiment in the form of a manufactured according to the process Plate explained in more detail. They show: FIG. 1 a longitudinal section through a multilayer board in the unpressed state; Fig. 2 is a longitudinal section through this plate in the pre-embossed State and FIG. 3 is a plan view of such an embossed plate.

Wie aus Figur 1 zu ersehen ist, wird zunächst auf eine Trägerplatte 1, die beispielsweise aus einer Spanplatte bestehen kann, eine Kleberschicht 2 in gleichmäßiger Dicke aufgetragen. Die Dicke dieser Kleberschicht sollte dabei - abhängig von der Tiefe der gewünschten Prägungen und abhängig vom Verhältnis niedergepreßter Bereiche zu unverpreßten Bereichen - mindestens etwa 1 mm betragen.As can be seen from Figure 1, is first on a carrier plate 1, which can for example consist of a chipboard, an adhesive layer 2 in applied evenly thick. The thickness of this adhesive layer should be - dependent on the depth of the desired embossing and depending on the ratio of pressed down Areas to unpressed areas - at least about 1 mm.

Als Kleber eigen sich insbesondere thermoplastische Leime, wie z. B. Polyvinylacetatleim (PVAc) oder aushärtbare Harzleime, wie z .3. Harnstofformaldehyd, Phenolformaldehyd, Resorcin oder Epoxiharze. Es ist aber auch möglich Leime auf Isocyanatbasis zu verwenden, bei denen unter Zusatz von Feuchtigkeit der Leim aufschäumt und der nur einen sehr geringen Preßdruck erfordert.Thermoplastic glues, such as. B. polyvinyl acetate glue (PVAc) or curable resin glue, such as .3. Urea formaldehyde, Phenol formaldehyde, resorcinol or epoxy resins. But it is also possible to glue on Use isocyanate-based, in which the glue foams up with the addition of moisture and which only requires a very low pressure.

Für einen möglichst dicken Auftrag ist es dabei zweckmäßig, den Leim mit einem Füllstoff zu versehen, um eine dickere Konsistenz zu erreichen. Als pulverförmige Füllstoffe eignen sich dazu besonders Leichtspat, Calziumcarbonat, Calziumsulfat, Coalin, Holzmehl oder Getreidemehl sowie Leichtmetallpulver. Der Anteil dieser Füllstoff sollte dabei je nach gewünschter Prägetiefe, d.h. je nach erforderlicher Auftragstärke des Klebers 5 - 20 % betragen.For the thickest possible application, it is useful to use the glue to add a filler to achieve a thicker consistency. As a powder Fillers are particularly suitable for light spar, calcium carbonate, calcium sulfate, Coalin, wood flour or grain flour and light metal powder. The amount this Filler should be depending on the desired embossing depth, i.e. depending on the required Application thickness of the adhesive is 5 - 20%.

Nachdem der Kleber 2 nun sorgfältig und gleichmäßig aufgetragen ist, wird die Schichtstoffplatte 3, wie sie beispielsweise unter dem Markennamen Tacon auf dem Markt ist, auf die Kleberschicht aufgelegt. Der so geschaffene Verbund wird dann in einer Prägepresse unter Wärmezufuhr verpreßt und kurzzeitig ausgehärtet. Für die Prägung und Aushärtung ist dabei eine Temperatur im Bereich von 60 - 1400 und ein Druck von 0,1 - 0,5N/mm2 erforderlich, wobei üblicherweise in einem Temperaturbereich von 75 - 950C gearbeitet wird. Der untere Temperaturbereich und der geringe Druck von 0,1 N/mm² oder etwas darüber ist insbesondere anwendbar bei Verwendung von Leimen auf Isocyanatbasis, da hierbei die Prägung wesentlich durch das Aufschäumen die Schichtstoffplatte in den nicht niedergepreßten Bereichen hochgedrückt wird. Die höheren Temperaturen etwa ab 1000C können bei nur kurzzeitiger Erwärmung angewandt werden, bei der eine Aufwärmung der Trägerplatte noch nicht erfolgt.After the adhesive 2 has now been applied carefully and evenly, is the laminate board 3, as it is, for example, under the brand name Tacon is on the market, placed on the adhesive layer. The network created in this way will then pressed in an embossing press with the supply of heat and cured for a short time. A temperature in the range of 60 - 1400 is required for embossing and curing and a pressure of 0.1-0.5N / mm2 is required, usually in a temperature range from 75 - 950C is worked. The lower temperature range and the low pressure of 0.1 N / mm² or slightly above is particularly applicable when using glues based on isocyanate, since the embossing is essentially due to the foaming Laminate board is pushed up in the areas not pressed down. the higher temperatures around 1000C can be used with only brief heating in which the carrier plate has not yet been warmed up.

Nach dem Verpressen ergibt sich dann eine Mehrschichtplatte, wie sie aus Fig. 2 und 3 zu ersehen ist. Diese Platte ist mit einer karoförmigen Prägung versehen, die beispielsweise durch einfaches Auflegen eines entsprechenden Metallgitters bzw. eines gestanzten, geprägten oder geäzten Bleches erreicht werden kann.After pressing, the result is a multilayer board like her from Figs. 2 and 3 can be seen. This plate is embossed in a diamond shape provided, for example, by simply placing a corresponding metal grid or a punched, embossed or etched sheet metal can be achieved.

Wie man insbesondere aus Fig. 2 deutlich ersieht, ist im Bereich der Prägerillen 4 die Schichtstoffplatte 3 bis auf die Trägerplatte 1 durchgedrückt und hat dabei den Kleber unter die benachbarten hochgewölbten Bereiche 5 gedrückt. Dadurch werden die polsterartigen Auf- wölbungen 5 noch stärker nach oben gedrückt, als es der ursprünglichen Höhe der Kleberschicht 2 entsprach, so daß hierdurch die Prägung sogar noch verstärkt wird.As can be clearly seen in particular from FIG. 2, is in the area of Embossing grooves 4 the laminate plate 3 pressed through to the carrier plate 1 and in the process has pressed the adhesive under the adjacent, arched areas 5. As a result, the upholstery bulges 5 even stronger pressed upwards when it corresponded to the original height of the adhesive layer 2, so that the embossing is even strengthened by this.

Die starke Aufwölbung außerhalb des Bereichs der Prägerillen wird zusätzlich durch eine Wärme streckung der Schichtstoffplatte erreicht, d. h. durch die Erwärmung der Schichtstoffplatte während der Prägung tritt eine geringfügige Erweichung derselben auf, so daß dadurch eine leichtere Aufwölbung möglich ist.The strong bulge outside the area of the embossing grooves is additionally achieved by a thermal stretching of the laminate board, d. H. by there is a slight heating of the laminate board during the embossing Softening of the same, so that a lighter bulge is possible.

Selbstverständlich ist auch jede andere Prägung in Form beliebiger Ornamente oder umlaufender geschlossener Rillen möglich. Eine derartige geprägte Mehrschichtplatte eignet sich besonders für Mobelfronten oder Türen, um diesen ein entsprechendes dekoratives Aussehen zu verleihen.Of course, any other type of embossing is also possible Ornaments or all-round closed grooves possible. Such a coined one Multi-layer panel is particularly suitable for furniture fronts or doors to this one to give a corresponding decorative appearance.

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Claims (8)

Patentansprüche 1 Verfahren zur Herstellung einer geprägten Mehrschichtplatte, bestehend aus einer Trägerplatte, insbesondere einer Spanplatte, und einer mindestens einseitigen Beschichtung aus einer Schichtstoffplatte, die aus mit ausgehärteten Harzen getränkten Papierbahnen besteht, dadurch gekennzeichnet, daß auf die Trägerplatte eine Schicht von mindestens 80 - 200 g/m2 eines Klebers aufgetragen, die Schichtstoffplatte aufgelegt und der so geschaffene Verbund durch einen auf die Schichtstoffplatte einwirkenden Prägestempel unter Mrärmezufuhr heißhärtend verpreßt wird.Claims 1 method for producing an embossed multilayer board, consisting of a carrier plate, in particular a chipboard, and at least one one-sided coating of a laminate board, which is made with cured Resins impregnated paper webs, characterized in that on the carrier plate a layer of at least 80 - 200 g / m2 of an adhesive is applied, the laminate board placed and the bond created in this way by one on the laminate board acting die is pressed hot-curing under supply of heat. 2. Verfahren nach Anspruch 1 dadurch gekennzeichnet, daß das heißhärtende Verpressen bei einer Temperatur von 60 - 1400, insbesondere 75 - 900C, und einem Druck von 0,1 - 0,5N/mm2 erfolgt.2. The method according to claim 1, characterized in that the thermosetting Pressing at a temperature of 60-1400, in particular 75-900C, and one Pressure of 0.1-0.5N / mm2 takes place. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Kleber mit einem Füllstoffanteil von bis zu 20 % versetzt wird.3. The method according to claim 1 or 2, characterized in that the Adhesive is mixed with a filler content of up to 20%. 4. Verfahren nach Anspruch 1 oder 3, dadurch gekennzeichnet, daß als Kleber ein thermoplastischer Leim verwendet wird.4. The method according to claim 1 or 3, characterized in that as Glue a thermoplastic glue is used. 5. Verfahren nach Anspruch 1 oder 3, dadurch gekennzeichnet, daß als Kleber aushärtbare Harzleime verwendet werden.5. The method according to claim 1 or 3, characterized in that as Adhesive curable resin glue can be used. 6. Verfahren nach Anspruch 1 oder 3, dadurch gekennzeichnet, daß als Kleber ein Leim auf Isocyanatbasis verwendet wird.6. The method according to claim 1 or 3, characterized in that as Glue an isocyanate-based glue is used. 7. Verfahren nach Anspruch 3 dadurch gekennzeichnet, daß der Füllstoff aus einem oder mehreren der nachfolgend genannten Stoffe besteht: Leichtspat, Calziumcarbonat oder -Sulfat, Caolin, Holzmehl, Leichtmetallmehl.7. The method according to claim 3, characterized in that the filler consists of one or more of the following substances: Light spar, Calcium carbonate or sulfate, Caolin, wood flour, light metal flour. 8. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß als Kleber eineSchmelzkleberfolie verwendet wird.8. The method according to claim 1 or 2, characterized in that as Adhesive a hot melt adhesive film is used.
DE3334921A 1983-09-27 1983-09-27 Method of making an embossed multilayer board Expired DE3334921C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE3334921A DE3334921C2 (en) 1983-09-27 1983-09-27 Method of making an embossed multilayer board
AT0253984A AT385232B (en) 1983-09-27 1984-08-06 METHOD FOR PRODUCING A MINTED MULTI-LAYER PANEL
ES535699A ES8507383A1 (en) 1983-09-27 1984-09-06 Process for producing an embossed multi-layer material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3334921A DE3334921C2 (en) 1983-09-27 1983-09-27 Method of making an embossed multilayer board

Publications (2)

Publication Number Publication Date
DE3334921A1 true DE3334921A1 (en) 1985-04-11
DE3334921C2 DE3334921C2 (en) 1986-10-23

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DE3334921A Expired DE3334921C2 (en) 1983-09-27 1983-09-27 Method of making an embossed multilayer board

Country Status (3)

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AT (1) AT385232B (en)
DE (1) DE3334921C2 (en)
ES (1) ES8507383A1 (en)

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WO2009124704A1 (en) * 2008-04-07 2009-10-15 Välinge Innovation Belgium BVBA Wood fibre based panels with a thin surface layer
US7811489B2 (en) 2007-11-19 2010-10-12 Valinge Innovation Ab Recycling of laminate floorings
CN101998896A (en) * 2008-04-07 2011-03-30 瓦林格创新比利时股份有限公司 Fibre based panels with a wear resistance surface
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Also Published As

Publication number Publication date
AT385232B (en) 1988-03-10
ATA253984A (en) 1987-08-15
DE3334921C2 (en) 1986-10-23
ES535699A0 (en) 1985-10-01
ES8507383A1 (en) 1985-10-01

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