DE2657924A1 - METHOD OF MANUFACTURING A LAMINATED COMPRESSED PANEL - Google Patents

Description

Dipl-Ing Heinz Lesser Dipt -lug Otto wing. Patent Attorneys D-B Munich 81 Cosimastiaße 81

bison works

Bahre S Greten GmbH & Co. KG L 10.966

3257 Jump / Deister L / km

Process for the production of a layer-molded material

plate

The invention relates to a method for manufacturing a laminated molded sheet made of with thermosetting Lignocellulose-containing and / or cellulose-containing particles mixed with resin, which are compressed under pressure and heat and consists of at least one decorative film impregnated with synthetic resin.

A laminated sheet of pressed material is generally understood to mean a thin plate consisting of several layers of carrier webs impregnated with phenolic plastic resin, the layers of which be combined with one another under pressure and heat. Such laminated molded panels are usually used as decorative layers Used for wood-based panels that are exposed to the elements, for example for house doors od. Like. Even if they are used as decorative layers for furniture. Compared to synthetic resin-impregnated decorative films that are based on Panels, such as chipboard or the like., Are pressed, they have a relatively high rigidity, about the Corresponds to the rigidity of so-called hardboard.

^{While temperatures of about 150 °} C. and pressures of ^{10-20 kp / cm 2} usually have to be used to apply synthetic resin-impregnated decorative films to already cured chipboard, higher pressures usually have to be used in the production of laminated molded panels, too

809825/0528

Dipl-Ing Hem? 1 he-was Dipl Ing OKo PIugel. f-'nlenlanwalte D 8 Munich 81 Cosimastrafie 81

if the heat to be supplied can be increased somewhat. For example, pressures of 100-150 kp / cm ² and, for example, temperatures of 140-160 ° C. are common.

Are such laminate-molded panels on already cured Chipboard or the like. Applied, then the pressures and temperatures to be applied correspond approximately to those that when applying synthetic resin-impregnated decorative films to chipboard or the like.

To the independent production on the one hand of chipboard od. the like. And on the other hand, to avoid laminated molded panels, it is also known (DT-PS 1 144 465), with thermosetting synthetic resin - or decorative foils coated chipboard to be produced in one operation. In order to manufacture such panels, instead of a finished chipboard loose chipboard is used and a chipboard with decorative film is produced in one operation, that between the decorative film soaked with synthetic resin and the loose chip material one or more almost or completely hardened backing films, e.g. hard paper, are inserted, taking these backing films against the backing material and provided each other with a glue, e.g. a glue film, before use. Then you are in the Ability to manufacture chipboard with a decorative layer in a single operation, the one required for this However, the effort is quite considerable, because in addition to the synthetic resin-impregnated decorative film, one or more, almost or fully cured underlay films are to be made available.

The invention is therefore based on the object of producing a laminated molded sheet that is not just one has a simpler structure, but can also be produced inexpensively, and both as such and as a cover

809-825 / 0528

Dip! -tug Hein / Ie ¹ SiPi Dipt Ing OtIo riugel PnIf ³ HUnAMUi'D!) Muncfieii 81 Cosimastraße 81

layer of a chipboard or the like. Can be used.

To solve this problem, it is proposed according to the invention that the lignocellulosic and / or cellulosic ones To add a mixture of at least two thermosetting resins to particles, their curing temperatures differ from each other and which react independently, and to ensure that these particles are in front of the The decorative layer is placed under pressure and heated to such an extent that the resin component hardens and afterwards Applying the decorative layer, a further pressure increase and possibly also a temperature increase takes place in order to then cure the other resin portion. The first-mentioned resin component can also be composed of several components be. What is achieved is that before the decorative layer is placed and pressed onto the particles, a semi-finished product is available, which is about a relatively thin Chipboard or fiberboard or the like. Corresponds. To connect the decorative layer to be applied with the chip layer Much higher pressures and possibly also higher temperatures are to be exerted in order to achieve a thin, however to be able to produce relatively stiff laminated pressed material plate. Although it is basically possible, more or to use less liquid resins to produce the binder mixture, in this case the volatile ones would have to be used Remove components of the resin, which only hardens at a higher temperature, by means of a drying process, It is recommended that the resin component, which hardens at higher temperatures and pressures, be made from a water-insoluble To let resin powder exist, because then the aforementioned drying process is omitted and the second resin component the first can then no longer influence the hardening resin portion, i.e. the pH value of the resin portion that hardens first not changed. So you are immediately after

8G982S / 0528

Dipl.-Itifj Heinz lessor Dipl-Ing Otto Flügel. Piilenl inwalle D 8 Munich 81 CosimastiaRe Rl

curing the at a relatively low temperature hardening resin content is able to put on the synthetic resin drinks decorative film and with a sufficiently high Pressure with curing of the second resin portion with the lignacellulosic and / or cellulosic particles to be pressed to form a layered PreBstoff panel. The first Powdered ones that harden at a higher temperature Resin content becomes flowable before it hardens and thus not only enables an intimate connection of the lignocellulosic and / or cellulose-containing particles with one another, but also an intimate connection between these particles with the synthetic resin-impregnated decorative layer, although the structure is bound by the resin that hardens first Particles is destroyed in the second pressing process because of the considerably increased pressing pressure.

Phenol novolak hexamethylenetetramine resin powder has proven to be particularly useful proven because the melting temperature of this resin powder can be significantly higher than the curing temperature of the resin portion that hardens first. There is then no sticking of the semi-finished product to surfaces, with which it comes into contact during manufacture,

Even if according to the invention to carry out two pressing operations are, this method enables an inexpensive production of laminated molded panels. It is not necessary, to carry out the two pressing processes immediately one after the other; the above-mentioned semi-finished product can also be produced there Are where relatively thin chipboard od. The like. Are made if the binder there above mentioned resin mixture is already added to the lignacellulosic and / or cellulosic particles. The semi-finished chipboard products can then be transported to the point where the decorative layer is applied. For the manufacture of the semi-finished product, both continuous

Dipl Inrj Hf'inz I nisfi Oi)) I-Ing. Otti> Fltigel Palprii.imv.iHo Π-1 Miiiuhnnßi r.osiniastratte 81

Borrowed as well as discontinuously operating presses The same applies to the application of the decorative layer. From the foregoing it follows that the chipboard semi-product can be made with relevant customary devices in the relevant customary manner, it So the spreading, pressing and coating devices used for the production of chipboard or the like can be used Find use.

The resin hardening at a lower temperature can made of urea resin, phenol resin, melamine resin, isocyanate resin or the like, or consist of suitable mixtures of these resins, which may also contain additives, z. B. hardener can be added.

Embodiment

10 kg chip or fiber material, moisture content 1 - 3% glue with at least 5% and more e.g. of approx. 6% urea-formaldehyde resin i.e. e.g. the 1G kg chip or Fiber material

0.923 kg raw glue 65%

0.080 kg ammonium chloride hardener 15%

(2% on solid resin)
Add 0.087 kg of water, which is a liquor of

1.090 kg results, the resin content in the liquor is then 55%.

After the glue has been applied, the resin powder is added, with an addition of about 10% phenol novolak-hexamethylenetetramine Powder - based on the absolutely dry chipboard or fiber material - quite good laminated molded panels can generate. Now this mass becomes

809825/0528

Dipl.-liKj. Heinz lessei, Oipl-Ing Otto Flügel. Patent Attorneys D-8 Munich 81. Cosimasttaßo 8t

a fleece manufactured in the conventional way, for example by sprinkling on a movable surface. This fleece is made into a thin, transportable plate in the flat press or endless process z. B. pressed at 120-140 ° C to the semi-finished product. After applying at least one decorative layer, the mass with the decorative layer to form SchictitpreBstoff plate is pressed under a pressure of 100 to 15o kp / cm ² at 150-180 ° C and then cooled before the end of the pressing process.

If the pressing pressure is exerted with flat presses, the urea-formaldehyde content can be increased by up to 12% while it can be increased up to 15% if continuously operating presses are used. However, this would be uneconomical, on the one hand because of the then higher costs for producing the semi-finished product Required additives to the chip or fiber material and on the other hand because the structure in the second pressing process of the semi-finished product is destroyed because of the then higher pressure.

809825/0528

Claims (3)

Dipl.-fmj Heinz Lesser Dipl-Ing Otto Flügel. Patenlinw; Hle D-8 Munich 81. Cosimastraße PATENT CLAIMS Process for the production of a laminated molded panel, those made from thermosetting resin, lignocellulosic and / or cellulosic Particles, which are compressed under pressure and heat, and of at least one synthetic resin impregnated Decorative film, characterized in that the particles are mixed with a mixture of at least two thermosetting resins whose curing temperatures differ from one another and which react independently of one another, and that the particles are pressurized and heated to such an extent before the decorative layer (s) are applied that which can cure one or more resin components and that after the decorative film has been applied, a further increase in pressure and, if necessary, the temperature is also increased in order to then cure the other resin component . 2. The method according to claim 1, characterized in that the at higher temperature and at Resin component that may harden under higher pressure consists of a water-insoluble resin powder. 3. The method according to claim 1 or 2, characterized in that phenol novolak-hexamethylenetetramine is used as resin powder is used. 9825/0528