DE3334921C2 - Method of making an embossed multilayer board - Google Patents
Method of making an embossed multilayer boardInfo
- Publication number
- DE3334921C2 DE3334921C2 DE3334921A DE3334921A DE3334921C2 DE 3334921 C2 DE3334921 C2 DE 3334921C2 DE 3334921 A DE3334921 A DE 3334921A DE 3334921 A DE3334921 A DE 3334921A DE 3334921 C2 DE3334921 C2 DE 3334921C2
- Authority
- DE
- Germany
- Prior art keywords
- adhesive
- board
- laminate board
- laminate
- embossed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 238000004049 embossing Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 8
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000005995 Aluminium silicate Substances 0.000 claims 1
- 235000012211 aluminium silicate Nutrition 0.000 claims 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000123 paper Substances 0.000 abstract description 3
- 239000011093 chipboard Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000005187 foaming Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- -1 Caolin Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000001175 calcium sulphate Substances 0.000 description 1
- 235000011132 calcium sulphate Nutrition 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43C—FASTENINGS OR ATTACHMENTS OF FOOTWEAR; LACES IN GENERAL
- A43C1/00—Shoe lacing fastenings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
- B32B2317/125—Paper, e.g. cardboard impregnated with thermosetting resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/16—Wood, e.g. woodboard, fibreboard, woodchips
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zur Herstellung einer geprägten Mehrschichtplatte, bestehend aus einer Trägerplatte, insbesondere einer Spanplatte, und einer mindestens einseitigen Beschichtung aus einer Schichtstoffplatte, die aus mit ausgehärteten Harzen getränkten Papierbahnen besteht. Erfindungsgemäß ist dabei zur leichteren Prägung mit geringem Druck vorgesehen, daß auf die Trägerplatte eine Schicht von mindestens 80-200 g/m2 eines Klebers aufgetragen, die Schichtstoffplatte aufgelegt und der so geschaffene Verbund durch einen auf die Schichtstoffplatte einwirkenden Prägestempel unter Wärmezufuhr heißhärtend verpreßt wird.The invention relates to a method for producing an embossed multilayer board, consisting of a carrier board, in particular a chipboard, and an at least one-sided coating of a laminate board, which consists of paper webs impregnated with hardened resins. According to the invention, for easier embossing with low pressure, a layer of at least 80-200 g / m2 of an adhesive is applied to the carrier plate, the laminate board is placed and the bond created in this way is pressed in a hot-setting manner by an embossing stamp acting on the laminate board with the supply of heat.
Description
Die Erfindung betrifft ein Verfahren zum Herstellen einer geprägten Mehrschichtplatte mit einer innenliegenden starren Trägerplatte und einer mindestens einseitigen Beschichtung durch eine dekorative Schichtstoffplatte aus mit ausgehärteten Harzen getränkten Papierbahnen, bei dem für die Schichtstoffplatte solche Materialien verwendet werden, daß die Schichtstoffplatte im ausgehärteten Zustand prägbar ist, und die Trägerplatte und die ungeprägte Schichtstoffplatte unter Einsatz einer Klebstoff-Zwischenschicht zusammengebracht werden, sowie unter Anwendung von Druck und Wärme die Prägung unter Ausbildung von Aufwölbungen eingebracht und d;2 Schichtung dabei zu der Mehrschichtplatte verbunden wird.The invention relates to a method for producing an embossed multilayer board with an interior rigid carrier board and at least one-sided coating by a decorative laminate board made of paper webs impregnated with hardened resins, such as those for the laminate board Materials are used that the laminate sheet can be embossed in the cured state, and the Carrier plate and the unembossed laminate plate brought together using an adhesive intermediate layer as well as embossing with the formation of bulges with the application of pressure and heat introduced and d; 2 layering is thereby connected to the multilayer board.
Ein derartiges Verfahren ist aus der DF-QS 19 44 833 bekannt. Dabei werden in eine Form eine starre Trägerplatte und eine Schichtstoffplatte eingelegt und dazwischen ein aufschäumbarer Kleber eingebracht, der beim Aufschäumen die Schichtstoffplatte gegen eine strukturierte Matrize preßt und damit zu einer Prägung derselben führt. Mit einem derartigen Verfahren mittels Aufschäumen einer Klebstoffschicht lassen sich jedoch keine scharfkonturigen Prägungen herstellen. Außerdem ergeben sich Lufteinschlüsse, die zu Lunker- oder Einfallstellen an der dekorativen Oberflächenschicht führen. Darüber hinaus ist diese Herstellungverfahren sehr aufwendig, da teure Stahlformen und gesonderte Maschinen, in denen das Schäumen vorgenommen werden kann, erforderlich sind. Da außerdem der Druck, der beim Schäumen entsteht, verhältnismäßig hoch ist, müsse auch hohe Schließkräfte bei den Formen aufgewendet werden.Such a procedure is from DF-QS 19 44 833 known. A rigid carrier plate and a laminate plate are placed in a mold and in between a foamable adhesive is introduced which, when foaming, the laminate board against a structured one The die presses and thus leads to an embossing of the same. With such a method by means of foaming However, no sharp-contour embossings can be produced on an adhesive layer. aside from that air inclusions result, which lead to cavities or sink marks on the decorative surface layer. In addition, this manufacturing process is very complex, since expensive steel molds and separate machines, in which foaming can be done are required. In addition, since the pressure that when foaming is relatively high, high closing forces must also be applied to the molds will.
Ferner ist es aus der DE-OS 31 05 731 bekannt, bei der Herstellung einer geprägten Mehrschichtplatte zwischen die Trägerplatte und die dekorative Schichtstoffplatte eine Schicht aus einem elastisch verformbaren Material, insbesondere einem Schaumstoff, einzulegen, die anschließend verpreßt und geprägt werden. Bei der Verwendung von Schaumstoff für diese Zwischenschicht ist jedoch die Querzugfestigkeit der Verklebung nicht immer ausreichend. Dieses Problem nicht ausreichender Querzugfestigkeit tritt zum Beispiel dann auf, wenn die Platte erwärmt wird und infolge des dann von den Gasen herrührenden Drucks ein Ablösen auftritt. Man kann dieses Problem zwar dadurch bewältigen, daß man beim Aufpressen und Prägen der Schichtstoffplatte höhere Drücke anwendet, dies führt jedoch dazu, daß die Schaumstoffstruktur in der Oberfläche der Schichtstoffplatte sichtbar wird.It is also known from DE-OS 31 05 731, in the manufacture of an embossed multilayer board between the carrier plate and the decorative laminate sheet a layer of an elastically deformable Insert material, in particular a foam, which is then pressed and embossed. In the However, the use of foam for this intermediate layer is the transverse tensile strength of the bond not always sufficient. This problem of insufficient transverse tensile strength occurs, for example, when when the plate is heated and peeling occurs as a result of the pressure then resulting from the gases. This problem can be overcome by pressing and embossing the laminate board Applying higher pressures, however, tends to break the foam structure in the surface of the Laminate board becomes visible.
Demgegenüber liegt der Erfindung die Aufgabe zugrunde, ein Verfahren anzugeben, mit dem sich bei derartigen Mehrschichtplatten Prägungen hoher Qualität mit verhältnismäßig niedrigen Drücken und mit einfachen Formwerkzeugen herstellen lassen, ohne daß dabei Lunker- oder Einfallstellen auftreten oder die Struktur der verwendeten Zwischenschicht sichtbar wird.In contrast, the invention is based on the object of specifying a method with which such Multi-layer plates High quality embossing with relatively low pressures and with simple Let mold tools be produced without voids or sink marks occurring or the structure the intermediate layer used becomes visible.
Zur Lösung dieser Aufgabe ist erfindungsgemäß vorgesehen, daß der Klebstoff der Zwischenschicht einen Füllstoffanteil von bis zu 20% aufweist und in einer Menge von mindestens 200 g/m2 verwendet wird derart, daß die Aufwölbungen allein durch Verdrängung von Klebstoff gebildet werden.To solve this problem, the invention provides that the adhesive of the intermediate layer has a filler content of up to 20% and is used in an amount of at least 200 g / m 2 such that the bulges are formed solely by displacement of adhesive.
Bei der Verwendung einer entsprechend dicken Kleberschicht von etwa mindestens 0,5—1 mm wird dann nämlich bei einer Verprägung der Kleber unter den eingedrückten Bereichen der Schichtstoffplatte weggedrückt und dringt in die dazwischenliegenden Bereiche, die dadurch zusätzlich aufgewölbt werden, so daß damit auch eine Prägung relativ großer Tiefe erreicht werden kann.When using a correspondingly thick adhesive layer of about at least 0.5-1 mm namely, when embossed, the adhesive is pressed away from under the indented areas of the laminate board and penetrates into the areas in between, which are thereby additionally bulged, so that with it an embossing of a relatively great depth can also be achieved.
Zweckmäßigerweise erfolgt das Einbringen der Prägung bei einer Temperatur von 60— 14O0C, insbesondere 75—900C, und einem Druck von 0,1 —0,5 N/mm2.Conveniently, the insertion of the embossment is carried out at a temperature of 60- 14O 0 C, particularly 75-90 0 C and a pressure of 0.1 -0.5 N / mm 2.
Als Kleber können dabei zweckmäßigerweise thermoplastische Klebstoffe aushärtbarer Harze oder solche in Form einer Schmelzkleberfolie verwendet werden. Als Füllstoffe eignen sich besonders Leichtspat, Calziumcarbonat oder -sulfat, Caolin, Holzmehl oder Leichtmetallpulver oder aber eine Mischung aus zwei oder mehreren dieser Stoffe.Thermoplastic adhesives or hardenable resins can expediently be used as adhesives can be used in the form of a hot-melt adhesive film. Light spar are particularly suitable as fillers, Calcium carbonate or sulfate, Caolin, wood flour or light metal powder or a mixture of two or more of these substances.
Anhand einer schematischen Zeichnung sind Aufbau und Wirkungsweise eines Ausführungsbeispiels in Form pinpr nar*h rtam VArfohr^n «»»•"getollte« plojja «jjk^j* erläutert. Dabei zeigtA schematic drawing is used to explain the structure and mode of operation of an exemplary embodiment in the form of pinpr nar * h rtam VArfohr ^ n «» »•" tollte «plojja« jjk ^ j *
F i g. 1 einen Längsschnitt durch eine Mehrschichtplatte im unverpreßten Zustand;F i g. 1 shows a longitudinal section through a multilayer board in the unpressed state;
F i g. 2 einen Längsschnitt durch diese Platte im geprägten Zustand undF i g. 2 shows a longitudinal section through this plate in the embossed state and
F i g. 3 eine Aufsicht auf eine derartige geprägte Platte. F i g. 3 is a plan view of such an embossed plate.
Wie aus F i g. 1 zu ersehen ist wird zunächst auf eine '■ Trägerplatte 1, die beispielsweise aus einer Spanplatte bestehen kann, eine Kleberschicht 2 in gleichmäßiger Dicke auftragen. Die Dicke dieser Klebeschicht sollte dabei — abhängig von der Tiefe der gewünschten Prägungen und abhängig vom Verhältnis niedergepreßter Bereiche zu unverpreßten Bereichen — mindestens etwa 03— 1 mm betragen.As shown in FIG. 1 can be seen is first on a '■ carrier plate 1, which for example consists of a chipboard may exist, apply an adhesive layer 2 in a uniform thickness. The thickness of this adhesive layer should be at the same time - depending on the depth of the desired embossing and depending on the ratio of pressed down Areas to unpressed areas - at least about 03-1 mm.
Als Kleber eignen sich insbesondere thermoplastisehe Leime, wie z. B. Polyvinylacetatleim (PVAc) oder ( aushärtbare Harzleime, wie z. B. Harnstofformaldehyd, " Phenolformaldehyd, Resorcin oder Epoxidharze. fj Für einen möglichst dicken Auftrag ist es dabeiParticularly suitable adhesives are thermoplastic glues, such as. B. polyvinyl acetate glue (PVAc) or (curable resin glues such as urea formaldehyde, "Phenol formaldehyde, resorcinol or epoxy resins. fj It is included for the largest possible job
'A zweckmäßig, den Leim mit einem Füllstoff zu versehen, ν um eine dickere Konsistenz zu erreichen und um zu ■■:' verhindern, daß der Leim, der ja zunächst im flüssigen β oder pastenförmigen Zustand vorliegt zu stark von der C Trägerplatte aufgesogen wird. Als pulverförmige Leime . eignen sich dazu besonders Leichtspat Cahhimcarbo-'; ■ nat, Calziumsulfat Caolin, Holzmehl oder Getreidemehl 'A convenient to provide the glue with a filler ν in order to achieve a thicker consistency and to ■■' prevent the glue, which is present even initially in a liquid β or pasty state is excessively absorbed by the C carrier plate . As a powdery glue. are particularly suitable for light spar Cahhimcarbo- '; ■ Nat, calcium sulphate Caolin, wood flour or grain flour
5 sowie Leichtmetallpulver. Der Anteil dieser Füllstoffe 1' sollte dabei je nach gewünschter Prägetiefe, d. h. je nach %■ erforderlicher Auftragsdicke des Klebers, 5—20% beiy tragen.5 as well as light metal powder. The proportion of these fillers 1 'should be 5-20% depending on the desired embossing depth, ie depending on the % required application thickness of the adhesive.
:: :: Nachdem der Kleber 2 nun sorgfältig und gleichmä-After the adhesive 2 has now been carefully and evenly
: zweckmäßigerweise aus mit aushärtbaren Harzen in :. Form von ungesättigtem Polyester- und/oder Epoxid-ί harz getränkten Papierbahnen besteht und unter dem ■ ■ Markennamen TACON im Handel ist auf die Kleber- \J{ schicht aufgelegt Der so geschaffene Verbund wird : expediently made with curable resins in:. Form of unsaturated polyester and / or epoxy resin-soaked paper webs and under the ■ ■ brand name TACON is placed on the adhesive \ J { layer. The bond created in this way is fdann in einer Prägepresse unter Wärmezufuhr verpreßt und kurzzeitig ausgehärtet Für die Prägung und Ausn härtung ist dabei eine Temperatur im Bereich von I 60—140°C und ein Druck von 0,1—0,5 N/mm2 erforder- |ΐ lieh, wobei üblicherweise in einem Temperaturbereich 3 von 75—900C gearbeitet wird.fdann pressed in a stamping press with supply of heat and briefly cured for the embossing and curing of n is a temperature in the range of I 60-140 ° C and a pressure of 0.1-0.5 N / mm 2 required | ΐ lent , usually in a temperature range 3 of 75-90 0 C is used.
ig Nach dem Verpressen ergibt sich dann eine Mehr-ig After pressing, there is then an increase in
I schichtplatte, wie sie aus den F i g. 2 und 3 zu ersehen ist I Diese Platte ist nach dem vorliegenden Ausführungsbei- !ι: spiel mit einer karoförmigen Prägung versehen, die beija spielsweise durch einfaches Auflegen eines entspre- ;'; chenden Metallgitters bzw. eines gestanzten, geprägten |? oder geäzten Bleches erreicht werden kann. ψ I layered board, as shown in FIGS. 2 and 3 can be seen I This plate is provided according to the present embodiment! Ι: game with a diamond-shaped embossing, for example, by simply placing a corresponding; '; corresponding metal grille or a punched, embossed |? or etched sheet metal can be achieved. ψ Wie man insbesondere aus F i g. 3 deutlich ersieht istAs can be seen in particular from FIG. 3 is clearly seen
η im Bereich der Prägerillen 4 die Schichtstoffplatte 3 bis η in the area of the embossing grooves 4, the laminate plate 3 to
66th auf die Trägerplatte 1 durchgedrückt und hat dabei den ι) Kleber 2 unter die benachbarten, hochgewölbten Bereij|§ ehe 5 gedrückt. Dadurch werden die polsterähnlichenpressed through on the carrier plate 1 and has the ι) Adhesive 2 pressed under the neighboring, high-arched area before 5. This will make the upholstery p Aufwölbungen 5 noch stärker nach oben gedruckt als es [Ι der ursprünglichen Höhe der Kleberschicht 2 entsprach, f';· so daß hierdurch die Prägung sogar noch verstärkt wird. !β Die starke Aufwölbung außerhalb des Bereichs der jvi Prägerillen wird zusätzlich noch durch eine Värme- |i| Streckung der Schichtstoffplatte erreicht d. h. durch die |; Erwärmung der Schichtstoffplatte während der Prall gung tritt eine geringfügige Erweichung derselben auf, tßi so daß dadurch eine leichtere Aufwölbung möglich ist if Selbstverständlich ist auch jede andere Prägung in ί'Ί Form beliebiger Ornamente oder umlaufender ge-ω ?ch!oss?ner Ri!!?n möglich. Eine dsrsrtigc geprägte !»- Mehrschichtplatte eignet sich besonders für Möbelfronten oder Türen, um diesen ein entsprechendes dekoratives Aussehen zu verleihen.p bulges 5 printed upwards even more strongly than it corresponded to the original height of the adhesive layer 2, f '; · so that the embossing is thereby even reinforced. ! β The strong bulge outside the area of the jvi embossing grooves is additionally caused by a heat | i | Stretching of the laminate board achieved ie through the |; If the laminate board heats up during the impact, it softens slightly, so that a lighter bulge is possible. !? n possible. A dsrsrtigc embossed! »Multilayer board is particularly suitable for furniture fronts or doors to give them a corresponding decorative appearance.
6565
Claims (6)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3334921A DE3334921C2 (en) | 1983-09-27 | 1983-09-27 | Method of making an embossed multilayer board |
AT0253984A AT385232B (en) | 1983-09-27 | 1984-08-06 | METHOD FOR PRODUCING A MINTED MULTI-LAYER PANEL |
ES535699A ES8507383A1 (en) | 1983-09-27 | 1984-09-06 | Process for producing an embossed multi-layer material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3334921A DE3334921C2 (en) | 1983-09-27 | 1983-09-27 | Method of making an embossed multilayer board |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3334921A1 DE3334921A1 (en) | 1985-04-11 |
DE3334921C2 true DE3334921C2 (en) | 1986-10-23 |
Family
ID=6210181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3334921A Expired DE3334921C2 (en) | 1983-09-27 | 1983-09-27 | Method of making an embossed multilayer board |
Country Status (3)
Country | Link |
---|---|
AT (1) | AT385232B (en) |
DE (1) | DE3334921C2 (en) |
ES (1) | ES8507383A1 (en) |
Cited By (1)
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EP2361787A1 (en) | 2010-02-24 | 2011-08-31 | FunderMax GmbH | Method for coating the surface of a support plate, corresponding apparatus and product |
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Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1944833A1 (en) * | 1969-09-04 | 1971-03-11 | Duropal Werk Eberh Wrede Ohg | Furniture panel decorative facing |
DE3105731C2 (en) * | 1981-02-17 | 1986-11-06 | Metzeler Schaum Gmbh, 8940 Memmingen | Method of making an embossed multilayer board |
-
1983
- 1983-09-27 DE DE3334921A patent/DE3334921C2/en not_active Expired
-
1984
- 1984-08-06 AT AT0253984A patent/AT385232B/en not_active IP Right Cessation
- 1984-09-06 ES ES535699A patent/ES8507383A1/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2361787A1 (en) | 2010-02-24 | 2011-08-31 | FunderMax GmbH | Method for coating the surface of a support plate, corresponding apparatus and product |
Also Published As
Publication number | Publication date |
---|---|
ES535699A0 (en) | 1985-10-01 |
DE3334921A1 (en) | 1985-04-11 |
ES8507383A1 (en) | 1985-10-01 |
AT385232B (en) | 1988-03-10 |
ATA253984A (en) | 1987-08-15 |
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