DE3279431D1 - A process for joining a metallic coated connector pin to a multilayer ceramic substrate - Google Patents
A process for joining a metallic coated connector pin to a multilayer ceramic substrateInfo
- Publication number
- DE3279431D1 DE3279431D1 DE8282111806T DE3279431T DE3279431D1 DE 3279431 D1 DE3279431 D1 DE 3279431D1 DE 8282111806 T DE8282111806 T DE 8282111806T DE 3279431 T DE3279431 T DE 3279431T DE 3279431 D1 DE3279431 D1 DE 3279431D1
- Authority
- DE
- Germany
- Prior art keywords
- joining
- ceramic substrate
- multilayer ceramic
- connector pin
- metallic coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/336,246 US4824009A (en) | 1981-12-31 | 1981-12-31 | Process for braze attachment of electronic package members |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3279431D1 true DE3279431D1 (en) | 1989-03-09 |
Family
ID=23315212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282111806T Expired DE3279431D1 (en) | 1981-12-31 | 1982-12-20 | A process for joining a metallic coated connector pin to a multilayer ceramic substrate |
Country Status (4)
Country | Link |
---|---|
US (1) | US4824009A (de) |
EP (1) | EP0083436B1 (de) |
JP (1) | JPS58119663A (de) |
DE (1) | DE3279431D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184748A (ja) * | 1982-04-23 | 1983-10-28 | Tanaka Kikinzoku Kogyo Kk | 半導体用リ−ドピンのろう付方法 |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
JPS60198762A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ピン付基板およびその製造方法 |
JPS60198763A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ピン付基板およびその製造方法 |
JPS60198760A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ろう付け方法 |
JPS60198761A (ja) * | 1984-03-22 | 1985-10-08 | Nec Corp | ろう付け方法 |
US5038195A (en) * | 1990-02-09 | 1991-08-06 | Ibm | Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate |
US5121871A (en) * | 1990-04-20 | 1992-06-16 | The United States Of America As Represented By The United States Department Of Energy | Solder extrusion pressure bonding process and bonded products produced thereby |
US5520752A (en) * | 1994-06-20 | 1996-05-28 | The United States Of America As Represented By The Secretary Of The Army | Composite solders |
JP3444245B2 (ja) * | 1999-09-03 | 2003-09-08 | 日本電気株式会社 | 無電解ニッケル/金メッキへのはんだ付け方法、配線構造体、回路装置及びその製造方法 |
EP1243026A1 (de) * | 1999-12-21 | 2002-09-25 | Advanced Micro Devices, Inc. | Organische gehäuse mit lot zur zuverlässligen flip-chip-verbindung |
US6229207B1 (en) | 2000-01-13 | 2001-05-08 | Advanced Micro Devices, Inc. | Organic pin grid array flip chip carrier package |
US7172511B2 (en) * | 2005-01-03 | 2007-02-06 | Casey Thomas P | Amusement ride |
US8125081B2 (en) * | 2006-01-16 | 2012-02-28 | Nec Corporation | Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these |
US7631879B2 (en) * | 2006-06-21 | 2009-12-15 | General Electric Company | “L” butt gap seal between segments in seal assemblies |
US11583960B2 (en) * | 2019-09-25 | 2023-02-21 | Morgan Advanced Ceramics, Inc. | High temperature capable braze assembly |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3006069A (en) * | 1957-05-23 | 1961-10-31 | Rca Corp | Method of sealing a metal member to a ceramic member |
US3053699A (en) * | 1960-03-25 | 1962-09-11 | Western Electric Co | Dip coating process |
GB1027525A (de) * | 1962-03-02 | |||
US3199189A (en) * | 1962-03-29 | 1965-08-10 | Alloys Unltd Inc | Gold alloy cladding |
US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
US3496630A (en) * | 1966-04-25 | 1970-02-24 | Ltv Aerospace Corp | Method and means for joining parts |
JPS4814505B1 (de) * | 1969-04-09 | 1973-05-08 | ||
US3648357A (en) * | 1969-07-31 | 1972-03-14 | Gen Dynamics Corp | Method for sealing microelectronic device packages |
US3664868A (en) * | 1970-03-16 | 1972-05-23 | American Lava Corp | Gold metallizing of refractory metals on ceramic substrates |
JPS5288370A (en) * | 1976-01-20 | 1977-07-23 | Hitachi Ltd | Electronic watch |
JPS5353551A (en) * | 1976-10-26 | 1978-05-16 | Nippon Electric Co | Method of brazing ceramic |
JPS54153573A (en) * | 1978-05-25 | 1979-12-03 | Mitsubishi Electric Corp | Manufacture for compound semiconductor device |
US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
US4418857A (en) * | 1980-12-31 | 1983-12-06 | International Business Machines Corp. | High melting point process for Au:Sn:80:20 brazing alloy for chip carriers |
-
1981
- 1981-12-31 US US06/336,246 patent/US4824009A/en not_active Expired - Fee Related
-
1982
- 1982-10-19 JP JP57182217A patent/JPS58119663A/ja active Granted
- 1982-12-20 DE DE8282111806T patent/DE3279431D1/de not_active Expired
- 1982-12-20 EP EP82111806A patent/EP0083436B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US4824009A (en) | 1989-04-25 |
EP0083436A3 (en) | 1985-06-19 |
EP0083436B1 (de) | 1989-02-01 |
JPS641060B2 (de) | 1989-01-10 |
EP0083436A2 (de) | 1983-07-13 |
JPS58119663A (ja) | 1983-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |