JPS5353551A - Method of brazing ceramic - Google Patents
Method of brazing ceramicInfo
- Publication number
- JPS5353551A JPS5353551A JP12921676A JP12921676A JPS5353551A JP S5353551 A JPS5353551 A JP S5353551A JP 12921676 A JP12921676 A JP 12921676A JP 12921676 A JP12921676 A JP 12921676A JP S5353551 A JPS5353551 A JP S5353551A
- Authority
- JP
- Japan
- Prior art keywords
- brazing ceramic
- brazing
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12921676A JPS5353551A (en) | 1976-10-26 | 1976-10-26 | Method of brazing ceramic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12921676A JPS5353551A (en) | 1976-10-26 | 1976-10-26 | Method of brazing ceramic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5353551A true JPS5353551A (en) | 1978-05-16 |
Family
ID=15003997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12921676A Pending JPS5353551A (en) | 1976-10-26 | 1976-10-26 | Method of brazing ceramic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5353551A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4824009A (en) * | 1981-12-31 | 1989-04-25 | International Business Machines Corporation | Process for braze attachment of electronic package members |
US5080980A (en) * | 1989-09-04 | 1992-01-14 | Shinko Electric Industries Co., Ltd. | Ceramic package for semiconductor device |
-
1976
- 1976-10-26 JP JP12921676A patent/JPS5353551A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4824009A (en) * | 1981-12-31 | 1989-04-25 | International Business Machines Corporation | Process for braze attachment of electronic package members |
US5080980A (en) * | 1989-09-04 | 1992-01-14 | Shinko Electric Industries Co., Ltd. | Ceramic package for semiconductor device |
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