DE3278002D1 - Compression-type semiconductor device - Google Patents
Compression-type semiconductor deviceInfo
- Publication number
- DE3278002D1 DE3278002D1 DE8282103413T DE3278002T DE3278002D1 DE 3278002 D1 DE3278002 D1 DE 3278002D1 DE 8282103413 T DE8282103413 T DE 8282103413T DE 3278002 T DE3278002 T DE 3278002T DE 3278002 D1 DE3278002 D1 DE 3278002D1
- Authority
- DE
- Germany
- Prior art keywords
- compression
- semiconductor device
- type semiconductor
- type
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6595681A JPS57181131A (en) | 1981-04-30 | 1981-04-30 | Pressure-contact type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3278002D1 true DE3278002D1 (en) | 1988-02-18 |
Family
ID=13301938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282103413T Expired DE3278002D1 (en) | 1981-04-30 | 1982-04-22 | Compression-type semiconductor device |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0064231B1 (de) |
JP (1) | JPS57181131A (de) |
DE (1) | DE3278002D1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59134876A (ja) * | 1983-01-20 | 1984-08-02 | Mitsubishi Electric Corp | 半導体装置 |
DE3335836A1 (de) * | 1983-10-01 | 1985-04-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Kontaktelektrode fuer leistungshalbleiterbauelement |
EP0220469B1 (de) * | 1985-10-15 | 1989-12-06 | Siemens Aktiengesellschaft | Leistungsthyristor |
DE3616233A1 (de) * | 1986-05-14 | 1987-11-19 | Semikron Elektronik Gmbh | Halbleiterbauelement |
DE3616185A1 (de) * | 1986-05-14 | 1987-11-19 | Semikron Elektronik Gmbh | Halbleiterbauelement |
JP2594278B2 (ja) * | 1986-07-30 | 1997-03-26 | ビービーシー ブラウン ボヴェリ アクチェンゲゼルシャフト | 加圧接続型gtoサイリスタ |
CH670334A5 (de) * | 1986-09-16 | 1989-05-31 | Bbc Brown Boveri & Cie | |
EP0262485A1 (de) * | 1986-10-01 | 1988-04-06 | BBC Brown Boveri AG | Halbleiterbauelement mit einer Ätzgrube |
DE3635708A1 (de) * | 1986-10-21 | 1988-04-28 | Bbc Brown Boveri & Cie | Verfahren und anordnung zur kontaktierung einer elektrode mit mehreren emitter-/kathoden-bereichen eines halbleiterbauelementes |
JPH081914B2 (ja) * | 1987-03-31 | 1996-01-10 | 株式会社東芝 | 圧接型半導体装置 |
EP0325774B1 (de) * | 1988-01-27 | 1992-03-18 | Asea Brown Boveri Ag | Abschaltbares Leistungshalbleiterbauelement |
JP2654852B2 (ja) * | 1990-06-27 | 1997-09-17 | 東洋電機製造株式会社 | 圧接形パツケージ構造に適合した静電誘導形半導体素子 |
DE59107655D1 (de) * | 1991-02-22 | 1996-05-09 | Asea Brown Boveri | Abschaltbares Hochleistungs-Halbleiterbauelement |
US5473193A (en) * | 1994-01-06 | 1995-12-05 | Harris Corporation | Package for parallel subelement semiconductor devices |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2103146A1 (de) * | 1970-01-26 | 1971-08-05 | Westinghouse Electric Corp | Mittels einer Gate Elektrode Steuer bares Schaltelement |
DE2757821C3 (de) * | 1976-12-28 | 1982-08-19 | Tokyo Shibaura Electric Co., Ltd., Kawasaki, Kanagawa | Verfahren zur Herstellung einer Mesa-Halbleiteranordnung mit Druckkontakt |
US4161740A (en) * | 1977-11-07 | 1979-07-17 | Microwave Semiconductor Corp. | High frequency power transistor having reduced interconnection inductance and thermal resistance |
JPS55121654A (en) * | 1979-03-13 | 1980-09-18 | Toshiba Corp | Compression bonded semiconductor device |
-
1981
- 1981-04-30 JP JP6595681A patent/JPS57181131A/ja active Pending
-
1982
- 1982-04-22 DE DE8282103413T patent/DE3278002D1/de not_active Expired
- 1982-04-22 EP EP19820103413 patent/EP0064231B1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0064231A2 (de) | 1982-11-10 |
EP0064231A3 (en) | 1984-12-19 |
JPS57181131A (en) | 1982-11-08 |
EP0064231B1 (de) | 1988-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |