DE3218953A1 - Verfahren und vorrichtung zur ausbildung einer schraegrille in einer halbleitervorrichtung - Google Patents

Verfahren und vorrichtung zur ausbildung einer schraegrille in einer halbleitervorrichtung

Info

Publication number
DE3218953A1
DE3218953A1 DE3218953A DE3218953A DE3218953A1 DE 3218953 A1 DE3218953 A1 DE 3218953A1 DE 3218953 A DE3218953 A DE 3218953A DE 3218953 A DE3218953 A DE 3218953A DE 3218953 A1 DE3218953 A1 DE 3218953A1
Authority
DE
Germany
Prior art keywords
angle
forming
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3218953A
Other languages
English (en)
Other versions
DE3218953C2 (de
Inventor
Shigeru Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7589381A external-priority patent/JPS57189762A/ja
Priority claimed from JP713882A external-priority patent/JPS6016098B2/ja
Priority claimed from JP888382A external-priority patent/JPS58126056A/ja
Priority claimed from JP888282A external-priority patent/JPS58126055A/ja
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of DE3218953A1 publication Critical patent/DE3218953A1/de
Application granted granted Critical
Publication of DE3218953C2 publication Critical patent/DE3218953C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/303752—Process
    • Y10T409/303808—Process including infeeding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T409/00—Gear cutting, milling, or planing
    • Y10T409/30—Milling
    • Y10T409/304536—Milling including means to infeed work to cutter
    • Y10T409/305544—Milling including means to infeed work to cutter with work holder
    • Y10T409/305656—Milling including means to infeed work to cutter with work holder including means to support work for rotation during operation
    • Y10T409/305712—Milling including means to infeed work to cutter with work holder including means to support work for rotation during operation and including means to infeed cutter toward work axis
DE3218953A 1981-05-20 1982-05-19 Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung Expired DE3218953C2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP7589381A JPS57189762A (en) 1981-05-20 1981-05-20 Inclined groove forming method
JP713882A JPS6016098B2 (ja) 1982-01-20 1982-01-20 半導体の溝加工用砥石
JP888382A JPS58126056A (ja) 1982-01-25 1982-01-25 斜め溝加工方法
JP888282A JPS58126055A (ja) 1982-01-25 1982-01-25 斜め溝加工方法

Publications (2)

Publication Number Publication Date
DE3218953A1 true DE3218953A1 (de) 1983-01-05
DE3218953C2 DE3218953C2 (de) 1986-05-15

Family

ID=27454647

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3218953A Expired DE3218953C2 (de) 1981-05-20 1982-05-19 Verfahren und Vorrichtung zur Ausbildung einer Schrägrille in einer Halbleitervorrichtung

Country Status (3)

Country Link
US (1) US4517769A (de)
DE (1) DE3218953C2 (de)
GB (1) GB2098893B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4822757A (en) * 1987-11-10 1989-04-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
GB8728879D0 (en) * 1987-12-10 1988-01-27 Westinghouse Brake & Signal Shaping silicon semiconductor wafers
US5616071A (en) * 1994-05-06 1997-04-01 Herrmann; Heinz Bevel grinder
JP4472316B2 (ja) * 2003-11-28 2010-06-02 日東電工株式会社 粘着テープ切断方法及び粘着テープ切断装置
US20070298687A1 (en) * 2006-06-22 2007-12-27 3M Innovative Properties Company Apparatus and method for modifying an edge
JP2011108746A (ja) * 2009-11-13 2011-06-02 Disco Abrasive Syst Ltd ウエーハの加工方法
WO2011132252A1 (ja) * 2010-04-19 2011-10-27 ヤマザキマザック株式会社 切削加工方法及び切削加工装置
JP6667100B2 (ja) * 2015-12-14 2020-03-18 株式会社ジェイテクト ツルア、これを備えたツルーイング装置、研削装置及びツルーイング方法
RU2710258C1 (ru) * 2019-05-29 2019-12-25 Федеральное государственное бюджетное учреждение науки Институт машиноведения им. А.А. Благонравова Российской академии наук (ИМАШ РАН) Устройство для шлифования пазов дисков газотурбинных двигателей

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH298992A (de) * 1950-08-17 1954-05-31 Josef Hjelmblad Karl Wilhelm Verfahren zum Schleifen von spiralförmigen Nuten.
GB1237414A (en) * 1968-04-11 1971-06-30 Tokyo Shibaura Electric Co A semiconductor device and a method of manufacturing the same
GB1491705A (en) * 1974-12-20 1977-11-16 Texas Instruments Ltd Semiconductor junctions

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1665954A (en) * 1923-08-08 1928-04-10 Fox Tom Harrow-disk sharpener
US2203788A (en) * 1937-04-01 1940-06-11 Clayton L Jenks Knife sharpening device
US2197309A (en) * 1938-09-07 1940-04-16 Hyland A Lackey Valve reseater
US2813379A (en) * 1956-05-17 1957-11-19 Norton Co Grinding machine
US2810238A (en) * 1956-12-04 1957-10-22 Goodrich Co B F Tire sidewall finishing apparatus
US3172243A (en) * 1962-12-13 1965-03-09 Cooper Tire & Rubber Co Method for grinding white sidewall tires
US3137976A (en) * 1962-12-21 1964-06-23 Goodrich Co B F Tire sidewall grinder and cleaner machine
US3698138A (en) * 1969-08-13 1972-10-17 Toyoda Machine Works Ltd Grinding machine with adaptive control system
US3691707A (en) * 1969-11-12 1972-09-19 Sola Basic Ind Semiconductor material cutting apparatus and method of making the same
US3839942A (en) * 1972-01-07 1974-10-08 Gen Motors Corp Method for simultaneously milling grooves in opposite sides of a workpiece
US4029531A (en) * 1976-03-29 1977-06-14 Rca Corporation Method of forming grooves in the [011] crystalline direction

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH298992A (de) * 1950-08-17 1954-05-31 Josef Hjelmblad Karl Wilhelm Verfahren zum Schleifen von spiralförmigen Nuten.
GB1237414A (en) * 1968-04-11 1971-06-30 Tokyo Shibaura Electric Co A semiconductor device and a method of manufacturing the same
GB1491705A (en) * 1974-12-20 1977-11-16 Texas Instruments Ltd Semiconductor junctions

Also Published As

Publication number Publication date
US4517769A (en) 1985-05-21
DE3218953C2 (de) 1986-05-15
GB2098893B (en) 1984-10-24
GB2098893A (en) 1982-12-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee