DE3170941D1 - Semiconductor device with a heat dissipating substrate - Google Patents

Semiconductor device with a heat dissipating substrate

Info

Publication number
DE3170941D1
DE3170941D1 DE8181107622T DE3170941T DE3170941D1 DE 3170941 D1 DE3170941 D1 DE 3170941D1 DE 8181107622 T DE8181107622 T DE 8181107622T DE 3170941 T DE3170941 T DE 3170941T DE 3170941 D1 DE3170941 D1 DE 3170941D1
Authority
DE
Germany
Prior art keywords
semiconductor device
heat dissipating
dissipating substrate
substrate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181107622T
Other languages
German (de)
English (en)
Inventor
Akio Chiba
Seiki Shimizu
Keiichi Kuniya
Zin Onuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3170941D1 publication Critical patent/DE3170941D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W70/6875—
    • H10W40/228—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—
DE8181107622T 1980-09-24 1981-09-24 Semiconductor device with a heat dissipating substrate Expired DE3170941D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980134737U JPS5759453U (enExample) 1980-09-24 1980-09-24

Publications (1)

Publication Number Publication Date
DE3170941D1 true DE3170941D1 (en) 1985-07-18

Family

ID=15135405

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181107622T Expired DE3170941D1 (en) 1980-09-24 1981-09-24 Semiconductor device with a heat dissipating substrate

Country Status (3)

Country Link
EP (1) EP0049791B1 (enExample)
JP (1) JPS5759453U (enExample)
DE (1) DE3170941D1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62125713U (enExample) * 1986-01-30 1987-08-10
JP3232618B2 (ja) * 1992-02-05 2001-11-26 株式会社日立製作所 Ｌｓｉ冷却装置
US6542371B1 (en) * 2000-11-02 2003-04-01 Intel Corporation High thermal conductivity heat transfer pad
EP1403923A1 (en) 2002-09-27 2004-03-31 Abb Research Ltd. Press pack power semiconductor module
DE102005046710B4 (de) * 2005-09-29 2012-12-06 Infineon Technologies Ag Verfahren zur Herstellung einer Bauelementanordnung mit einem Träger und einem darauf montierten Halbleiterchip
US8237259B2 (en) 2007-06-13 2012-08-07 Infineon Technologies Ag Embedded chip package
DE102007031490B4 (de) 2007-07-06 2017-11-16 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleitermoduls
CN116758819A (zh) * 2023-05-31 2023-09-15 上海天马微电子有限公司 支撑板及显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2218169A1 (de) * 1972-04-14 1973-10-18 Siemens Ag Kuehlvorrichtung fuer elektronische bauelemente
JPS5253720A (en) * 1975-10-29 1977-04-30 Hitachi Ltd Non-orientated cu-carbon fiber compoite and its manufacturing method
JPS603776B2 (ja) * 1977-06-03 1985-01-30 株式会社日立製作所 半導体素子
JPS5550646A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Integrated circuit device

Also Published As

Publication number Publication date
JPS5759453U (enExample) 1982-04-08
EP0049791A2 (en) 1982-04-21
EP0049791A3 (en) 1982-11-10
EP0049791B1 (en) 1985-06-12

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Free format text: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING. SCHUEBEL-HOPF, U., DIPL.-CHEM. DR.RER.NAT. GROENING, H., DIPL.-ING., PAT.-ANWAELTE, 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee