JPS5759453U - - Google Patents
Info
- Publication number
- JPS5759453U JPS5759453U JP1980134737U JP13473780U JPS5759453U JP S5759453 U JPS5759453 U JP S5759453U JP 1980134737 U JP1980134737 U JP 1980134737U JP 13473780 U JP13473780 U JP 13473780U JP S5759453 U JPS5759453 U JP S5759453U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980134737U JPS5759453U (enExample) | 1980-09-24 | 1980-09-24 | |
| EP81107622A EP0049791B1 (en) | 1980-09-24 | 1981-09-24 | Semiconductor device with a heat dissipating substrate |
| DE8181107622T DE3170941D1 (en) | 1980-09-24 | 1981-09-24 | Semiconductor device with a heat dissipating substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980134737U JPS5759453U (enExample) | 1980-09-24 | 1980-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5759453U true JPS5759453U (enExample) | 1982-04-08 |
Family
ID=15135405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980134737U Pending JPS5759453U (enExample) | 1980-09-24 | 1980-09-24 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0049791B1 (enExample) |
| JP (1) | JPS5759453U (enExample) |
| DE (1) | DE3170941D1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62125713U (enExample) * | 1986-01-30 | 1987-08-10 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3232618B2 (ja) * | 1992-02-05 | 2001-11-26 | 株式会社日立製作所 | Ｌｓｉ冷却装置 |
| US6542371B1 (en) * | 2000-11-02 | 2003-04-01 | Intel Corporation | High thermal conductivity heat transfer pad |
| EP1403923A1 (en) | 2002-09-27 | 2004-03-31 | Abb Research Ltd. | Press pack power semiconductor module |
| DE102005046710B4 (de) * | 2005-09-29 | 2012-12-06 | Infineon Technologies Ag | Verfahren zur Herstellung einer Bauelementanordnung mit einem Träger und einem darauf montierten Halbleiterchip |
| US8237259B2 (en) | 2007-06-13 | 2012-08-07 | Infineon Technologies Ag | Embedded chip package |
| DE102007031490B4 (de) | 2007-07-06 | 2017-11-16 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleitermoduls |
| CN116758819A (zh) * | 2023-05-31 | 2023-09-15 | 上海天马微电子有限公司 | 支撑板及显示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2218169A1 (de) * | 1972-04-14 | 1973-10-18 | Siemens Ag | Kuehlvorrichtung fuer elektronische bauelemente |
| JPS5253720A (en) * | 1975-10-29 | 1977-04-30 | Hitachi Ltd | Non-orientated cu-carbon fiber compoite and its manufacturing method |
| JPS603776B2 (ja) * | 1977-06-03 | 1985-01-30 | 株式会社日立製作所 | 半導体素子 |
| JPS5550646A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Integrated circuit device |
-
1980
- 1980-09-24 JP JP1980134737U patent/JPS5759453U/ja active Pending
-
1981
- 1981-09-24 EP EP81107622A patent/EP0049791B1/en not_active Expired
- 1981-09-24 DE DE8181107622T patent/DE3170941D1/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62125713U (enExample) * | 1986-01-30 | 1987-08-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0049791B1 (en) | 1985-06-12 |
| EP0049791A2 (en) | 1982-04-21 |
| EP0049791A3 (en) | 1982-11-10 |
| DE3170941D1 (en) | 1985-07-18 |