DE3100634C2 - Vorrichtung zum Galvanisieren eines Bandes aus elektrisch leitendem Material - Google Patents
Vorrichtung zum Galvanisieren eines Bandes aus elektrisch leitendem MaterialInfo
- Publication number
- DE3100634C2 DE3100634C2 DE3100634A DE3100634A DE3100634C2 DE 3100634 C2 DE3100634 C2 DE 3100634C2 DE 3100634 A DE3100634 A DE 3100634A DE 3100634 A DE3100634 A DE 3100634A DE 3100634 C2 DE3100634 C2 DE 3100634C2
- Authority
- DE
- Germany
- Prior art keywords
- cathode
- electrode gap
- anode
- block
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 7
- 238000009713 electroplating Methods 0.000 title claims description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 32
- 238000009827 uniform distribution Methods 0.000 claims 1
- 239000011888 foil Substances 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 230000002028 premature Effects 0.000 abstract description 3
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003251 chemically resistant material Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55002242A JPS5841358B2 (ja) | 1980-01-12 | 1980-01-12 | メツキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3100634A1 DE3100634A1 (de) | 1982-02-04 |
| DE3100634C2 true DE3100634C2 (de) | 1984-11-22 |
Family
ID=11523880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3100634A Expired DE3100634C2 (de) | 1980-01-12 | 1981-01-12 | Vorrichtung zum Galvanisieren eines Bandes aus elektrisch leitendem Material |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4323441A (enExample) |
| JP (1) | JPS5841358B2 (enExample) |
| DE (1) | DE3100634C2 (enExample) |
| FR (1) | FR2473559A1 (enExample) |
| GB (1) | GB2067223B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58107498A (ja) * | 1981-12-18 | 1983-06-27 | Fuji Photo Film Co Ltd | 帯状金属板の電解処理方法および装置 |
| JPS59211597A (ja) * | 1983-05-14 | 1984-11-30 | Kawasaki Steel Corp | 合金めつき鋼板の製造方法および装置 |
| JPS63140100A (ja) * | 1986-12-02 | 1988-06-11 | Kawasaki Steel Corp | 電解処理槽 |
| JPH01502204A (ja) * | 1987-02-13 | 1989-08-03 | サントル・ド・ルシェルシュ・メタリュルジュク | 電着による極薄金属薄板の連続製造設備 |
| US4915796A (en) * | 1988-10-14 | 1990-04-10 | Charles Denofrio | Electroplating process |
| US4871435A (en) * | 1988-10-14 | 1989-10-03 | Charles Denofrio | Electroplating apparatus |
| US5344538A (en) * | 1993-01-11 | 1994-09-06 | Gould Inc. | Thin plate anode |
| FR2725215B1 (fr) * | 1994-09-29 | 1996-11-22 | Lorraine Laminage | Cellule d'electrodeposition en continu d'alliages metalliques |
| US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
| US20040200061A1 (en) * | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
| US20060037865A1 (en) * | 2004-08-19 | 2006-02-23 | Rucker Michael H | Methods and apparatus for fabricating gas turbine engines |
| US20090078579A1 (en) * | 2007-09-20 | 2009-03-26 | Weibezahn Karl S | Systems And Methods For Electroplating Embossed Features On Substrates |
| CN103649379A (zh) | 2011-07-07 | 2014-03-19 | 贝卡尔特公司 | 电解槽中的分布板 |
| DE102020107907B4 (de) * | 2020-03-23 | 2023-10-26 | Jacob Zimmermann | Vorrichtung zur elektrochemischen Herstellung dünner Folien und Verfahren zur elektrochemischen Herstellung dünner Folien |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2244423A (en) * | 1938-06-28 | 1941-06-03 | Hanson Van Winkle Munning Co | Apparatus for strip plating |
| US4030999A (en) * | 1975-10-06 | 1977-06-21 | National Semiconductor Corporation | Stripe on strip plating apparatus |
| JPS5524141Y2 (enExample) * | 1976-10-16 | 1980-06-09 |
-
1980
- 1980-01-12 JP JP55002242A patent/JPS5841358B2/ja not_active Expired
-
1981
- 1981-01-07 US US06/223,208 patent/US4323441A/en not_active Expired - Lifetime
- 1981-01-09 FR FR8100327A patent/FR2473559A1/fr active Granted
- 1981-01-12 DE DE3100634A patent/DE3100634C2/de not_active Expired
- 1981-01-12 GB GB8100769A patent/GB2067223B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3100634A1 (de) | 1982-02-04 |
| JPS56102597A (en) | 1981-08-17 |
| JPS5841358B2 (ja) | 1983-09-12 |
| GB2067223B (en) | 1983-06-02 |
| FR2473559A1 (fr) | 1981-07-17 |
| GB2067223A (en) | 1981-07-22 |
| US4323441A (en) | 1982-04-06 |
| FR2473559B1 (enExample) | 1983-02-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: ZUMSTEIN SEN., F., DR. ASSMANN, E., DIPL.-CHEM. DR |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |