DE3061079D1 - Opto-electronic connexion device - Google Patents

Opto-electronic connexion device

Info

Publication number
DE3061079D1
DE3061079D1 DE8080400059T DE3061079T DE3061079D1 DE 3061079 D1 DE3061079 D1 DE 3061079D1 DE 8080400059 T DE8080400059 T DE 8080400059T DE 3061079 T DE3061079 T DE 3061079T DE 3061079 D1 DE3061079 D1 DE 3061079D1
Authority
DE
Germany
Prior art keywords
opto
electronic
connexion
connexion device
electronic connexion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080400059T
Other languages
English (en)
Inventor
Raymond Henry
Jacques Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3061079D1 publication Critical patent/DE3061079D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE8080400059T 1979-02-08 1980-01-15 Opto-electronic connexion device Expired DE3061079D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7903226A FR2448727A1 (fr) 1979-02-08 1979-02-08 Tete de couplage opto-electronique

Publications (1)

Publication Number Publication Date
DE3061079D1 true DE3061079D1 (de) 1982-12-23

Family

ID=9221744

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080400059T Expired DE3061079D1 (de) 1979-02-08 1980-01-15 Opto-electronic connexion device

Country Status (5)

Country Link
US (1) US4291942A (de)
EP (1) EP0014607B1 (de)
JP (1) JPS55106412A (de)
DE (1) DE3061079D1 (de)
FR (1) FR2448727A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57138608A (en) * 1981-02-20 1982-08-27 Hitachi Ltd Photoelectric transducer with optical fiber
GB2127990B (en) * 1982-09-29 1986-05-14 Gen Electric Co Plc Coupling optical fibre and opto-electronic device
DE3568087D1 (en) * 1984-02-22 1989-03-09 Siemens Ag Optoelectronic housing module
DE3433717A1 (de) * 1984-09-14 1986-03-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens
JP2527662Y2 (ja) * 1990-03-05 1997-03-05 三菱自動車工業株式会社 クランクプーリ
US5434940A (en) * 1994-03-24 1995-07-18 The Whitaker Corporation Active fiber needle
FR2758888B1 (fr) * 1997-01-27 1999-04-23 Thomson Csf Procede de modelisation fine du fouillis de sol recu par un radar
US6964529B2 (en) * 2003-07-16 2005-11-15 Hui-Chueh Chien Orientation-adjustable optical transceiver module
US9500808B2 (en) * 2012-05-09 2016-11-22 The Boeing Company Ruggedized photonic crystal sensor packaging
US10754101B1 (en) * 2019-11-01 2020-08-25 The Boeing Company Fabrication of universal hermetic optical fiber connector

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423594A (en) * 1964-03-03 1969-01-21 Anthony G Galopin Photoelectric semiconductor device with optical fiber means coupling input signals to base
GB1438016A (en) * 1973-09-06 1976-06-03 Plessey Co Ltd Mounting of an optical filament in axial alignment with a second optical element
US3859536A (en) * 1974-01-07 1975-01-07 Corning Glass Works Optical communication system source-detector pair
JPS50153654A (de) * 1974-05-30 1975-12-10
CA1065140A (en) * 1975-06-05 1979-10-30 Thomas R. Kyle Method for sealing optical fibers to device encapsulations
US4118100A (en) * 1975-12-10 1978-10-03 International Telephone And Telegraph Corporation Optical couplers for light emitting diodes and detectors
FR2387517A1 (fr) * 1977-04-13 1978-11-10 Thomson Csf Systeme d'encapsulation etanche d'un dispositif optoelectronique emetteur ou recepteur a transmission par fibre optique
DE2724850A1 (de) * 1977-06-02 1978-12-07 Bosch Gmbh Robert Elektrooptische anordnung
US4173389A (en) * 1977-09-28 1979-11-06 Bell Telephone Laboratories, Incorporated Molded optical fiber connector

Also Published As

Publication number Publication date
FR2448727B1 (de) 1981-11-27
FR2448727A1 (fr) 1980-09-05
JPS55106412A (en) 1980-08-15
US4291942A (en) 1981-09-29
EP0014607B1 (de) 1982-11-17
EP0014607A1 (de) 1980-08-20

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee