DE3009163C2 - - Google Patents
Info
- Publication number
- DE3009163C2 DE3009163C2 DE3009163A DE3009163A DE3009163C2 DE 3009163 C2 DE3009163 C2 DE 3009163C2 DE 3009163 A DE3009163 A DE 3009163A DE 3009163 A DE3009163 A DE 3009163A DE 3009163 C2 DE3009163 C2 DE 3009163C2
- Authority
- DE
- Germany
- Prior art keywords
- face
- support
- semiconductor
- pressure
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19803009163 DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
| JP3446181A JPS56142431A (en) | 1980-03-10 | 1981-03-10 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19803009163 DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3009163A1 DE3009163A1 (de) | 1981-09-24 |
| DE3009163C2 true DE3009163C2 (https=) | 1989-03-09 |
Family
ID=6096770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19803009163 Granted DE3009163A1 (de) | 1980-03-10 | 1980-03-10 | Messwertaufnehmer fuer druck |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS56142431A (https=) |
| DE (1) | DE3009163A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889873A (ja) * | 1981-11-24 | 1983-05-28 | Nippon Denso Co Ltd | 半導体圧力変換器 |
| DE3376760D1 (en) * | 1983-11-10 | 1988-06-30 | Kristal Instr Ag | Transducer element, method for its manufacture and its use in a pressure pick-up device |
| DE4207848A1 (de) * | 1992-03-12 | 1993-09-16 | Jenoptik Jena Gmbh | Einrichtung zur kraft- und druckmessung in mindestens einer komponente |
| JP4685662B2 (ja) * | 2005-03-03 | 2011-05-18 | エア・ウォーター株式会社 | ガス分離方法およびそれに用いる装置 |
| EP2184576B1 (en) | 2007-08-27 | 2019-05-15 | Hitachi, Ltd. | Semiconductor strain sensor |
| JP2009053005A (ja) * | 2007-08-27 | 2009-03-12 | Hitachi Metals Ltd | 半導体歪センサーおよび半導体歪センサーの取付け方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5112437B2 (https=) * | 1971-10-01 | 1976-04-19 | ||
| DE2617731C3 (de) * | 1976-04-23 | 1979-06-07 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Miniaturdruckmeßwandler |
-
1980
- 1980-03-10 DE DE19803009163 patent/DE3009163A1/de active Granted
-
1981
- 1981-03-10 JP JP3446181A patent/JPS56142431A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3009163A1 (de) | 1981-09-24 |
| JPS56142431A (en) | 1981-11-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8320 | Willingness to grant licences declared (paragraph 23) | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |