DE29908585U1 - Device for machining workpieces made of diamond-containing materials - Google Patents

Device for machining workpieces made of diamond-containing materials

Info

Publication number
DE29908585U1
DE29908585U1 DE29908585U DE29908585U DE29908585U1 DE 29908585 U1 DE29908585 U1 DE 29908585U1 DE 29908585 U DE29908585 U DE 29908585U DE 29908585 U DE29908585 U DE 29908585U DE 29908585 U1 DE29908585 U1 DE 29908585U1
Authority
DE
Germany
Prior art keywords
laser
unit
optical axis
laser beam
focusing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29908585U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LASERPLUSS AG
Original Assignee
LASERPLUSS AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LASERPLUSS AG filed Critical LASERPLUSS AG
Priority to DE29908585U priority Critical patent/DE29908585U1/en
Publication of DE29908585U1 publication Critical patent/DE29908585U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (7)

1. Vorrichtung zur Bearbeitung von Werkstücken aus diamanthaltigen Werkstoffen, mit
einem Laser (14) zur Erzeugung eines gepulsten Laserstrahls L,
einer Halterung (17) für das Werkstück,
einer Antriebseinheit (15) zum Verfahren des Lasers und/oder der Werkstückhalterung in Richtung und quer zur optischen Achse (16) des Lasers,
einer Fokussiereinheit (21) zum Fokussieren des Laserstrahls und
einer Steuereinheit (S) zum Ansteuern der Antriebseinheit (15), die derart zum Verfahren des Lasers und/oder der Werkstückhalterung in Richtung und quer zur optischen Achse (16) des Lasers ausge­ bildet ist, daß der Laserstrahl zum Abtragen einzelner Werkstoff­ schichten in mehreren nebeneinander verlaufenden und/oder ein­ ander überlappenden Linien unter Bildung einer Schnittfuge über die gesamte Breite der abzutragenden Fläche geführt wird, dadurch gekennzeichnet,
daß die Steuereinheit (S) zum Ansteuern der Antriebseinheit (15) ferner derart zum Verfahren des Lasers und/oder der Werkstück­ halterung in Richtung und quer zur optischen Achse (16) des La­ sers ausgebildet ist, daß mit zunehmender Abtragtiefe die Breite der Fläche, über die der Laserstrahl geführt wird, verringert wird. 1. Device for machining workpieces made of diamond-containing materials, with
a laser ( 14 ) for generating a pulsed laser beam L,
a holder ( 17 ) for the workpiece,
a drive unit ( 15 ) for moving the laser and / or the workpiece holder in the direction and transverse to the optical axis ( 16 ) of the laser,
a focusing unit ( 21 ) for focusing the laser beam and
a control unit (S) for controlling the drive unit ( 15 ), which is so out for moving the laser and / or the workpiece holder in the direction and transverse to the optical axis ( 16 ) of the laser that the laser beam for removing individual material layers in several running alongside one another and / or another overlapping lines to form a kerf over the entire width of the surface to be removed, characterized in that
that the control unit (S) for controlling the drive unit ( 15 ) is further designed in such a way for moving the laser and / or the workpiece holder in the direction and transversely to the optical axis ( 16 ) of the laser that with increasing depth of cut the width of the surface, over which the laser beam is guided is reduced. 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß eine erste Ablenkeinheit (19) zum Ablenken des Laserstrahls auf der optischen Achse des Lasers angeordnet ist und daß eine zweite Ablenkeinheit zum Ablenken des Laserstrahls neben der optischen Achse des Laserstrahls angeordnet ist, wobei die erste und zweite Ablenkeinheit (19, 20) und die Fokussiereinheit (21) derart ausge­ bildet sind, daß der Laserstrahl aus der optischen Achse des La­ sers abgelenkt und der abgelenkte Laserstrahl auf einen Punkt (B) fokussiert wird, der auf der optischen Achse des Lasers liegt.2. Device according to claim 1, characterized in that a first deflection unit ( 19 ) for deflecting the laser beam is arranged on the optical axis of the laser and that a second deflection unit for deflecting the laser beam is arranged next to the optical axis of the laser beam, the first and second deflection unit ( 19 , 20 ) and the focusing unit ( 21 ) are formed such that the laser beam is deflected from the optical axis of the laser and the deflected laser beam is focused on a point (B) which is on the optical axis of the laser lies. 3. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß die erste und zweite Ablenkeinheit (19, 20) und die Fokussiereinheit (21) um die optische Achse 16 des Lasers L drehbar angeordnet sind.3. Apparatus according to claim 2, characterized in that the first and second deflection unit ( 19 , 20 ) and the focusing unit ( 21 ) are arranged rotatably about the optical axis 16 of the laser L. 4. Vorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß eine zweite Antriebseinheit (23) zum Drehen der ersten und zweiten Ablenkeinheit (19, 20) und der Fokussiereinheit (21) um die optische Achse (16) des Lasers L und eine zweite Steuereinheit (24) zum Ansteuern der zweiten Antriebseinheit vorgesehen sind, wobei die Steuereinheit derart ausgebildet ist, daß der Laserstrahl aus der optischen Achse in einer Ebene abgelenkt wird, die mit der Normalen der Bearbeitungsbahn einen rechten Winkel einschließt.4. The device according to claim 3, characterized in that a second drive unit ( 23 ) for rotating the first and second deflection unit ( 19 , 20 ) and the focusing unit ( 21 ) about the optical axis ( 16 ) of the laser L and a second control unit ( 24 ) are provided for driving the second drive unit, the control unit being designed such that the laser beam is deflected from the optical axis in a plane which encloses a right angle with the normal of the machining path. 5. Vorrichtung nach einem der Ansprüche 2 bis 4, dadurch gekenn­ zeichnet, daß die erste und/oder zweite Ablenkeinheit (19, 20) Spiegel sind.5. Device according to one of claims 2 to 4, characterized in that the first and / or second deflection unit ( 19 , 20 ) are mirrors. 6. Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekenn­ zeichnet, daß die Fokussiereinheit (21) ein Linsensystem ist. 6. Device according to one of claims 1 to 5, characterized in that the focusing unit ( 21 ) is a lens system. 7. Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß der Laser (14) ein diodengepumpter Nd-YAG Laser ist.7. Device according to one of claims 1 to 6, characterized in that the laser ( 14 ) is a diode-pumped Nd-YAG laser.
DE29908585U 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials Expired - Lifetime DE29908585U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29908585U DE29908585U1 (en) 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19860585A DE19860585A1 (en) 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond
DE29908585U DE29908585U1 (en) 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials

Publications (1)

Publication Number Publication Date
DE29908585U1 true DE29908585U1 (en) 1999-09-02

Family

ID=7893031

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19860585A Ceased DE19860585A1 (en) 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond
DE29908585U Expired - Lifetime DE29908585U1 (en) 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE19860585A Ceased DE19860585A1 (en) 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond

Country Status (1)

Country Link
DE (2) DE19860585A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2314412A2 (en) 2009-10-22 2011-04-27 Ewag AG Laser machining apparatus and method for forming a surface on an unfinished product
DE102010011508A1 (en) 2010-03-15 2011-09-15 Ewag Ag Laser processing apparatus and method for producing a rotationally symmetrical tool
CN101610870B (en) * 2007-10-16 2013-09-11 三星钻石工业股份有限公司 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
WO2019166425A1 (en) 2018-02-28 2019-09-06 Vollmer Werke Maschinenfabrik Gmbh Device and method for machining a workpiece by means of a laser beam

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007012815B4 (en) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Method and device for forming a die
DE102008030783B3 (en) 2008-06-28 2009-08-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Process for laser beam angle cutting of workpiece involving ultrasonic gas cutting stream generally useful in laser cutting operations gives higher quality products at increased cutting speeds
DE102009034576A1 (en) * 2009-07-24 2011-02-03 Technische Universität Kaiserslautern Optical cutting edge preparation method and corresponding computer program product and corresponding device
US9463531B2 (en) 2009-10-23 2016-10-11 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
DE102011000768B4 (en) * 2011-02-16 2016-08-18 Ewag Ag Laser processing method and laser processing apparatus with switchable laser arrangement
EP2682219A1 (en) * 2012-07-06 2014-01-08 Rollomatic S.A. Method for workpiece processing
DE102014207510B4 (en) 2014-04-17 2021-12-16 Kennametal Inc. Cutting tool and method for producing a cutting tool
DE102014207507B4 (en) 2014-04-17 2021-12-16 Kennametal Inc. Cutting tool and method for producing a cutting tool
US9643282B2 (en) 2014-10-17 2017-05-09 Kennametal Inc. Micro end mill and method of manufacturing same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH1335667A4 (en) * 1967-09-25 1969-01-31 Laser Tech Sa Method for drilling watch stones using laser radiation
CH534570A (en) * 1967-09-25 1973-04-30 Laser Tech Sa Device for drilling watch stones using laser radiation
US4401875A (en) * 1977-05-05 1983-08-30 Retech, Inc. Saw blade for high speed electric arc saw
DE3202697A1 (en) * 1982-01-28 1983-08-04 Kapp & Co Werkzeugmaschinenfabrik, 8630 Coburg METHOD AND DEVICE FOR FINE-PROFILING TOOLS COATED WITH SUPER-HARD MATERIALS
DE4000420A1 (en) * 1989-01-09 1990-07-12 Mitsubishi Electric Corp Laser beam machine - with laser beam inclined to perpendicular axis of workpiece to reduce amt. of slag adhering to workpiece underside

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101610870B (en) * 2007-10-16 2013-09-11 三星钻石工业股份有限公司 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
EP2314412A2 (en) 2009-10-22 2011-04-27 Ewag AG Laser machining apparatus and method for forming a surface on an unfinished product
DE102009044316A1 (en) 2009-10-22 2011-05-05 Ewag Ag Laser processing apparatus and method for producing a surface on a blank
US8969758B2 (en) 2009-10-22 2015-03-03 Ewag Ag Laser machining apparatus and method for forming a surface on an unfinished product
DE102009044316B4 (en) * 2009-10-22 2015-04-30 Ewag Ag Method for producing a surface and / or edge on a blank and laser processing device for carrying out the method
DE102010011508A1 (en) 2010-03-15 2011-09-15 Ewag Ag Laser processing apparatus and method for producing a rotationally symmetrical tool
EP2374569A2 (en) 2010-03-15 2011-10-12 Ewag AG Laser processing device and method for manufacturing a rotation symmetric tool
DE102010011508B4 (en) * 2010-03-15 2015-12-10 Ewag Ag Method for producing at least one flute and at least one cutting edge and laser processing device
WO2019166425A1 (en) 2018-02-28 2019-09-06 Vollmer Werke Maschinenfabrik Gmbh Device and method for machining a workpiece by means of a laser beam

Also Published As

Publication number Publication date
DE19860585A1 (en) 2000-07-20

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19991007

R150 Term of protection extended to 6 years

Effective date: 20021008

R151 Term of protection extended to 8 years

Effective date: 20050809

R152 Term of protection extended to 10 years

Effective date: 20070808

R071 Expiry of right