DE19860585A1 - Device for laser-processing workpieces containing diamond - Google Patents

Device for laser-processing workpieces containing diamond

Info

Publication number
DE19860585A1
DE19860585A1 DE19860585A DE19860585A DE19860585A1 DE 19860585 A1 DE19860585 A1 DE 19860585A1 DE 19860585 A DE19860585 A DE 19860585A DE 19860585 A DE19860585 A DE 19860585A DE 19860585 A1 DE19860585 A1 DE 19860585A1
Authority
DE
Germany
Prior art keywords
laser beam
laser
characterized
workpiece
optical axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19860585A
Other languages
German (de)
Inventor
Werner Schulz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LASERPLUSS AG
Original Assignee
LASERPLUSS AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LASERPLUSS AG filed Critical LASERPLUSS AG
Priority to DE19860585A priority Critical patent/DE19860585A1/en
Publication of DE19860585A1 publication Critical patent/DE19860585A1/en
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

In a method for machining workpieces made of diamond-containing materials, in particular for cutting edge machining of tools made of diamond-containing materials, L workpiece is removed from the workpiece point by point with a pulsed laser beam while the laser beam is guided over the workpiece surface (16). The material is removed in layers from the workpiece. As the gap depth increases, the area over which the laser beam is guided is reduced. This enables a kerf (8) with a straight cutting edge (7) to be worked out in the workpiece without radii. To create kerfs with cutting edges that have a negative clearance angle, the laser beam is tilted in a plane that includes a right angle with the normal of the machining path.

Description

The invention relates to a method for machining workpieces materials containing diamond, in particular for Cutting edge processing of tools from diamond-containing Materials. In addition, the invention relates to a Device for performing such a method.

Abrasive materials are processed because of their increased Lifetime increasingly diamond-containing materials (PCD layers) or Diamond materials in monocrystalline and polycrystalline form (CVD- Layers). Tools with cutting edges Diamond materials are only used because of the hardness of the material little, but the production of these tools is very expensive.

Only the diamond itself can be used for machining Machining tool can be used. This is fine grain used as dust in a suspension on metallic supports. The Machining is carried out by abrasion (grinding), whereby the workpiece and Wear tool heavily. The stock removal rate of the grinding process is very low. Rotary symmetrical tools with many cutting edges cannot be sanded at all because the Grinding wheel wear from edge to edge Tool geometry changed. Therefore, the making of profiles is on multi-edged tools not possible. Monocrystalline Natural diamond can only be worked in the crystal direction. If there are structural anomalies, the diamond material cannot be processed  become.

Another known processing method for diamond materials is Electro erosion, which is only for electrically conductive ones Diamond coatings (PCD) can be applied. A disadvantage of Erosion technology is that a relatively large area in the boundary layer of the Diamond is destroyed. Therefore, post-processing is destroyed Zone required by grinding.

The invention is based, a method and a task Specify device that the machining of workpieces diamond-containing materials, especially the Cutting edge processing of tools from diamond-containing Simplify materials.

This object is achieved according to the invention with the features of claims 1 and 11 respectively.

It has been shown that with a pulsed laser beam with high Energy density in the focus in a simple way containing more diamonds Material or diamond material regardless of the crystal direction Removed point by point at a relatively high speed can.

Single crystal diamonds only absorb in the unprocessed state Fractions of the laser light. The first time the laser beam hits the The energy density of the beam must be so high that the surface part of the light absorbed is sufficient to cause a thermal reaction in Gear. When the reaction has started, there is the working surface made of converted carbon, which is the light completely absorbed.  

With polycrystalline diamond materials, however, this can Initial reaction can be neglected because of the metal bond of the Diamond grains absorb enough light.

It has proven to be particularly advantageous if the laser beam from a diode pumped Yd-YAG laser is generated. Such a laser has a compact structure with high beam quality with higher Energy density, shorter laser pulses and better focusability than conventional lasers. In the gate phase, performance can be precise dosed and set a high performance for processing.

The Nd-YAG laser is preferably in Q-switched operation controlled so that it has short light pulses with high energy peaks generated. This is advantageous in that with a longer exposure time of the Laser light gives the material more time to dissipate the energy, thereby the processing effect of the laser beam decreases. This effect plays play a significant role in the good heat conduction of a diamond.

The machining of cutting edges for contour tools is very high Requirements. The cutting edges should be straight a negative clearance angle (undercut) is often required.

For tool cutting, the workpiece can be cut with the Laser beam material in layers to form a kerf be removed along a given machining path runs. To remove the individual layers of material, the Laser beam in several juxtaposed and / or each other overlapping lines across the entire width of the area to be removed guided. The material processing with the laser are however Limits set because the focused on the workpiece surface  Laser beam widened like a angel. The laser beam penetrates several passes deeper into the material, it becomes at the top The cutting edge is shadowed, which puts its performance in focus decreases. This effect occurs at focal lengths of 50 mm from one Processing depth of 200 µm. Another problem with the Deep machining of diamonds is the supply of oxygen that comes with increasing gap depth decreases and the machining process slows down, reducing the thermal load and thus the risk of Destruction increases. In addition, that with metal bound Materials with increasing depth material no longer from the Kerf can be carried out. The result is that the Kerf narrowed at the leading edge.

This advantageously avoids the above disadvantages be that with increasing depth of processing the width of the area to be removed, over which the laser beam is guided, is reduced becomes. This allows kerfs with straight cutting edges to be cut without Work out radii.

Machining can be done on individual tools as well Rotary tools with a finite number of cutting edges applied become.

The reduction of the machining width with increasing removal depth leads to a reduction in processing time. The Processing time can be reduced in practice up to 50% to reduce.

To develop a cutting edge with a negative clearance angle, the Laser beam advantageously to a perpendicular to the Workpiece surface axis about a predetermined  Deflection angle inclined in a plane that is normal to the Machining path includes a right angle during the Laser beam is guided over the workpiece.

The laser beam is advantageously directed onto the workpiece in such a way that its optical axis is perpendicular to the workpiece surface, the laser beam being emitted before it hits the workpiece surface the optical axis is deflected in a plane that is normal the machining path encloses a right angle. The distracted The laser beam is then deflected again and to the point of Focused workpiece surface in which the optical axis of the Laser beam cuts the workpiece surface. If the Machining path not a straight line, but a curved one The inclined laser beam is rotated around an axis, that is perpendicular to the workpiece surface. This ensures that the laser beam is always inclined in a plane that with the Normal the machining path includes a right angle.

To accelerate the removal, the kerf gas, in particular Oxygen. Compressed air can also be used for cleaning be fed.

In the following the method according to the invention and a Embodiment of a device for performing the inventive method with reference to the drawings explained in more detail.

Show it:

Fig. 1, the machining of a workpiece from diamondiferous material with a pulsed laser beam in a time sequence,

Fig. 2 shows the preparation of a kerf in the workpiece,

Fig. 3, the cutting edge processing with an inclined laser beam and

Fig. 4 shows a cutting edge processing device in a simplified schematic representation.

Fig. 1 shows the processing of a diamond with a pulsed laser beam in chronological order. The first laser pulse 1 strikes the still unprocessed diamond 1 . With a lens system, the laser beam, which has a conical shape, is focused on the surface of the workpiece. The laser beam is generated with a diode-pumped Nd-YAG laser, which is controlled in Q-switched mode and generates short light pulses with high energy peaks. The diameter of the laser beam at the focal point 5 depends on the quality of the laser, its beam diameter and the focal length of the lens system.

Due to the absorption of light on the surface of the diamond Plasma ignited. The high temperatures lead to a reaction of the Carbon in the diamond with the oxygen in the ambient air. The Carbon combines with oxygen to form carbon dioxide. At the The surface of the diamond creates pure carbon with another Crystal structure. This increases the absorption of the material for the Laser light on strongly. For polycrystalline diamond materials, the Metal bond evaporates at high temperatures. The narrower the temporal and the spatial limitation of the point of light, the lower the Boundary layer between unprocessed thermally untreated metal  and evaporated material. The machining result becomes more precise, the Postprocessing less.

With each laser pulse, material gets to a certain depth worn away. The processing depth depends on the bundling of the Laser light, its pulse power, pulse duration and the oxygen content of the Ambient air.

The laser beam is guided over the material surface at a constant feed rate, so that the laser pulses 1 , 2 , 3 . . . n hit the workpiece at different points. The laser beam is guided over the workpiece surface at a feed rate such that the points at which the material is removed in a point-like manner overlap one another. After the processing run, the laser beam leaves a trench 4 , which can have a width of 25 μm and a depth of 15 μm, for example.

With a focus diameter of 10 µm, the machining of Diamond layers proved to be beneficial when the laser pulses overlap between 5 and 25%. With an average pulse rate of 5 KHz, this results in a feed rate of 1.5 m per minute.

Fig. 2 illustrates how a wider kerf is worked out in a diamond-containing workpiece 6 with the laser beam L to a cutting tool with a radius-free cutting edge 7 to manufacture, having a positive clearance angle.

The material is removed from the workpiece in layers with the laser beam L. First, the laser beam L is focused on the workpiece surface. The laser beam is then guided in the longitudinal direction of the kerf 8 over its entire length along a straight line 9 . Thereupon, the laser beam is displaced transversely to the longitudinal direction of the kerf and returned again along a line 10 in the opposite direction. The two lines can run side by side or overlap. The laser beam is then guided on this meandering path B1 over the entire width of the surface to be removed until the first material layer Δa is removed. For this purpose, the workpiece and / or the laser beam can be moved.

In order to be able to remove the next material layer Δa, the laser beam and / or the workpiece is moved in a direction perpendicular to the workpiece surface until the focus of the laser beam lies in the base of the kerf previously worked out. The laser beam is again guided in this plane along a meandering path B2 over the bottom of the kerf. However, the laser beam is not guided over the entire width b of the kerf 8 . Rather, the laser beam is guided such that the outer lines of the meandering path are offset inwards by the amount Δb. The removed area thus has a width of b-2Δb.

In subsequent processing cycles, the others are now Material layers Δa removed to the desired depth. Here the laser beam is guided such that the outer lines of each meandering path in each case by the distance Δb compared to that above located web are offset inwards. The distance Δb is from that Divergence angle of the laser beam L depends. The removal levels can be lowered gradually or continuously.

Since the ablation area is reduced with increasing ablation depth, there can be no shadowing of the laser beam at the edges of the kerf. Thus, a kerf 8 with a straight cutting edge 7 without radii is worked out in the workpiece.

Fig. 3 shows a section through a workpiece 11 transversely to the longitudinal direction of the cutting edge 12. The cutting edge has a negative clearance angle α, which is defined as the angle enclosed by the cutting edge and an axis 12 which is perpendicular to the workpiece surface.

To machine a cutting edge with a negative clearance angle α can, the laser beam L is inclined.

The laser beam L is inclined relative to the axis 13 which is perpendicular to the workpiece surface by a deflection angle β in a plane which includes a right angle with the longitudinal direction of the cutting edge. If the cutting edge does not have a straight, but a curved course, the laser beam is inclined in a plane which encloses a right angle with the normal which is applied to the cutting edge in the respective processing point.

FIG. 4 shows a cutting edge processing device for processing a cutting edge with a negative clearance angle, which can have a straight or curved course, in a simplified schematic illustration.

The device has a diode-pumped Nd-YAG laser 14 and a drive unit 15 for moving the laser in the x, y and z directions. The laser 14 generates a pulsed laser beam L, the optical axis 16 of which is designated. A holder 17 for the workpiece 18 to be machined is arranged below the laser.

In addition, the device has a first and second deflection unit 19 , 20 for the laser beam L and a focusing unit 21 which are attached to a common support 22 .

The first deflection unit 19 is a deflection mirror which is inclined at an angle of 45 ° to the optical axis 16 of the laser and which deflects the laser beam L from the optical axis by 90 °. The second deflection unit 20 is a second deflection mirror arranged next to the optical axis 16 in the beam path of the laser beam. The second deflection mirror is inclined in such a way that the laser beam strikes the workpiece at a point B at which the optical axis of the laser 16 intersects the workpiece. The focusing unit 21 is a lens system which is arranged in the beam path below the second deflection mirror and which focuses the laser beam onto the processing point B.

Due to the focal length of the lens system and the inclination of the second deflection mirror, a specific deflection angle β can be set, by which the laser beam L is inclined relative to an axis 16 which is perpendicular to the workpiece surface. The larger the clearance angle γ of the cutting edge, the greater the deflection angle β to be set. The deflection angle β is generally between 1 and 15 °, preferably between 8 and 12 °.

In the event that a cutting edge running in the z direction is machined the first and second deflecting mirrors are set in such a way that the laser beam is deflected in the x / y plane. For editing A curved cutting edge requires the laser beam track.  

To track the laser beam, the device has a second drive unit 23 which rotates the common carrier 22 for the first and second deflecting mirrors and the lens system about the optical axis of the laser. The second drive unit 23 is controlled by a control unit 24 which, depending on the course of the cutting edge, rotates the common support about the optical axis 16 of the laser 14 in such a way that the laser beam L is always deflected in a plane which is perpendicular to that at the the respective machining point is normal, ie the laser beam is inclined in a plane that extends perpendicular to the normal of the machining path. For example, for a cutting edge running in the x direction, the laser beam is deflected in the y / z plane.

The rotation of the optical arrangement can be due to the small mass the mirror can be executed very quickly, so that even tight radii constant speed can be processed.

During the processing of the kerf, the laser is moved by the first drive unit in such a way that the laser beam for machining the kerf is guided on meandering paths over the workpiece surface, the material being removed in layers, as described with reference to FIG. 3. However, the laser beam is tilted.

Claims (16)

1. A method for machining workpieces made of diamond-containing materials, in particular for machining cutting edges of tools, characterized in that material is removed from the workpiece point by point with a pulsed laser, the laser beam being guided over the workpiece surface.
2. The method according to claim 1, characterized in that the Laser beam generated by a diode pumped Nd-YAG laser becomes.
3. The method according to claim 1 or 2, characterized in that with the laser beam layer by layer to form a material Kerf is removed along a given Machining path runs, the laser beam being removed of the individual material layers in several side by side running and / or overlapping lines over the the entire width of the area to be removed and with increasing depth of cut the width of the area over which the Laser beam is guided, is reduced.
4. The method according to any one of claims 1 to 3, characterized characterized in that the laser beam is perpendicular to the Workpiece surface axis about a predetermined Deflection angle is inclined in a plane that with the Normal of the machining path includes a right angle, while the laser beam is being scanned over the workpiece.  
5. The method according to any one of claims 1 to 4, characterized characterized in that the laser beam on the Workpiece surface is directed that its optical axis that the laser beam is perpendicular to the workpiece surface before hitting the material surface from the optical Is deflected in a plane that is normal to the axis Machining path includes a right angle and that deflected laser beam at the deflection angle to the point of Workpiece surface is focused, in which the optical axis of the laser beam cuts the workpiece surface.
6. The method according to claim 5, characterized in that the vertically incident laser beam is deflected by 90 °.
7. The method according to any one of claims 4 to 6, characterized characterized in that the deflection angle is between 1 and 15 °, is preferably between 5 and 8 °.
8. The method according to any one of claims 1 to 7, characterized characterized in that the laser is a diode pumped Nd-YAG Is laser.
9. The method according to any one of claims 1 to 8, characterized characterized in that the laser beam with a Feed rate is that the places, at where the material is removed point by point, each other overlap.
10. The method according to any one of claims 1 to 9, characterized characterized in that the kerf is supplied with gas.  
11. Device for performing the method according to one of claims 1 to 10, with
a laser ( 14 ) for generating a pulsed laser beam L,
a holder ( 17 ) for the workpiece and
a drive unit ( 15 ) for moving the laser and / or the workpiece holder in the direction and transverse to the optical axis ( 16 ) of the laser,
marked by,
a first deflection unit ( 19 ) for deflecting the laser beam, which is arranged on the optical axis of the laser,
a second deflection unit ( 20 ) for deflecting the laser beam, which is arranged next to the optical axis of the laser beam and
a focusing unit ( 21 ) for focusing the laser beam, wherein
the first and second deflection units and the focusing unit are designed such that the laser beam is deflected from the optical axis of the laser and the deflected laser beam can be focused to a point B which lies on the optical axis of the laser.
12. The apparatus according to claim 11, characterized in that the first and second deflection unit ( 19 , 20 ) and the focusing unit ( 21 ) are arranged rotatably about the optical axis ( 16 ) of the laser L.
13. The apparatus according to claim 12, characterized in that a second drive unit ( 23 ) for rotating the first and second deflection unit ( 19 , 20 ) and the focusing unit ( 21 ) about the optical axis ( 16 ) of the laser L and a control unit ( 24th ) are provided, the control unit being designed such that the laser beam is deflected out of the optical axis in a plane which encloses a right angle with the normal of the machining path.
14. Device according to one of claims 11 to 13, characterized in that the first and / or second deflection unit ( 19 , 20 ) are mirrors.
15. The device according to one of claims 11 to 14, characterized in that the focusing unit ( 21 ) is a lens system.
16. The device according to one of claims 11 to 15, characterized in that the laser ( 14 ) is a diode-pumped Nd-YAG laser.
DE19860585A 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond Ceased DE19860585A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19860585A DE19860585A1 (en) 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19860585A DE19860585A1 (en) 1998-12-29 1998-12-29 Device for laser-processing workpieces containing diamond
DE29908585U DE29908585U1 (en) 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials

Publications (1)

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DE19860585A1 true DE19860585A1 (en) 2000-07-20

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DE29908585U Expired - Lifetime DE29908585U1 (en) 1998-12-29 1999-05-14 Device for machining workpieces made of diamond-containing materials

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009050938A1 (en) 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
DE102009034576A1 (en) * 2009-07-24 2011-02-03 Technische Universität Kaiserslautern Optical cutting edge preparation method and corresponding computer program product and corresponding device
US20110095005A1 (en) * 2009-10-22 2011-04-28 Gerhard Brunner Laser machining apparatus and method for forming a surface on an unifinished product
WO2011050053A2 (en) 2009-10-23 2011-04-28 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
DE102011000768A1 (en) * 2011-02-16 2012-08-16 Ewag Ag Laser processing apparatus with switchable laser arrangement and laser processing method
EP2700471A1 (en) * 2012-07-06 2014-02-26 Rollomatic S.A. Method for workpiece processing
US8847109B2 (en) 2007-03-16 2014-09-30 Sauer Gmbh Lasertec Method and device for machining a workpiece
US8872065B2 (en) 2010-03-15 2014-10-28 Ewag Ag Laser machining apparatus and method for the manufacture of a rotationally symmetrical tool
US9108271B2 (en) 2008-06-28 2015-08-18 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Oblique laser beam cutting
US9643282B2 (en) 2014-10-17 2017-05-09 Kennametal Inc. Micro end mill and method of manufacturing same
US10105769B2 (en) 2014-04-17 2018-10-23 Kennametal Inc. Machining tool and method for manufacturing a machining tool
US10369636B2 (en) 2014-04-17 2019-08-06 Kennametal Inc. Machining tool and method for manufacturing a machining tool

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Cited By (29)

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US8847109B2 (en) 2007-03-16 2014-09-30 Sauer Gmbh Lasertec Method and device for machining a workpiece
EP2199007A1 (en) * 2007-10-16 2010-06-23 Mitsuboshi Diamond Industrial Co., Ltd. Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
US20100320179A1 (en) * 2007-10-16 2010-12-23 Hideki Morita Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same
EP2199007A4 (en) * 2007-10-16 2011-02-09 Mitsuboshi Diamond Ind Co Ltd Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
WO2009050938A1 (en) 2007-10-16 2009-04-23 Mitsuboshi Diamond Industrial Co., Ltd. Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
KR101235617B1 (en) * 2007-10-16 2013-02-28 미쓰보시 다이야몬도 고교 가부시키가이샤 Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method
US9108271B2 (en) 2008-06-28 2015-08-18 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Oblique laser beam cutting
US9149889B2 (en) 2008-06-28 2015-10-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Orientating a laser cutting beam
DE102009034576A1 (en) * 2009-07-24 2011-02-03 Technische Universität Kaiserslautern Optical cutting edge preparation method and corresponding computer program product and corresponding device
EP2314412A3 (en) * 2009-10-22 2015-05-13 Ewag AG Laser machining apparatus and method for forming a surface on an unfinished product
EP2314412B1 (en) 2009-10-22 2018-12-19 Ewag AG Laser machining apparatus and method for forming a surface on an unfinished product
CN102091875A (en) * 2009-10-22 2011-06-15 埃瓦格股份公司 Laser machining apparatus and method for forming a surface on an unfinished product
CN102091875B (en) * 2009-10-22 2016-03-09 埃瓦格股份公司 For forming laser process equipment and the method on surface in unfinished products
US8969758B2 (en) * 2009-10-22 2015-03-03 Ewag Ag Laser machining apparatus and method for forming a surface on an unfinished product
US20110095005A1 (en) * 2009-10-22 2011-04-28 Gerhard Brunner Laser machining apparatus and method for forming a surface on an unifinished product
EP2490853A2 (en) * 2009-10-23 2012-08-29 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
WO2011050053A2 (en) 2009-10-23 2011-04-28 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
EP2490853A4 (en) * 2009-10-23 2015-04-29 Kennametal Inc Three-dimensional surface shaping of rotary cutting tool edges with lasers
US9463531B2 (en) 2009-10-23 2016-10-11 Kennametal Inc. Three-dimensional surface shaping of rotary cutting tool edges with lasers
US8872065B2 (en) 2010-03-15 2014-10-28 Ewag Ag Laser machining apparatus and method for the manufacture of a rotationally symmetrical tool
US8916798B2 (en) 2011-02-16 2014-12-23 Ewag Ag Laser machining apparatus with switchable laser system and laser machining method
DE102011000768B4 (en) * 2011-02-16 2016-08-18 Ewag Ag Laser processing method and laser processing apparatus with switchable laser arrangement
EP2489458A1 (en) * 2011-02-16 2012-08-22 Ewag AG Laser processing device with switchable laser assembly and laser processing method
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