DE29823250U1 - Schaltungsanordnung zur Prüfung von Lötstellen - Google Patents

Schaltungsanordnung zur Prüfung von Lötstellen

Info

Publication number
DE29823250U1
DE29823250U1 DE29823250U DE29823250U DE29823250U1 DE 29823250 U1 DE29823250 U1 DE 29823250U1 DE 29823250 U DE29823250 U DE 29823250U DE 29823250 U DE29823250 U DE 29823250U DE 29823250 U1 DE29823250 U1 DE 29823250U1
Authority
DE
Germany
Prior art keywords
solder joints
welding points
circuit arrangement
testing solder
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29823250U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Macrotron Scientific Engineering De GmbH
Original Assignee
Macrotron Process Technologies 85551 Kirchheim De GmbH
Macrotron Process Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macrotron Process Technologies 85551 Kirchheim De GmbH, Macrotron Process Technologies GmbH filed Critical Macrotron Process Technologies 85551 Kirchheim De GmbH
Priority to DE29823250U priority Critical patent/DE29823250U1/de
Publication of DE29823250U1 publication Critical patent/DE29823250U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
DE29823250U 1997-05-05 1998-05-04 Schaltungsanordnung zur Prüfung von Lötstellen Expired - Lifetime DE29823250U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29823250U DE29823250U1 (de) 1997-05-05 1998-05-04 Schaltungsanordnung zur Prüfung von Lötstellen

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19718940 1997-05-05
PCT/EP1998/002615 WO1998050784A1 (de) 1997-05-05 1998-05-04 Verfahren und schaltungsanordnung zur prüfung von lötstellen
DE29823250U DE29823250U1 (de) 1997-05-05 1998-05-04 Schaltungsanordnung zur Prüfung von Lötstellen

Publications (1)

Publication Number Publication Date
DE29823250U1 true DE29823250U1 (de) 1999-04-29

Family

ID=7828672

Family Applications (2)

Application Number Title Priority Date Filing Date
DE29823250U Expired - Lifetime DE29823250U1 (de) 1997-05-05 1998-05-04 Schaltungsanordnung zur Prüfung von Lötstellen
DE59809216T Expired - Lifetime DE59809216D1 (de) 1997-05-05 1998-05-04 Verfahren und schaltungsanordnung zur prüfung von lötstellen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59809216T Expired - Lifetime DE59809216D1 (de) 1997-05-05 1998-05-04 Verfahren und schaltungsanordnung zur prüfung von lötstellen

Country Status (6)

Country Link
US (1) US6404206B1 (de)
EP (1) EP0980520B1 (de)
AT (1) ATE246803T1 (de)
CA (1) CA2289721A1 (de)
DE (2) DE29823250U1 (de)
WO (1) WO1998050784A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009012468U1 (de) 2009-09-12 2010-01-07 Amrhein Messtechnik Gmbh Messeinrichtung für fehlerhafte Bauteile
DE102015212690B3 (de) * 2015-07-07 2016-09-01 Robert Bosch Gmbh Anlage und Verfahren zur Lötstellenüberprüfung

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043200A (ja) * 2000-07-24 2002-02-08 Mitsubishi Electric Corp 異常原因検出装置及び異常原因検出方法
US6563905B1 (en) * 2001-10-30 2003-05-13 Qualcomm, Incorporated Ball grid array X-ray orientation mark
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
US7203355B2 (en) * 2002-12-24 2007-04-10 Orbotech Ltd. Automatic optical inspection system and method
US20040218006A1 (en) * 2003-04-30 2004-11-04 Dickerson Stephen Lang Scanning apparatus
US7612296B2 (en) * 2004-08-31 2009-11-03 Synergy Microwave Corporation Visually inspectable surface mount device pad
JP4736764B2 (ja) * 2005-01-11 2011-07-27 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
US20080124210A1 (en) * 2006-11-28 2008-05-29 Peter Wayte Rotary assembly components and methods of fabricating such components
US20150015269A1 (en) * 2013-07-11 2015-01-15 Nvidia Corporation Detection of mis-soldered circuits by signal echo characteristics
US10338032B2 (en) 2016-11-22 2019-07-02 Gm Global Technology Operations Llc. Automated quality determination of joints
JP6682467B2 (ja) * 2017-03-21 2020-04-15 名古屋電機工業株式会社 検査装置、検査方法および検査プログラム
CN117153714B (zh) * 2023-10-31 2024-04-02 宁波尚进自动化科技有限公司 焊接键合的检测方法、系统、设备及其介质

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809308A (en) * 1986-02-20 1989-02-28 Irt Corporation Method and apparatus for performing automated circuit board solder quality inspections
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
JP2934455B2 (ja) * 1988-08-26 1999-08-16 株式会社日立製作所 Ｘ線透過画像によるはんだ付部の検査方法及びその装置
JP2751435B2 (ja) * 1989-07-17 1998-05-18 松下電器産業株式会社 電子部品の半田付状態の検査方法
US5164994A (en) * 1989-12-21 1992-11-17 Hughes Aircraft Company Solder joint locator
US5495424A (en) * 1990-04-18 1996-02-27 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
US5118192A (en) * 1990-07-11 1992-06-02 Robotic Vision Systems, Inc. System for 3-D inspection of objects
EP0859953B1 (de) * 1995-11-06 2000-09-20 Macrotron Process Technologies Gmbh Verfahren und anordnung zur prüfung von lötstellen
KR100200215B1 (ko) * 1996-04-08 1999-06-15 윤종용 상관 신경 회로망을 이용한 납땜 검사 장치 및방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009012468U1 (de) 2009-09-12 2010-01-07 Amrhein Messtechnik Gmbh Messeinrichtung für fehlerhafte Bauteile
DE102015212690B3 (de) * 2015-07-07 2016-09-01 Robert Bosch Gmbh Anlage und Verfahren zur Lötstellenüberprüfung

Also Published As

Publication number Publication date
US6404206B1 (en) 2002-06-11
EP0980520A1 (de) 2000-02-23
ATE246803T1 (de) 2003-08-15
DE59809216D1 (de) 2003-09-11
WO1998050784A1 (de) 1998-11-12
CA2289721A1 (en) 1998-11-12
EP0980520B1 (de) 2003-08-06

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19990610

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20010718

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20040521

R081 Change of applicant/patentee

Owner name: MACROTRON SCIENTIFIC ENGINEERING GMBH, DE

Free format text: FORMER OWNER: MACROTRON PROCESS TECHNOLOGIES GMBH, 85551 KIRCHHEIM, DE

Effective date: 20050112

R152 Utility model maintained after payment of third maintenance fee after eight years

Effective date: 20060619

R071 Expiry of right