DE2966504D1 - Method of making a semiconductor laser - Google Patents

Method of making a semiconductor laser

Info

Publication number
DE2966504D1
DE2966504D1 DE7979400294T DE2966504T DE2966504D1 DE 2966504 D1 DE2966504 D1 DE 2966504D1 DE 7979400294 T DE7979400294 T DE 7979400294T DE 2966504 T DE2966504 T DE 2966504T DE 2966504 D1 DE2966504 D1 DE 2966504D1
Authority
DE
Germany
Prior art keywords
making
semiconductor laser
laser
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7979400294T
Other languages
English (en)
Inventor
Eugene Duda
Claude Tondu
Alain Maumy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE2966504D1 publication Critical patent/DE2966504D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/037—Stamping with other step

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
DE7979400294T 1978-05-18 1979-05-10 Method of making a semiconductor laser Expired DE2966504D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7814762A FR2426347A1 (fr) 1978-05-18 1978-05-18 Source laser a semi-conducteur et son procede de fabrication

Publications (1)

Publication Number Publication Date
DE2966504D1 true DE2966504D1 (en) 1984-02-02

Family

ID=9208400

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7979400294T Expired DE2966504D1 (en) 1978-05-18 1979-05-10 Method of making a semiconductor laser

Country Status (6)

Country Link
US (1) US4411057A (de)
EP (1) EP0006042B1 (de)
JP (1) JPS54150993A (de)
CA (1) CA1164700A (de)
DE (1) DE2966504D1 (de)
FR (1) FR2426347A1 (de)

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JPS5776509A (en) * 1980-10-30 1982-05-13 Nippon Sheet Glass Co Ltd Optical fiber-lens coupler and its manufacture
JPS57172308A (en) * 1981-04-16 1982-10-23 Omron Tateisi Electronics Co Coupling method of semiconductor laser and optical waveguide
FR2509479A1 (fr) * 1981-07-10 1983-01-14 Thomson Csf Dispositif d'emission-reception d'energie radiante et systeme de liaison bidirectionnelle par fibre optique comprenant un tel dispositif
JPS5967678A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 光フアイバ−付レ−ザ−ダイオ−ド装置
DE3307465A1 (de) * 1983-03-03 1984-09-06 Standard Elektrik Lorenz Ag, 7000 Stuttgart Vorrichtung zum haltern eines wandlers und eines vor dem wandler endenden lichtwellenleiters
DE3307669A1 (de) * 1983-03-04 1984-09-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter
DE3330392A1 (de) * 1983-08-23 1985-03-07 Siemens AG, 1000 Berlin und 8000 München Laserdiode mit vereinfachter justierung
FR2558268B1 (fr) * 1984-01-17 1986-04-25 Thomson Csf Procede de fabrication d'une tete optique emissive a laser semiconducteur et tete optique ainsi fabriquee
DE3412766A1 (de) * 1984-04-05 1985-10-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Gehaeuse fuer eine faseroptische anordnung
FR2574566B1 (fr) * 1984-12-11 1987-01-16 Thomson Csf Diodes emettrices/receptrices de lumiere et elements de transmission optiques non reciproques integres, et leur procede de fabrication
IT1187137B (it) * 1985-01-30 1987-12-16 Claudio Salveti Apparecchio laser per uso medicale
JPS61182008A (ja) * 1985-02-07 1986-08-14 Yokogawa Electric Corp 光フアイバ結合器
JPS61278442A (ja) * 1985-05-31 1986-12-09 Tachi S Co Ltd 車両用座席のシ−トアジヤスタ
JPS6156630U (de) * 1985-08-01 1986-04-16
DE3531734A1 (de) * 1985-09-05 1987-03-12 Siemens Ag Einrichtung zur positionierung eines halbleiterlasers mit selbstjustierender wirkung fuer eine anzukoppelnde glasfaser
JPS6273437A (ja) * 1985-09-26 1987-04-04 Mitsubishi Electric Corp 光学式ヘツド装置
JPH0769520B2 (ja) * 1985-10-16 1995-07-31 ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ 可動部材の取付構造
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
US4892374A (en) * 1988-03-03 1990-01-09 American Telephone And Telegraph Company, At&T Bell Laboratories Article comprising an opto-electronic device and an optical waveguide coupled thereto, and method of making the article
US4904036A (en) * 1988-03-03 1990-02-27 American Telephone And Telegraph Company, At&T Bell Laboratories Subassemblies for optoelectronic hybrid integrated circuits
GB2220501A (en) * 1988-07-06 1990-01-10 Plessey Co Plc Coupling waveguides using transverse cylindrical lenses
US4946553A (en) * 1988-09-08 1990-08-07 United Technologies Corporation Apparatus for interfacing an optical fiber to an optical source
DE4002490A1 (de) * 1989-08-31 1991-08-01 Bodenseewerk Geraetetech Verfahren zum anbringen von elektrooptischen bauteilen an integriert-optischen wellenleitern
US6090635A (en) * 1992-11-17 2000-07-18 Gte Laboratories Incorporated Method for forming a semiconductor device structure having a laser portion
JPH06334262A (ja) * 1993-03-23 1994-12-02 Mitsubishi Electric Corp 半導体レーザアレイ装置，半導体レーザ装置，及びそれらの製造方法
US5438580A (en) * 1993-09-24 1995-08-01 Opto Power Corporation Laser package and method of assembly
EP0767923B1 (de) * 1994-06-29 2000-01-05 BRITISH TELECOMMUNICATIONS public limited company Optische bauteilanordnung
US6152588A (en) 1994-09-28 2000-11-28 Sdl, Inc. Addressable vehicular lighting system
GB2307786B (en) * 1996-05-16 1997-10-15 Bookham Technology Ltd Assembly of an optical component and an optical waveguide
SE508068C2 (sv) * 1996-12-19 1998-08-24 Ericsson Telefon Ab L M Mikroreplikering i metall
SE511944C2 (sv) * 1997-06-18 1999-12-20 Ericsson Telefon Ab L M Förfarande för att inrikta optiska byggelement, bärare samt optisk komponent
US6240113B1 (en) 1998-02-27 2001-05-29 Litton Systems, Inc. Microlaser-based electro-optic system and associated fabrication method
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
GB2335504B (en) 1998-05-28 2000-01-26 Bookham Technology Ltd Assembly of optical component and optical fibre
SE522114C2 (sv) 1998-08-18 2004-01-13 Ericsson Telefon Ab L M Metalliska byggelement för optoelektronik
DE19838518A1 (de) * 1998-08-25 2000-03-02 Bosch Gmbh Robert Anordnung
US6932519B2 (en) * 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US20030021572A1 (en) * 2001-02-07 2003-01-30 Steinberg Dan A. V-groove with tapered depth and method for making
US6885786B2 (en) 2001-02-07 2005-04-26 Shipley Company, L.L.C. Combined wet and dry etching process for micromachining of crystalline materials
US6907150B2 (en) * 2001-02-07 2005-06-14 Shipley Company, L.L.C. Etching process for micromachining crystalline materials and devices fabricated thereby
US6964804B2 (en) * 2001-02-14 2005-11-15 Shipley Company, L.L.C. Micromachined structures made by combined wet and dry etching
US20020195417A1 (en) * 2001-04-20 2002-12-26 Steinberg Dan A. Wet and dry etching process on <110> silicon and resulting structures
CN100365775C (zh) 2003-05-23 2008-01-30 罗姆和哈斯电子材料有限责任公司 用于显微机械加工晶体材料的蚀刻方法以及由此方法制备的器件
RU2647212C1 (ru) * 2012-04-11 2018-03-14 Нанопресижен Продактс, Инк. Герметичная сборка для выравнивания оптического волокна
WO2017141894A1 (ja) * 2016-02-15 2017-08-24 三菱電機株式会社 半導体レーザ光源装置

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US436187A (en) * 1890-09-09 Die for making car-axle-box lids
US3840889A (en) * 1973-07-11 1974-10-08 Rca Corp Laser diode package formed of ceramic and metal materials having high electrical and thermal conductivity
US4027521A (en) * 1975-01-30 1977-06-07 Trw Inc. Apparatus for making terminal connectors
NL7505629A (nl) * 1975-05-14 1976-11-16 Philips Nv Inrichting voor het koppelen van een lichtbron met een optische vezel.
JPS523391A (en) * 1975-06-27 1977-01-11 Hitachi Ltd Mount used for semiconductor laser
FR2317786A1 (fr) * 1975-07-11 1977-02-04 Licentia Gmbh Photocoupleur entre un guide de lumiere filiforme et un laser a semiconducteurs montes a demeure sur un support commun
NL180882C (nl) * 1976-05-31 1987-05-04 Philips Nv Optisch koppelelement en optische koppelinrichting met zulke koppelelementen.
US4079404A (en) * 1976-12-30 1978-03-14 International Business Machines Corporation Self-aligning support structure for optical components
US4156206A (en) * 1976-12-30 1979-05-22 International Business Machines Corporation Grating coupled waveguide laser apparatus
US4186994A (en) * 1978-04-21 1980-02-05 Bell Telephone Laboratories, Incorporated Arrangement for coupling between an electrooptic device and an optical fiber

Also Published As

Publication number Publication date
EP0006042A1 (de) 1979-12-12
FR2426347A1 (fr) 1979-12-14
EP0006042B1 (de) 1983-12-28
FR2426347B1 (de) 1981-12-04
JPS54150993A (en) 1979-11-27
CA1164700A (en) 1984-04-03
US4411057A (en) 1983-10-25

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee