DE2951296A1 - Isolierkoerper - Google Patents

Isolierkoerper

Info

Publication number
DE2951296A1
DE2951296A1 DE19792951296 DE2951296A DE2951296A1 DE 2951296 A1 DE2951296 A1 DE 2951296A1 DE 19792951296 DE19792951296 DE 19792951296 DE 2951296 A DE2951296 A DE 2951296A DE 2951296 A1 DE2951296 A1 DE 2951296A1
Authority
DE
Germany
Prior art keywords
insulating body
thermally conductive
conductive particles
barrel
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19792951296
Other languages
German (de)
English (en)
Other versions
DE2951296C2 (cs
Inventor
Hans 7900 Ulm Bendig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Electron Devices GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19792951296 priority Critical patent/DE2951296A1/de
Publication of DE2951296A1 publication Critical patent/DE2951296A1/de
Application granted granted Critical
Publication of DE2951296C2 publication Critical patent/DE2951296C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
DE19792951296 1979-12-20 1979-12-20 Isolierkoerper Granted DE2951296A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19792951296 DE2951296A1 (de) 1979-12-20 1979-12-20 Isolierkoerper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792951296 DE2951296A1 (de) 1979-12-20 1979-12-20 Isolierkoerper

Publications (2)

Publication Number Publication Date
DE2951296A1 true DE2951296A1 (de) 1981-06-25
DE2951296C2 DE2951296C2 (cs) 1988-10-27

Family

ID=6089002

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792951296 Granted DE2951296A1 (de) 1979-12-20 1979-12-20 Isolierkoerper

Country Status (1)

Country Link
DE (1) DE2951296A1 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
WO2002039797A1 (en) * 2000-11-10 2002-05-16 Telefonaktiebolaget Lm Ericsson (Publ) A dielectric spacing layer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325582A (en) * 1964-08-27 1967-06-13 Bosch Gmbh Robert Arrangement for supporting and for conducting heat away from a semiconductor element in a capsule of electrically conductive material
US3391242A (en) * 1966-12-27 1968-07-02 Admiral Corp Transistor insulator with self-contained silicone grease supply

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325582A (en) * 1964-08-27 1967-06-13 Bosch Gmbh Robert Arrangement for supporting and for conducting heat away from a semiconductor element in a capsule of electrically conductive material
US3391242A (en) * 1966-12-27 1968-07-02 Admiral Corp Transistor insulator with self-contained silicone grease supply

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
WO2002039797A1 (en) * 2000-11-10 2002-05-16 Telefonaktiebolaget Lm Ericsson (Publ) A dielectric spacing layer

Also Published As

Publication number Publication date
DE2951296C2 (cs) 1988-10-27

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Legal Events

Date Code Title Description
8120 Willingness to grant licences paragraph 23
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AEG ELEKTRONISCHE ROEHREN GMBH, 89077 ULM, DE

8339 Ceased/non-payment of the annual fee