DE2920940C2 - - Google Patents

Info

Publication number
DE2920940C2
DE2920940C2 DE2920940A DE2920940A DE2920940C2 DE 2920940 C2 DE2920940 C2 DE 2920940C2 DE 2920940 A DE2920940 A DE 2920940A DE 2920940 A DE2920940 A DE 2920940A DE 2920940 C2 DE2920940 C2 DE 2920940C2
Authority
DE
Germany
Prior art keywords
resist
copper
nickel
cobalt
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2920940A
Other languages
German (de)
English (en)
Other versions
DE2920940A1 (de
Inventor
Klaus Gedrat
Hans-Juergen Dipl.-Chem.Dr. Ehrich
Hartmut Ing.(Grad.) Mahlkow
Joachim 1000 Berlin De Wolff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Priority to DE19792920940 priority Critical patent/DE2920940A1/de
Priority to NL8002375A priority patent/NL8002375A/nl
Priority to CH3804/80A priority patent/CH658563A5/de
Priority to US06/150,174 priority patent/US4285991A/en
Priority to SE8003710A priority patent/SE457593B/sv
Priority to IT22186/80A priority patent/IT1130622B/it
Priority to JP6606880A priority patent/JPS55156396A/ja
Priority to CA000352367A priority patent/CA1152225A/en
Priority to IE1052/80A priority patent/IE49333B1/en
Priority to FR8011341A priority patent/FR2457621A1/fr
Priority to GB8016840A priority patent/GB2051489B/en
Publication of DE2920940A1 publication Critical patent/DE2920940A1/de
Application granted granted Critical
Publication of DE2920940C2 publication Critical patent/DE2920940C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0341—Intermediate metal, e.g. before reinforcing of conductors by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Moulding By Coating Moulds (AREA)
  • Braking Arrangements (AREA)
  • Mechanical Operated Clutches (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
DE19792920940 1979-05-21 1979-05-21 Verfahren zur herstellung von gedruckten schaltungen Granted DE2920940A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE19792920940 DE2920940A1 (de) 1979-05-21 1979-05-21 Verfahren zur herstellung von gedruckten schaltungen
NL8002375A NL8002375A (nl) 1979-05-21 1980-04-23 Werkwijze voor de vervaardiging van gedrukte bedra- dingen.
CH3804/80A CH658563A5 (de) 1979-05-21 1980-05-14 Verfahren zur herstellung von gedruckten schaltungen.
US06/150,174 US4285991A (en) 1979-05-21 1980-05-15 Method for producing printed circuits
SE8003710A SE457593B (sv) 1979-05-21 1980-05-19 Saett foer framstaellning av tryckta kretsar
JP6606880A JPS55156396A (en) 1979-05-21 1980-05-20 Method of manufacturing printed board
IT22186/80A IT1130622B (it) 1979-05-21 1980-05-20 Processo per la fabbricazione di circuiti stampati
CA000352367A CA1152225A (en) 1979-05-21 1980-05-21 Process for the manufacture of printed circuits
IE1052/80A IE49333B1 (en) 1979-05-21 1980-05-21 Process for the manufacture of printed circuits
FR8011341A FR2457621A1 (fr) 1979-05-21 1980-05-21 Procede de fabrication de circuits imprimes
GB8016840A GB2051489B (en) 1979-05-21 1980-05-21 Process for the manufacture of printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792920940 DE2920940A1 (de) 1979-05-21 1979-05-21 Verfahren zur herstellung von gedruckten schaltungen

Publications (2)

Publication Number Publication Date
DE2920940A1 DE2920940A1 (de) 1980-12-04
DE2920940C2 true DE2920940C2 (en, 2012) 1988-10-06

Family

ID=6071549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19792920940 Granted DE2920940A1 (de) 1979-05-21 1979-05-21 Verfahren zur herstellung von gedruckten schaltungen

Country Status (11)

Country Link
US (1) US4285991A (en, 2012)
JP (1) JPS55156396A (en, 2012)
CA (1) CA1152225A (en, 2012)
CH (1) CH658563A5 (en, 2012)
DE (1) DE2920940A1 (en, 2012)
FR (1) FR2457621A1 (en, 2012)
GB (1) GB2051489B (en, 2012)
IE (1) IE49333B1 (en, 2012)
IT (1) IT1130622B (en, 2012)
NL (1) NL8002375A (en, 2012)
SE (1) SE457593B (en, 2012)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008434A1 (de) * 1980-03-03 1981-09-17 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur selektiven chemischen und/oder galvanischen abscheidung von metallueberzuegen, insbesondere zur herstellung von gedruckten schaltungen
DE3021896A1 (de) * 1980-06-06 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur herstellung von gedruckten schaltungen
DE3380413D1 (en) * 1982-04-27 1989-09-21 Richardson Chemical Co Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
DE3242162A1 (de) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von verbundwerkstoffen
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
GB2141879B (en) * 1983-06-01 1988-03-09 Ferranti Plc Manufacture of printed circuit boards
DE3407114A1 (de) * 1984-02-28 1985-09-05 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von leiterplatten
DE3417563C2 (de) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Verfahren zur Herstellung von Metallmustern auf isolierenden Trägern, insbesondere gedruckte Schaltungen
ATA200888A (de) * 1987-08-11 1993-07-15 Schering Ag Konditionierungsmittel für gedruckte schaltungen
DE3800682A1 (de) * 1988-01-13 1989-07-27 Bayer Ag Verfahren zur herstellung von elektrischen leiterplatten
GB2284509B (en) * 1993-12-03 1997-11-26 John Frederick David Knopp Method of making a printed circuit board
EP0762813A1 (en) * 1995-08-25 1997-03-12 Macdermid Incorporated Method for the manufacture of printed circuit boards
US7537799B2 (en) 2003-07-11 2009-05-26 Hewlett-Packard Development Company, L.P. Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
US20050199587A1 (en) * 2004-03-12 2005-09-15 Jon Bengston Non-chrome plating on plastic
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB829263A (en) * 1957-02-08 1960-03-02 Sperry Rand Corp Method of making printed circuits
GB964557A (en) * 1962-07-02 1964-07-22 Marconi Co Ltd Improvements in or relating to printed circuits and methods of manufacturing the same
DE1621103A1 (de) * 1967-11-24 1971-06-24 Guenter Dr Laubmeyer Verfahren zur Herstellung metallisierter Loecher in gedruckten Schaltungen
DE1924775B2 (de) * 1969-05-14 1971-06-09 Verfahren zur herstellung einer leiterplatte
US3640765A (en) * 1969-08-06 1972-02-08 Rca Corp Selective deposition of metal
US3672986A (en) * 1969-12-19 1972-06-27 Day Co Nv Metallization of insulating substrates
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US4024631A (en) * 1975-11-24 1977-05-24 Xerox Corporation Printed circuit board plating process
AT349110B (de) * 1975-12-09 1979-03-26 Ney Fa Gerhard Vorrichtung zum doublieren von gemaelden
US4104111A (en) * 1977-08-03 1978-08-01 Mack Robert L Process for manufacturing printed circuit boards

Also Published As

Publication number Publication date
IE49333B1 (en) 1985-09-18
FR2457621B1 (en, 2012) 1985-03-22
CA1152225A (en) 1983-08-16
JPS55156396A (en) 1980-12-05
IT8022186A0 (it) 1980-05-20
FR2457621A1 (fr) 1980-12-19
IE801052L (en) 1980-11-21
GB2051489A (en) 1981-01-14
GB2051489B (en) 1983-07-20
IT1130622B (it) 1986-06-18
SE8003710L (sv) 1980-11-22
US4285991A (en) 1981-08-25
DE2920940A1 (de) 1980-12-04
JPS6252480B2 (en, 2012) 1987-11-05
SE457593B (sv) 1989-01-09
NL8002375A (nl) 1980-11-25
CH658563A5 (de) 1986-11-14

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee