DE2719741A1

DE2719741A1 - Abrasive disc for slitting semiconductor wafers - is made by bonding galvanically made abrasive disc onto metal disc

Info

Publication number: DE2719741A1
Application number: DE19772719741
Authority: DE
Inventors: Geb Riemer Elfriede Peltz
Original assignee: Peltz Gebriemer elfriede
Current assignee: Peltz Gebriemer elfriede
Priority date: 1977-05-03
Filing date: 1977-05-03
Publication date: 1978-11-09

Abstract

The slitting disc, or dicing saw for cutting semiconductor wafers is typically about 30 micron. thick. The support disc (1) which is made from a high strength light alloy is covered with a very thin layer of epoxy adhesive. A ring (3) made from the grinding material is pressed hot against the support disc. The slitting blade is made in sheet form by a galvano-plastic process. The diamond bort used (typically 5 to 6 micron in size) is nickel plated and mounted on a base plate. Carrier material, which is normally a Nickel or Nickel-Cobalt alloy is galvanically applied to the diamond bort to form the slitting blade. The blade is then removed from the base plate.

Description

Schleifscheibe Grinding wheel

Zum Teilen von Halbleiterscheiben (Wafers) und sonstigen harten, in der Elektronikindustrie verwendeten Substratscheiben werden in neuerer Zeit häufig sogenannte wDicing-Saws" verwendet. Dies sind eigentlich keine Sägen, sondern Schleifer mit numerischer Steuerung der Raster oder Gatter, bei denen der Schleifkörper aus dünnen Blättern (typ. 30/um) mit in Metallegierung eingebetteten Diamantkörnern besteht, der durch die hohe Drehzahl der "Schleifscheibe" stabilisiert wird.For dividing semiconductor wafers and other hard, in Substrate wafers used in the electronics industry have recently become common so-called wDicing-Saws "are used. These are actually not saws, but grinders with numerical control of the grid or gate where the grinding wheel is made thin blades (typ. 30 / um) with diamond grains embedded in a metal alloy which is stabilized by the high speed of the "grinding wheel".

Bis Jetzt wurden diese Schleifscheiben (Saw-Blades) nach einem sehr komplizierten und teuren Galvanoverfahren direkt auf dem Trägermaterial hergestellt, das dann durch Ätzung teilweise wieder beseitigt werden mußte. Dieses Verfahren ist im US-Patent 3 691 707 v. 19. Sept. 1972, im französ.Up until now, these saw blades were after a great deal complicated and expensive electroplating processes produced directly on the carrier material, which then had to be partially removed again by etching. This method is in U.S. Patent 3,691,707 to Sept. 19, 1972, in French.

Patent 2 069 266 und in weiteren Länderpatenten beschrieben.Patent 2,069,266 and described in other national patents.

Nach japanischen Verfahren wurde ein kunststoffgebundenes Blatt in einem Adapter zentriert und eingespannt Wegen dieser sehr komplizierten Herstellverfahren wurde vom Erfinder ein neuer Weg gesucht, diese Sägeblätter einfacher und kostengünstiger herzustellen, wobei gleichzeitig eine höhere Schwingungsdämpfung des Schleifmittelträgers und damit ein sauberer Schnitt erreicht werden sollte, der wie folgt gefunden wurde: Auf einem Rörper aus hochfestem Leichtmetall wird ein geeigneter Rleber wegen der aus Festigkeitsgründen sehr dUnnen Schicht aufgeschleudert. Diese kleberbeschichtete Trägerscheibe wird mittels Heißpressung mit der eigentlichen Schleiffolie (in Ringform) verbunden. Der Schleifring in Form einer Folie wird in einem galvanoplastischen Verfahren hergestellt, bei dem die erforderlichen Diamantkörner (typ. 5...6/um, jedoch bis 30,um) während des galvanischen Auftra gens des Trägermaterials auf die zur Galvanoplastik notwendige Grundplatte, von der er nachher wieder gelöst wird, in das Trägermaterial eingebettet werden. Zur besseren Verbindung mit dem Trägermaterial, das vorwiegend aus Nickel oder Legierungen, z.B. Nickel-Kobalt, besteht, werden die Diamantkörner vor Einbringen in das Nickel-Bad stromlos vorvernickelt. Als Kleber wird wegen der bei der hohen Drehzahl erforderlichen Scherfestigkeit vorwiegend ein Epoxidkleber oder ein Kleber aus Phenolharzen verwendet.A plastic-bound sheet was made in centered and clamped in an adapter because of this very complicated manufacturing process the inventor was looking for a new way to make these saw blades simpler and cheaper produce, at the same time a higher vibration damping of the abrasive backing and so that a clean cut should be achieved, which was found as follows: on A body made of high-strength light metal is a suitable liver because of the For reasons of strength, a very thin layer is thrown on. This glue coated The carrier disk is hot-pressed with the actual abrasive film (in a ring shape) tied together. The slip ring in the form of a foil is in a galvanoplastic Process produced in which the required diamond grains (typ. 5 ... 6 / um, but up to 30 .mu.m) during the galvanic application of the carrier material to the baseplate necessary for electroplating, from which it is removed again afterwards, be embedded in the carrier material. For a better connection with the carrier material, which consists primarily of nickel or alloys, e.g. nickel-cobalt the diamond grains are electrolessly pre-nickel-plated before they are introduced into the nickel bath. As glue becomes predominant because of the shear strength required at the high speed an epoxy adhesive or a phenolic resin adhesive is used.

Claims

P a t e n t a n t a n p r ü c h e 1. A grinding wheel, consisting of a support body (4) made of aluminum or another high-strength light alloy, to which an adhesive (t) made of epoxy resin or another thermosetting adhesive is applied is, and which is connected to the grinding body (3) by hot pressing.

2. A grinding wheel, thereby g e k e n n n z e i c h -n e t that the one required to connect the carrier body (4) and the abrasive carrier (3) Adhesive (2) is applied by spinning on.

3. A grinding wheel, thereby g e k e n n n z e i c h -n e t that the edge bead that occurs during centrifugation is removed by increasing the speed will.

4. A grinding wheel, thereby g e k e n n n z e i c h -n e t that an epoxy resin or for connecting the carrier body (4) and the abrasive carrier (3) a phenolic resin is used, which has a thickness of 4 ... 7 / µm and is pressed under pressure will.

5. A grinding wheel, thereby g e k e n n n z e i c h -n e t that the abrasive carrier (3) made of nickel or an alloy suitable for electroplating, predominantly Nickel-cobalt, in which the abrasive bodies () are galvanically made of diamond (grain size: 5 ... 30 / um) are introduced.

6. A grinding wheel, thereby g e k e n n n z e i c h -n e t that the abrasive bodies (eleven) made of diamond or corundum in the sleeping aid carrier (3) have been pretreated by electroless nickel plating.

7. An abrasive (3) in the form of a film, with a thickness of 15 ... 100 / um, which is produced by electroplating on a carrier from which it is used for Further processing is removed again.

8. A grinding wheel consisting of a body made of aluminum or Another high-strength light alloy, on which a glued-on epoxy resin or another thermosetting adhesive by centrifuging or screen printing in one thickness of 4 ... 7 / um is brought to and a grinding foil mouse nickel in the diamond grains (4) of 5 ... 30 / µm are embedded, which are connected to the body by hot pressing is.