JPS5621775A - Cutting wheel and its manufacture - Google Patents

Cutting wheel and its manufacture

Info

Publication number
JPS5621775A
JPS5621775A JP6881380A JP6881380A JPS5621775A JP S5621775 A JPS5621775 A JP S5621775A JP 6881380 A JP6881380 A JP 6881380A JP 6881380 A JP6881380 A JP 6881380A JP S5621775 A JPS5621775 A JP S5621775A
Authority
JP
Japan
Prior art keywords
manufacture
cutting wheel
cutting
wheel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6881380A
Other languages
Japanese (ja)
Inventor
Furankusu Uebu Suuiito Jiyoon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Loadpoint Ltd
Original Assignee
Loadpoint Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loadpoint Ltd filed Critical Loadpoint Ltd
Publication of JPS5621775A publication Critical patent/JPS5621775A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
JP6881380A 1979-05-23 1980-05-23 Cutting wheel and its manufacture Pending JPS5621775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7918053 1979-05-23

Publications (1)

Publication Number Publication Date
JPS5621775A true JPS5621775A (en) 1981-02-28

Family

ID=10505405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6881380A Pending JPS5621775A (en) 1979-05-23 1980-05-23 Cutting wheel and its manufacture

Country Status (1)

Country Link
JP (1) JPS5621775A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2719741A1 (en) * 1977-05-03 1978-11-09 Geb Riemer Elfriede Peltz Abrasive disc for slitting semiconductor wafers - is made by bonding galvanically made abrasive disc onto metal disc
JPS5459691A (en) * 1977-08-18 1979-05-14 Chemet Res Inc Blade for cutting material and its preparation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2719741A1 (en) * 1977-05-03 1978-11-09 Geb Riemer Elfriede Peltz Abrasive disc for slitting semiconductor wafers - is made by bonding galvanically made abrasive disc onto metal disc
JPS5459691A (en) * 1977-08-18 1979-05-14 Chemet Res Inc Blade for cutting material and its preparation

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