DE2529676A1 - Thin chipboard panel covered with resin impregnated paper - preventing overcuring leading to destruction of chip structure - Google Patents

Thin chipboard panel covered with resin impregnated paper - preventing overcuring leading to destruction of chip structure

Info

Publication number
DE2529676A1
DE2529676A1 DE19752529676 DE2529676A DE2529676A1 DE 2529676 A1 DE2529676 A1 DE 2529676A1 DE 19752529676 DE19752529676 DE 19752529676 DE 2529676 A DE2529676 A DE 2529676A DE 2529676 A1 DE2529676 A1 DE 2529676A1
Authority
DE
Germany
Prior art keywords
decorative
layer
impregnated
paper
chipboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19752529676
Other languages
German (de)
Other versions
DE2529676C2 (en
Inventor
Theodor Dipl Ing Henne
Ernst Riedl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resopal GmbH
Original Assignee
ROEMMLER H RESOPAL WERK GmbH
Resopal Werk H Roemmler GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROEMMLER H RESOPAL WERK GmbH, Resopal Werk H Roemmler GmbH filed Critical ROEMMLER H RESOPAL WERK GmbH
Priority to DE2529676A priority Critical patent/DE2529676C2/en
Publication of DE2529676A1 publication Critical patent/DE2529676A1/en
Application granted granted Critical
Publication of DE2529676C2 publication Critical patent/DE2529676C2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/08Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/06Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44CPRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00Processes for producing special ornamental bodies
    • B44C5/04Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0469Ornamental plaques, e.g. decorative panels, decorative veneers comprising a decorative sheet and a core formed by one or more resin impregnated sheets of paper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/028Paper layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2451/00Decorative or ornamental articles

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)

Abstract

Decorative laminated panel comprises a chipboard panel 1-5mm. thick with a heat-curable resin content of 8-35 wt. %; and a decorative paper layer impregnated with heat-curable resin. In addn. to the decorative paper layer, which is pref. impregnated with melamine resin, there may also be one or more sheets of soda kraft paper impregnated with phenolic resin. The panel is produced by curing the resin-impregnated chipboard, but not completely, and pressing it with teh decorative layer(s) at a pressure of 70-120 kp/sq. cm. and at temps. of 120-150 degrees C. Embossed press plates and bonding sheets may also be used in the mfr. of the panel to provide the decorative layer with spatial texturing. If the laminated panel is provided with the decorative paper layer on one side only, it may be provided with a sheet of paper on the other side.

Description

"Dekorative Schichtstoffplatte" Die Erfindung betrifft eine dekorative Schichtstoffplatte mit Träger- und Dekorschicht."Decorative laminate board" The invention relates to a decorative Laminate board with carrier and decorative layer.

Es sind bereits Schichtstoffplatten verschiedener Art bek n Atgeworden, die eine Dekorschicht und eine Trägerschicht aufweisen. Sie können aus verschiedenen bahnenförmigen Trägermaterialien aufgebaut sein, z. B. Vliesen, die mit härtbaren oder thermoplastischen Harzen imprägniert bzw. beschichtet worden sind. Mehrere solcher Bahnen gleicher oder verschiededener Art können gegebenenfalls unter Einwirkung von Wärme und Druck vereinigt sein. Besonders häufig werden Bahnen von Natronkraftpapier als Träger verwendet, die mit Phenol- oder Kresolharz imprägniert sind. An diese schließt sich dann ein oder beidseitig mindestens ein mit Harnstoff- oder Melaminharz imprägnierter, gegebenenfalls unifarbiger oder dekorativ bedruckter Bogen aus Zellulose an. Die Gesamtstärke solcher Schichtstoffplatten beträgt im allgemeinen 0,7 bis 1,5 mm.Laminate panels of various types have already been known which have a decorative layer and a carrier layer. You can choose from different be constructed in sheet-like carrier materials, e.g. B. nonwovens with curable or thermoplastic resins have been impregnated or coated. Several Such tracks of the same or different types can, if necessary, be affected be united by heat and pressure. Sheets of soda kraft paper are particularly common used as a carrier impregnated with phenolic or cresol resin. To this then closes one or both sides at least one with urea or melamine resin Impregnated, possibly plain-colored or decoratively printed sheet made of cellulose at. The total thickness of such laminate panels is generally 0.7 to 1.5 mm.

Es wurde nun auch schon bekannt, eine solche Schichtstoffplatte dadurch aufzubauen, daß man die meist nur aus einer Papierlage bestehende Dekorschicht auf eine ebenfalls einschichtige Kern- bzw. Trägerlage entsprechender Stärke, etwa Vulkanfieber, aufbringt. Diese Lösung konnte bisher nicht befriedigen.It has now also become known that such a laminate board can be produced by this build up that you usually only consist of a paper layer decorative layer a single-layer core or carrier layer of the same thickness, such as volcanic fever, brings up. So far, this solution has not been satisfactory.

Angesichts des ökonomischen Aufwandes, wie er zur Umwandlung von Holz bzw. Holzfaserprodukten in Papier notwendig ist, schien es erstrebenswert, eine Schichtstoffplatte zu schaffen, die mit einer Trägerschicht aus Holzfaser- bzw. Holzschnitzelstoffen auskommt. Dadurch werden die hohen Kosten für die Herstellung der einzelnen Papiere sowie deren Tränkung mit Harz entbehrlich.Given the economic outlay involved in converting wood or wood fiber products in paper is necessary, it seemed desirable to achieve a To create a laminate board with a carrier layer made of wood fiber or Wood chips. This reduces the high cost of manufacture the individual papers as well as their impregnation with resin can be dispensed with.

Obwohl es seit langem bekannt ist, übliche Schichtstoffplatten auf Holzspanplatten vorzugsweise in den Stärken 8 bis 30 mm ein- oder beidseitig aufzubringen, ist doch bisher offensichtlich nicht der Versuch gellacht worden, eine dünne dekorative Schichtstoffplatte auf Holzträgerbasis herzustellen.Although it has long been known, common laminate boards are based on To apply chipboard, preferably 8 to 30 mm thick, on one or both sides, so far, the attempt has obviously not been laughed at, a thin decorative Produce laminated board on a wooden base.

Die Lösung der vorgenannten Aufgabe ist überraschenderweise gelungen und dadurch gekennzeichnet, daß die Trägerschicht eine etwa 1 bis 5 mm starke Spanplatte mit einem Gehalt an wärmehärtbaren Harzen von etwa 8 bis 35 Gew. % und die Dekorschicht eine ansich bekannte mit einem wärmehärtbaren Harz imprägnierte Papierschicht ist.The solution to the above-mentioned problem has surprisingly been successful and characterized in that the carrier layer is an approximately 1 to 5 mm thick chipboard With a content of thermosetting resins of about 8 to 35% by weight and the decorative layer is a known thermosetting resin impregnated paper layer.

Hierbei hat sich als besonders wichtig der Harzgehalt erwiesen, der von dem üblicher Spanplatten abweicht. Weiterhin war es notwendig, von Spanplatten auszugehen, die normalerweise nicht voll ausgehärtet sind. Andernfalls könnte es bei dem zweimaligen Heizpreßendurchgang unter Druck zu einer ttberhärtung und damit Versprödung des Materials kommen, was eine Zerstörung des Stangefüges zur Folge haben kann.The resin content has proven to be particularly important here differs from the usual chipboard. Furthermore, it was necessary from chipboard that are usually not fully cured. Otherwise it could in the two heat press passes under pressure to over-hardening and thus The material becomes brittle, which results in the rod structure being destroyed may have.

Das Verfahren zur Herstellung der erfindungsgemäßen Schichtstoffplatten ist demgemäß dadurch gekennzeichnet, daß die mit wärmehärtbaren Harzen getränkte Spanplatte nicht voll ausgehärtet ist und mit der Dekorschicht unter einem Druck von 70 bis 120 kp/cm2 und Temperaturen von 120 bis 150 0C verpreßt wird.The process for producing the laminated panels according to the invention is accordingly characterized in that the thermosetting resins impregnated Chipboard is not fully cured and with the decorative layer under a pressure of 70 to 120 kp / cm2 and temperatures of 120 to 150 0C is pressed.

Weitere Merkmale der erfindungsgemäßen dekorativen Schichtstoffplatte ergeben sich aus den Unteransprüchen.Further features of the decorative laminate board according to the invention result from the subclaims.

Der neuartige Aufbau der Dekorschichtstoffplatten erlaubt im übrigen fast alle die Anwendungen, die von bekannten Schichtstoffplatten her geläufig sind. Unter angepaßten Herstellbedingingen ist auch die Verwendung geprägter Preßbleche oder Zulagebogen möglich,um der Dekorschicht eine räumliche Strukturierung zu verleihen. Sofern die Schichtstoffplatte nur einseitig mit Dekorpapier versehen ist, enthält sie auf der anderen Seite ein Gegenzugpapier.The new structure of the decorative laminate panels also allows almost all of the applications that are familiar from known laminate panels. The use of embossed press plates is also subject to adapted manufacturing conditions or additional sheets possible to give the decorative layer a spatial structure. If the laminate board is only provided with decorative paper on one side, contains on the other side a counter paper.

In dem fc;genden Beispiel mit zugehöriger Figur wird der erfindungsgemäße Aufbau der Schichtstoffplatte näher erläutert.In the following example with the associated figure, the inventive Structure of the laminate board explained in more detail.

Dabei ist mit 1 die im Falle des Beispieles einlagig gewählte Dekorschicht bezeichnet, mit 2 der Spanplattenträger und mit 3 das Gegenzugpapier. Selbstverständlich sind insbesondere bei dickeren Spanplatten zwischen 3 bis 5 mm auch Schichtstoffplatten denkbar, die auf beiden Seiten eine Dekorschicht aufweisen und selbsttragend eingesetzt werden. Häufiger ist natürlich die Verwendung einseitig dekorativ ausgestatteter Schichtstoffplatten und deren Aufbringung auf stärkere Trägerplatten etc.In this case, 1 is the decorative layer selected as a single layer in the case of the example denotes, with 2 the chipboard support and with 3 the counter-pulling paper. Of course Laminate panels are also particularly suitable for thicker chipboard between 3 and 5 mm conceivable, which have a decorative layer on both sides and are used in a self-supporting manner will. More often, of course, is the use of one-sided decorative features Laminate panels and their application to thicker carrier panels, etc.

Claims (4)

Patentansprüche Claims Dekorative Schichtstoffplatte mit Träger- und Dekorschicht, dadurch gekennzeichnet, daß die Trägerschicht eine etwa 1 bis 5 mm starke Spanplatte mit einem Gehalt an wärmehärtbaren Harzen von etwa 8 bis 35 Gew. , und die Dekorschicht eine ansich bekannte mit einem wärmehärtbaren Harz imprägnierte Papierschicht ist.Decorative laminate board with carrier and decorative layer, thereby characterized in that the carrier layer is an approximately 1 to 5 mm thick chipboard with a thermosetting resin content of about 8 to 35% by weight, and the decorative layer is a known thermosetting resin impregnated paper layer. 2. Dekorative Schichtstoffplatte nach Anspruch 1, dadurch gekennzeichnet, daß die Dekorschicht neben dem oben aufliegenden Dekorpapier zusätzlich einen oder mehrere Bogen von mit Phenolharz imprägniertem Natronkraftpapier enthält.2. Decorative laminate board according to claim 1, characterized in that that the decorative layer in addition to the decorative paper lying on top also one or contains several sheets of phenolic resin impregnated kraft paper. 3. Dekorative Schichtstoffplatte nach Anspruch 1 oder 2, gekennzeichnet durch ein mit Melaminharz imprägniertes Dekorpapier.3. Decorative laminate board according to claim 1 or 2, characterized through a decorative paper impregnated with melamine resin. 4. Verfahren zur Herstellung der dekorativen Schichtstoffplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die mit wärmehärtbaren Harz getränkte Spanplatte nicht voll ausgehärtet ist und mit der Dekorschicht unter einem Druck von 70 bis 120 kp/cm2 und Temperaturen von 120 bis 150 0C verpreßt wird.4. Process for the production of the decorative laminate board according to one of claims 1 to 3, characterized in that the with thermosetting Resin-soaked chipboard is not fully cured and with the decorative layer underneath a pressure of 70 to 120 kp / cm2 and temperatures of 120 to 150 0C is pressed.
DE2529676A 1975-07-03 1975-07-03 Process for the production of a decorative laminate board Expired DE2529676C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE2529676A DE2529676C2 (en) 1975-07-03 1975-07-03 Process for the production of a decorative laminate board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2529676A DE2529676C2 (en) 1975-07-03 1975-07-03 Process for the production of a decorative laminate board

Publications (2)

Publication Number Publication Date
DE2529676A1 true DE2529676A1 (en) 1977-01-27
DE2529676C2 DE2529676C2 (en) 1984-01-26

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ID=5950567

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2529676A Expired DE2529676C2 (en) 1975-07-03 1975-07-03 Process for the production of a decorative laminate board

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DE (1) DE2529676C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844968A (en) * 1986-04-24 1989-07-04 Swedoor Aktiebolag Heat form pressed product and a method of heat form pressing
WO1999009274A2 (en) * 1997-08-14 1999-02-25 Akzenta Paneele + Profile Gmbh Covering element for building surfaces or the like and method for the production thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE8704034L (en) * 1987-10-16 1989-04-17 Forbo Forshaga Ab DIRECT HIGH PRESSURE LAMINATION

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1052667A (en) * 1963-11-27
DE1008479B (en) * 1954-05-31 1957-05-16 Kuennemeyer Geb Process for preventing the deformation of wood fiber boards or the like provided on one side with a thermosetting synthetic resin coating after hot pressing
DE1912300A1 (en) * 1968-03-11 1969-10-23 Ct Internat Pour L Economie Et Method of manufacturing panels
DE2250238A1 (en) * 1971-10-20 1973-04-26 Emballages De Quevilly Petit Q METHOD AND DEVICE FOR THE PRODUCTION OF MOLDED PARTS FROM COMPRESSED MATERIAL
DE2307905A1 (en) * 1973-02-17 1974-10-10 Goldschmidt Ag Th Surface-finishing esp of wood panels - using polyurethane soft foam impregnated with phenol or amino-plasts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1008479B (en) * 1954-05-31 1957-05-16 Kuennemeyer Geb Process for preventing the deformation of wood fiber boards or the like provided on one side with a thermosetting synthetic resin coating after hot pressing
GB1052667A (en) * 1963-11-27
DE1912300A1 (en) * 1968-03-11 1969-10-23 Ct Internat Pour L Economie Et Method of manufacturing panels
DE2250238A1 (en) * 1971-10-20 1973-04-26 Emballages De Quevilly Petit Q METHOD AND DEVICE FOR THE PRODUCTION OF MOLDED PARTS FROM COMPRESSED MATERIAL
DE2307905A1 (en) * 1973-02-17 1974-10-10 Goldschmidt Ag Th Surface-finishing esp of wood panels - using polyurethane soft foam impregnated with phenol or amino-plasts

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DE-Z: Holz als Roh- u. Werkstoff, 1969, S. 441-463, 1957, S. 62-67 *
DE-Z: Holz-Zentralblatt, 1970, S. 1726,1727 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844968A (en) * 1986-04-24 1989-07-04 Swedoor Aktiebolag Heat form pressed product and a method of heat form pressing
WO1999009274A2 (en) * 1997-08-14 1999-02-25 Akzenta Paneele + Profile Gmbh Covering element for building surfaces or the like and method for the production thereof
WO1999009274A3 (en) * 1997-08-14 1999-04-15 Akzenta Paneele & Profile Gmbh Covering element for building surfaces or the like and method for the production thereof
US6568148B1 (en) 1997-08-14 2003-05-27 Akzenta Paneele + Profile Gmbh Covering element for building surfaces or the like and method for the production thereof

Also Published As

Publication number Publication date
DE2529676C2 (en) 1984-01-26

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: RESOPAL GMBH, 6114 GROSS-UMSTADT, DE

8331 Complete revocation