DE242908C - - Google Patents
Info
- Publication number
- DE242908C DE242908C DENDAT242908D DE242908DA DE242908C DE 242908 C DE242908 C DE 242908C DE NDAT242908 D DENDAT242908 D DE NDAT242908D DE 242908D A DE242908D A DE 242908DA DE 242908 C DE242908 C DE 242908C
- Authority
- DE
- Germany
- Prior art keywords
- train
- lever
- rake
- circuits
- switches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000000391 smoking effect Effects 0.000 description 2
- 210000001364 upper extremity Anatomy 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
- B61L25/00—Recording or indicating positions or identities of vehicles or trains or setting of track apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Train Traffic Observation, Control, And Security (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE242908C true DE242908C (enrdf_load_stackoverflow) |
Family
ID=502077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT242908D Active DE242908C (enrdf_load_stackoverflow) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE242908C (enrdf_load_stackoverflow) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403776A (en) * | 1990-06-25 | 1995-04-04 | Fujitsu Limited | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| US5643831A (en) * | 1994-01-20 | 1997-07-01 | Fujitsu Limited | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device |
| US5959346A (en) * | 1996-11-11 | 1999-09-28 | Fujitsu Limited | Method for fabricating metal bumps onto electronic device |
| US6025258A (en) * | 1994-01-20 | 2000-02-15 | Fujitsu Limited | Method for fabricating solder bumps by forming solder balls with a solder ball forming member |
| US6271110B1 (en) | 1994-01-20 | 2001-08-07 | Fujitsu Limited | Bump-forming method using two plates and electronic device |
| US6319810B1 (en) | 1994-01-20 | 2001-11-20 | Fujitsu Limited | Method for forming solder bumps |
| US6528346B2 (en) | 1994-01-20 | 2003-03-04 | Fujitsu Limited | Bump-forming method using two plates and electronic device |
-
0
- DE DENDAT242908D patent/DE242908C/de active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5403776A (en) * | 1990-06-25 | 1995-04-04 | Fujitsu Limited | Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| US5643831A (en) * | 1994-01-20 | 1997-07-01 | Fujitsu Limited | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device |
| US6025258A (en) * | 1994-01-20 | 2000-02-15 | Fujitsu Limited | Method for fabricating solder bumps by forming solder balls with a solder ball forming member |
| US6271110B1 (en) | 1994-01-20 | 2001-08-07 | Fujitsu Limited | Bump-forming method using two plates and electronic device |
| US6319810B1 (en) | 1994-01-20 | 2001-11-20 | Fujitsu Limited | Method for forming solder bumps |
| US6528346B2 (en) | 1994-01-20 | 2003-03-04 | Fujitsu Limited | Bump-forming method using two plates and electronic device |
| US5959346A (en) * | 1996-11-11 | 1999-09-28 | Fujitsu Limited | Method for fabricating metal bumps onto electronic device |
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