DE2414163A1 - Verfahren zur herstellung von halbleiterbauelementen - Google Patents

Verfahren zur herstellung von halbleiterbauelementen

Info

Publication number
DE2414163A1
DE2414163A1 DE2414163A DE2414163A DE2414163A1 DE 2414163 A1 DE2414163 A1 DE 2414163A1 DE 2414163 A DE2414163 A DE 2414163A DE 2414163 A DE2414163 A DE 2414163A DE 2414163 A1 DE2414163 A1 DE 2414163A1
Authority
DE
Germany
Prior art keywords
semiconductor
semiconductor wafers
spacers
covering
holding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2414163A
Other languages
German (de)
English (en)
Inventor
Tibor Pakoczy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, BBC Brown Boveri AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of DE2414163A1 publication Critical patent/DE2414163A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE2414163A 1974-03-04 1974-03-23 Verfahren zur herstellung von halbleiterbauelementen Withdrawn DE2414163A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH299574A CH570045A5 (enrdf_load_stackoverflow) 1974-03-04 1974-03-04

Publications (1)

Publication Number Publication Date
DE2414163A1 true DE2414163A1 (de) 1975-09-11

Family

ID=4246277

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2414163A Withdrawn DE2414163A1 (de) 1974-03-04 1974-03-23 Verfahren zur herstellung von halbleiterbauelementen
DE19757540835U Expired DE7540835U (de) 1974-03-04 1974-03-23 Halbleiterbauelement

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19757540835U Expired DE7540835U (de) 1974-03-04 1974-03-23 Halbleiterbauelement

Country Status (3)

Country Link
CH (1) CH570045A5 (enrdf_load_stackoverflow)
DE (2) DE2414163A1 (enrdf_load_stackoverflow)
FR (1) FR2263603A1 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
CH570045A5 (enrdf_load_stackoverflow) 1975-11-28
DE7540835U (de) 1976-04-22
FR2263603B1 (enrdf_load_stackoverflow) 1980-11-07
FR2263603A1 (en) 1975-10-03

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Legal Events

Date Code Title Description
OF Willingness to grant licences before publication of examined application
8141 Disposal/no request for examination