FR2263603A1 - Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame - Google Patents

Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame

Info

Publication number
FR2263603A1
FR2263603A1 FR7506520A FR7506520A FR2263603A1 FR 2263603 A1 FR2263603 A1 FR 2263603A1 FR 7506520 A FR7506520 A FR 7506520A FR 7506520 A FR7506520 A FR 7506520A FR 2263603 A1 FR2263603 A1 FR 2263603A1
Authority
FR
France
Prior art keywords
junction
silicone rubber
semiconductor wafers
encapsulating
clamping frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7506520A
Other languages
English (en)
French (fr)
Other versions
FR2263603B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2263603A1 publication Critical patent/FR2263603A1/fr
Application granted granted Critical
Publication of FR2263603B1 publication Critical patent/FR2263603B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR7506520A 1974-03-04 1975-03-03 Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame Granted FR2263603A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH299574A CH570045A5 (enrdf_load_stackoverflow) 1974-03-04 1974-03-04

Publications (2)

Publication Number Publication Date
FR2263603A1 true FR2263603A1 (en) 1975-10-03
FR2263603B1 FR2263603B1 (enrdf_load_stackoverflow) 1980-11-07

Family

ID=4246277

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7506520A Granted FR2263603A1 (en) 1974-03-04 1975-03-03 Encapsulating PN-junction in silicone rubber - by stacking semiconductor wafers with PTFE spacers in clamping frame

Country Status (3)

Country Link
CH (1) CH570045A5 (enrdf_load_stackoverflow)
DE (2) DE2414163A1 (enrdf_load_stackoverflow)
FR (1) FR2263603A1 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
DE2414163A1 (de) 1975-09-11
FR2263603B1 (enrdf_load_stackoverflow) 1980-11-07
CH570045A5 (enrdf_load_stackoverflow) 1975-11-28
DE7540835U (de) 1976-04-22

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Legal Events

Date Code Title Description
ST Notification of lapse