JPS51112264A - Packing material of semiconductor device - Google Patents

Packing material of semiconductor device

Info

Publication number
JPS51112264A
JPS51112264A JP50036792A JP3679275A JPS51112264A JP S51112264 A JPS51112264 A JP S51112264A JP 50036792 A JP50036792 A JP 50036792A JP 3679275 A JP3679275 A JP 3679275A JP S51112264 A JPS51112264 A JP S51112264A
Authority
JP
Japan
Prior art keywords
packing material
semiconductor device
automatized
wrapped
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50036792A
Other languages
Japanese (ja)
Other versions
JPS5243062B2 (en
Inventor
Kazuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036792A priority Critical patent/JPS51112264A/en
Publication of JPS51112264A publication Critical patent/JPS51112264A/en
Publication of JPS5243062B2 publication Critical patent/JPS5243062B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Containers And Plastic Fillers For Packaging (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE:A packing material of a power transistor whose packing process is automatized so that a sheet is folded in a C-shape and wrapped with a lead wire extended between the both ends and the both sides are adhered.
JP50036792A 1975-03-28 1975-03-28 Packing material of semiconductor device Granted JPS51112264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50036792A JPS51112264A (en) 1975-03-28 1975-03-28 Packing material of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036792A JPS51112264A (en) 1975-03-28 1975-03-28 Packing material of semiconductor device

Publications (2)

Publication Number Publication Date
JPS51112264A true JPS51112264A (en) 1976-10-04
JPS5243062B2 JPS5243062B2 (en) 1977-10-28

Family

ID=12479629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036792A Granted JPS51112264A (en) 1975-03-28 1975-03-28 Packing material of semiconductor device

Country Status (1)

Country Link
JP (1) JPS51112264A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012192931A (en) * 2011-03-15 2012-10-11 Fuji Seal International Inc Package wrapped with film, and method of manufacturing the same

Also Published As

Publication number Publication date
JPS5243062B2 (en) 1977-10-28

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