DE2361171A1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number
DE2361171A1
DE2361171A1 DE2361171A DE2361171A DE2361171A1 DE 2361171 A1 DE2361171 A1 DE 2361171A1 DE 2361171 A DE2361171 A DE 2361171A DE 2361171 A DE2361171 A DE 2361171A DE 2361171 A1 DE2361171 A1 DE 2361171A1
Authority
DE
Germany
Prior art keywords
junction
film
semiconductor device
layer
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2361171A
Other languages
German (de)
English (en)
Inventor
Eiichi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2361171A1 publication Critical patent/DE2361171A1/de
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/118Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
DE2361171A 1972-12-08 1973-12-07 Halbleitervorrichtung Pending DE2361171A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47122517A JPS4979782A (enrdf_load_stackoverflow) 1972-12-08 1972-12-08

Publications (1)

Publication Number Publication Date
DE2361171A1 true DE2361171A1 (de) 1974-06-27

Family

ID=14837798

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2361171A Pending DE2361171A1 (de) 1972-12-08 1973-12-07 Halbleitervorrichtung

Country Status (2)

Country Link
JP (1) JPS4979782A (enrdf_load_stackoverflow)
DE (1) DE2361171A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3490241T1 (de) * 1983-05-16 1985-05-15 Sony Corp., Tokio/Tokyo Halbleitervorrichtung
DE3542166A1 (de) * 1985-11-29 1987-06-04 Telefunken Electronic Gmbh Halbleiterbauelement
FR2650122A1 (fr) * 1989-07-21 1991-01-25 Motorola Semiconducteurs Dispositif semi-conducteur a haute tension et son procede de fabrication

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5187115A (en) 1977-12-05 1993-02-16 Plasma Physics Corp. Method of forming semiconducting materials and barriers using a dual enclosure apparatus
JPS567463A (en) * 1979-06-29 1981-01-26 Hitachi Ltd Semiconductor device and its manufacture
JPS59161864A (ja) * 1983-03-04 1984-09-12 Fujitsu Ltd 半導体装置
KR890004495B1 (ko) * 1984-11-29 1989-11-06 가부시끼가이샤 도오시바 반도체 장치

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3490241T1 (de) * 1983-05-16 1985-05-15 Sony Corp., Tokio/Tokyo Halbleitervorrichtung
DE3542166A1 (de) * 1985-11-29 1987-06-04 Telefunken Electronic Gmbh Halbleiterbauelement
US4879586A (en) * 1985-11-29 1989-11-07 Telefunken Electronic Gmbh Semiconductor component
FR2650122A1 (fr) * 1989-07-21 1991-01-25 Motorola Semiconducteurs Dispositif semi-conducteur a haute tension et son procede de fabrication
EP0408868A3 (en) * 1989-07-21 1991-03-20 Motorola Semiconducteurs S.A. High voltage semiconductor device and fabrication process

Also Published As

Publication number Publication date
JPS4979782A (enrdf_load_stackoverflow) 1974-08-01

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