DE215058C - - Google Patents
Info
- Publication number
- DE215058C DE215058C DENDAT215058D DE215058DA DE215058C DE 215058 C DE215058 C DE 215058C DE NDAT215058 D DENDAT215058 D DE NDAT215058D DE 215058D A DE215058D A DE 215058DA DE 215058 C DE215058 C DE 215058C
- Authority
- DE
- Germany
- Prior art keywords
- sides
- open
- soldered
- copper
- end pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
Landscapes
- Measuring Volume Flow (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE215058C true DE215058C (cs) |
Family
ID=476591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT215058D Active DE215058C (cs) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE215058C (cs) |
-
0
- DE DENDAT215058D patent/DE215058C/de active Active
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