DE2144137A1 - Verfahren zum Herstellen der Löcher für die Verbindungen zwischen elektrischen, parallel übereinander liegenden Schaltungslagen einer Mehrlagen-Schaltungspackung - Google Patents
Verfahren zum Herstellen der Löcher für die Verbindungen zwischen elektrischen, parallel übereinander liegenden Schaltungslagen einer Mehrlagen-SchaltungspackungInfo
- Publication number
- DE2144137A1 DE2144137A1 DE19712144137 DE2144137A DE2144137A1 DE 2144137 A1 DE2144137 A1 DE 2144137A1 DE 19712144137 DE19712144137 DE 19712144137 DE 2144137 A DE2144137 A DE 2144137A DE 2144137 A1 DE2144137 A1 DE 2144137A1
- Authority
- DE
- Germany
- Prior art keywords
- dielectric
- layer
- holes
- process according
- irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011888 foil Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 38
- 230000005855 radiation Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 5
- 230000004807 localization Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 3
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 230000007928 solubilization Effects 0.000 claims 1
- 238000005063 solubilization Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 63
- 239000002184 metal Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000003989 dielectric material Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 206010073306 Exposure to radiation Diseases 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US6964670A | 1970-09-04 | 1970-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2144137A1 true DE2144137A1 (de) | 1972-03-09 |
Family
ID=22090315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712144137 Pending DE2144137A1 (de) | 1970-09-04 | 1971-09-03 | Verfahren zum Herstellen der Löcher für die Verbindungen zwischen elektrischen, parallel übereinander liegenden Schaltungslagen einer Mehrlagen-Schaltungspackung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3778900A (enExample) |
| DE (1) | DE2144137A1 (enExample) |
| FR (1) | FR2101773A5 (enExample) |
| GB (1) | GB1326129A (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4008300A (en) * | 1974-10-15 | 1977-02-15 | A & P Products Incorporated | Multi-conductor element and method of making same |
| US4054479A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additive process for producing printed circuit elements using a self-supported photosensitive sheet |
| US4054483A (en) * | 1976-12-22 | 1977-10-18 | E. I. Du Pont De Nemours And Company | Additives process for producing plated holes in printed circuit elements |
| US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
| US4341591A (en) * | 1981-04-08 | 1982-07-27 | Rca Corporation | Method of fabricating a color-selection structure for a CRT |
| US4413051A (en) * | 1981-05-04 | 1983-11-01 | Dynamics Research Corporation | Method for providing high resolution, highly defined, thick film patterns |
| US4487828A (en) * | 1983-06-03 | 1984-12-11 | At&T Technologies, Inc. | Method of manufacturing printed circuit boards |
| DE3477455D1 (en) * | 1984-07-16 | 1989-04-27 | Ibm Deutschland | Manufacture of connection holes in plastic plates and application of the method |
| CA1276972C (en) * | 1986-10-22 | 1990-11-27 | David S. Strong | Multi-cell metal/air battery |
| JP2702507B2 (ja) * | 1988-05-31 | 1998-01-21 | キヤノン株式会社 | 電気的接続部材及びその製造方法 |
| US5216807A (en) * | 1988-05-31 | 1993-06-08 | Canon Kabushiki Kaisha | Method of producing electrical connection members |
| US5807453A (en) * | 1995-05-04 | 1998-09-15 | Tessera, Inc. | Fabrication of leads on semiconductor connection components |
| EP0976307A1 (en) * | 1997-04-16 | 2000-02-02 | AlliedSignal Inc. | Positive working photodefinable resin coated metal for mass production of microvias in multilayer printed wiring boards |
| US6255039B1 (en) | 1997-04-16 | 2001-07-03 | Isola Laminate Systems Corp. | Fabrication of high density multilayer interconnect printed circuit boards |
| US6120693A (en) * | 1998-11-06 | 2000-09-19 | Alliedsignal Inc. | Method of manufacturing an interlayer via and a laminate precursor useful for same |
| US6103134A (en) * | 1998-12-31 | 2000-08-15 | Motorola, Inc. | Circuit board features with reduced parasitic capacitance and method therefor |
| GB2369453B (en) * | 2000-11-24 | 2002-07-31 | Bookham Technology Plc | Fabrication of integrated circuit |
| US6930256B1 (en) * | 2002-05-01 | 2005-08-16 | Amkor Technology, Inc. | Integrated circuit substrate having laser-embedded conductive patterns and method therefor |
| JP2003022850A (ja) * | 2001-07-09 | 2003-01-24 | Tokyo Electron Ltd | フィードスルーの製造方法およびフィードスルー |
| US7670962B2 (en) | 2002-05-01 | 2010-03-02 | Amkor Technology, Inc. | Substrate having stiffener fabrication method |
| US9691635B1 (en) | 2002-05-01 | 2017-06-27 | Amkor Technology, Inc. | Buildup dielectric layer having metallization pattern semiconductor package fabrication method |
| US7548430B1 (en) | 2002-05-01 | 2009-06-16 | Amkor Technology, Inc. | Buildup dielectric and metallization process and semiconductor package |
| US10811277B2 (en) | 2004-03-23 | 2020-10-20 | Amkor Technology, Inc. | Encapsulated semiconductor package |
| US11081370B2 (en) | 2004-03-23 | 2021-08-03 | Amkor Technology Singapore Holding Pte. Ltd. | Methods of manufacturing an encapsulated semiconductor device |
| US7145238B1 (en) | 2004-05-05 | 2006-12-05 | Amkor Technology, Inc. | Semiconductor package and substrate having multi-level vias |
| US8826531B1 (en) | 2005-04-05 | 2014-09-09 | Amkor Technology, Inc. | Method for making an integrated circuit substrate having laminated laser-embedded circuit layers |
| US7589398B1 (en) | 2006-10-04 | 2009-09-15 | Amkor Technology, Inc. | Embedded metal features structure |
| US7752752B1 (en) | 2007-01-09 | 2010-07-13 | Amkor Technology, Inc. | Method of fabricating an embedded circuit pattern |
| US8872329B1 (en) | 2009-01-09 | 2014-10-28 | Amkor Technology, Inc. | Extended landing pad substrate package structure and method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3060076A (en) * | 1957-09-30 | 1962-10-23 | Automated Circuits Inc | Method of making bases for printed electric circuits |
| US3271180A (en) * | 1962-06-19 | 1966-09-06 | Ibm | Photolytic processes for fabricating thin film patterns |
| US3264402A (en) * | 1962-09-24 | 1966-08-02 | North American Aviation Inc | Multilayer printed-wiring boards |
| US3311966A (en) * | 1962-09-24 | 1967-04-04 | North American Aviation Inc | Method of fabricating multilayer printed-wiring boards |
| US3369293A (en) * | 1963-10-29 | 1968-02-20 | Mc Donnell Douglas Corp | Method of manufacturing etched circuitry |
| US3319317A (en) * | 1963-12-23 | 1967-05-16 | Ibm | Method of making a multilayered laminated circuit board |
| US3476561A (en) * | 1965-08-30 | 1969-11-04 | Ibm | Photoetch method |
-
1970
- 1970-09-04 US US00069646A patent/US3778900A/en not_active Expired - Lifetime
-
1971
- 1971-06-22 GB GB2932271A patent/GB1326129A/en not_active Expired
- 1971-07-06 FR FR7126005A patent/FR2101773A5/fr not_active Expired
- 1971-09-03 DE DE19712144137 patent/DE2144137A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1326129A (en) | 1973-08-08 |
| FR2101773A5 (enExample) | 1972-03-31 |
| US3778900A (en) | 1973-12-18 |
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