DE2123308A1 - Elektronischer Verbindungsmodul und Herstellungsverfahren hierfür - Google Patents

Elektronischer Verbindungsmodul und Herstellungsverfahren hierfür

Info

Publication number
DE2123308A1
DE2123308A1 DE19712123308 DE2123308A DE2123308A1 DE 2123308 A1 DE2123308 A1 DE 2123308A1 DE 19712123308 DE19712123308 DE 19712123308 DE 2123308 A DE2123308 A DE 2123308A DE 2123308 A1 DE2123308 A1 DE 2123308A1
Authority
DE
Germany
Prior art keywords
core
connections
connection
wire
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712123308
Other languages
German (de)
English (en)
Inventor
Sergio Antonio South Kent Elmhurst; Chow Weichien Park Forrest; IH.; Kosem Marion Willoughby Hills Ohio; Valach Charles Frank Western Springs Hl.; Alessio (V.St.A.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of DE2123308A1 publication Critical patent/DE2123308A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19712123308 1970-06-22 1971-05-11 Elektronischer Verbindungsmodul und Herstellungsverfahren hierfür Pending DE2123308A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4831770A 1970-06-22 1970-06-22
US23599372A 1972-03-20 1972-03-20

Publications (1)

Publication Number Publication Date
DE2123308A1 true DE2123308A1 (de) 1972-01-05

Family

ID=26726000

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712123308 Pending DE2123308A1 (de) 1970-06-22 1971-05-11 Elektronischer Verbindungsmodul und Herstellungsverfahren hierfür

Country Status (6)

Country Link
US (2) US3703033A (enExample)
CH (1) CH536590A (enExample)
DE (1) DE2123308A1 (enExample)
FR (1) FR2099091A5 (enExample)
GB (1) GB1355241A (enExample)
NL (1) NL7106350A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2326861A1 (de) * 1972-05-25 1973-12-06 Commissariat Energie Atomique Verfahren zum gegenseitigen verbinden von elektronischen mikrobausteinen und nach einem solchen verfahren hergestellte verbindungssubstrate und hybridschaltungen
DE3916485A1 (de) * 1989-05-20 1990-11-22 Aei Ges Fuer Automatik Elektro Kontaktleiste mit federnden kontaktelementen

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2188399B1 (enExample) * 1972-06-09 1976-08-06 Logic Dynamics
US4044397A (en) * 1976-08-12 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Integrated circuit wiring bridge apparatus
FR2424646A1 (fr) * 1978-04-28 1979-11-23 Commissariat Energie Atomique Procede de raccordement de bornes de connexion d'ensembles electriques
JPS6020932Y2 (ja) * 1979-02-05 1985-06-22 日本電気株式会社 半導体装置
US6928707B2 (en) * 2002-11-19 2005-08-16 Hewlett-Packard Development Company, L.P. CCFL wrapped with a heater wire, and machines for manufacturing same
US6757175B1 (en) * 2003-03-27 2004-06-29 International Business Machines Corporation Method and embedded bus bar structure for implementing power distribution

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3185761A (en) * 1963-02-12 1965-05-25 Burroughs Corp Fabricated circuit structure
US3323023A (en) * 1964-07-22 1967-05-30 Motorola Inc Semiconductor apparatus
US3440722A (en) * 1965-04-15 1969-04-29 Electronic Eng Co California Process for interconnecting integrated circuits
US3496634A (en) * 1966-12-30 1970-02-24 Ibm Method of wiring and metal embedding an electrical back panel
US3418535A (en) * 1967-01-23 1968-12-24 Elco Corp Interconnection matrix for dual-in-line packages
US3504592A (en) * 1968-04-08 1970-04-07 Us Navy Electrical connector
US3626086A (en) * 1970-04-28 1971-12-07 Computer Ind Inc Wire-routing system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2326861A1 (de) * 1972-05-25 1973-12-06 Commissariat Energie Atomique Verfahren zum gegenseitigen verbinden von elektronischen mikrobausteinen und nach einem solchen verfahren hergestellte verbindungssubstrate und hybridschaltungen
DE3916485A1 (de) * 1989-05-20 1990-11-22 Aei Ges Fuer Automatik Elektro Kontaktleiste mit federnden kontaktelementen

Also Published As

Publication number Publication date
FR2099091A5 (enExample) 1972-03-10
GB1355241A (en) 1974-06-05
NL7106350A (enExample) 1971-12-24
US3703033A (en) 1972-11-21
US3761770A (en) 1973-09-25
CH536590A (de) 1973-04-30

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Legal Events

Date Code Title Description
OD Request for examination
OHW Rejection