DE2107010A1 - Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen - Google Patents

Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Info

Publication number
DE2107010A1
DE2107010A1 DE19712107010 DE2107010A DE2107010A1 DE 2107010 A1 DE2107010 A1 DE 2107010A1 DE 19712107010 DE19712107010 DE 19712107010 DE 2107010 A DE2107010 A DE 2107010A DE 2107010 A1 DE2107010 A1 DE 2107010A1
Authority
DE
Germany
Prior art keywords
cooling
semiconductor components
heating zone
heat pipe
condensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712107010
Other languages
German (de)
English (en)
Inventor
Gregor Dipl.-Phys. 6901 Dossenheim; Heidtmann Uwe 6901 Nußloch; Müller Elmar Dipl.-Ing. 6508 Alzey Gammel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
Original Assignee
BBC BROWN BOVERI and CIE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE filed Critical BBC BROWN BOVERI and CIE
Priority to DE19712107010 priority Critical patent/DE2107010A1/de
Priority to FR7204623A priority patent/FR2125379B1/fr
Priority to CH202072A priority patent/CH530092A/de
Publication of DE2107010A1 publication Critical patent/DE2107010A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19712107010 1971-02-13 1971-02-13 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen Pending DE2107010A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19712107010 DE2107010A1 (de) 1971-02-13 1971-02-13 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen
FR7204623A FR2125379B1 (cs) 1971-02-13 1972-02-11
CH202072A CH530092A (de) 1971-02-13 1972-02-14 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712107010 DE2107010A1 (de) 1971-02-13 1971-02-13 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
DE2107010A1 true DE2107010A1 (de) 1972-08-17

Family

ID=5798757

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712107010 Pending DE2107010A1 (de) 1971-02-13 1971-02-13 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Country Status (3)

Country Link
CH (1) CH530092A (cs)
DE (1) DE2107010A1 (cs)
FR (1) FR2125379B1 (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4121534A1 (de) * 1990-06-30 1992-01-09 Toshiba Kawasaki Kk Kuehlvorrichtung
DE4121447A1 (de) * 1990-06-29 1992-01-23 Digital Equipment Corp Luftgekuehlter waermeaustauscher fuer vielchip-baugruppen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1406481A (fr) * 1964-01-16 1965-07-23 Materiel Electrique S W Le Dispositif de refroidissement d'au moins un boîtier contenant un élément semiconducteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4121447A1 (de) * 1990-06-29 1992-01-23 Digital Equipment Corp Luftgekuehlter waermeaustauscher fuer vielchip-baugruppen
DE4121534A1 (de) * 1990-06-30 1992-01-09 Toshiba Kawasaki Kk Kuehlvorrichtung
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung

Also Published As

Publication number Publication date
FR2125379A1 (cs) 1972-09-29
FR2125379B1 (cs) 1975-10-24
CH530092A (de) 1972-10-31

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