DE207067C - - Google Patents
Info
- Publication number
- DE207067C DE207067C DENDAT207067D DE207067DA DE207067C DE 207067 C DE207067 C DE 207067C DE NDAT207067 D DENDAT207067 D DE NDAT207067D DE 207067D A DE207067D A DE 207067DA DE 207067 C DE207067 C DE 207067C
- Authority
- DE
- Germany
- Prior art keywords
- ring
- tongue
- pin
- held
- ortscheit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62C—VEHICLES DRAWN BY ANIMALS
- B62C11/00—Safeguarding appliances not otherwise provided for, e.g. for readily releasing unmanageable draught animals
- B62C11/02—Providing for disengaging thills
Landscapes
- Engineering & Computer Science (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Catching Or Destruction (AREA)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE207067C true DE207067C (cs) |
Family
ID=469197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DENDAT207067D Active DE207067C (cs) |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE207067C (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5441286A (en) * | 1992-12-22 | 1995-08-15 | Nordica S.P.A. | Wheel mounting device for inline skates |
| US5481082A (en) * | 1993-07-19 | 1996-01-02 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for die bonding semiconductor element |
-
0
- DE DENDAT207067D patent/DE207067C/de active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5441286A (en) * | 1992-12-22 | 1995-08-15 | Nordica S.P.A. | Wheel mounting device for inline skates |
| US5481082A (en) * | 1993-07-19 | 1996-01-02 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for die bonding semiconductor element |
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