DE2023680C3 - Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben - Google Patents

Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Info

Publication number
DE2023680C3
DE2023680C3 DE19702023680 DE2023680A DE2023680C3 DE 2023680 C3 DE2023680 C3 DE 2023680C3 DE 19702023680 DE19702023680 DE 19702023680 DE 2023680 A DE2023680 A DE 2023680A DE 2023680 C3 DE2023680 C3 DE 2023680C3
Authority
DE
Germany
Prior art keywords
semiconductor body
carrier
arrangement according
contact pads
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19702023680
Other languages
German (de)
English (en)
Other versions
DE2023680A1 (de
DE2023680B2 (de
Inventor
Theo Dipl.-Phys. Freitag
Hanns-Heinz Peltz
Hubert Dipl.- Phys. Pretsch
Detlev Schmitter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19702023680 priority Critical patent/DE2023680C3/de
Priority to DE19702057126 priority patent/DE2057126C3/de
Priority to CH552271A priority patent/CH524247A/de
Priority to AT370971A priority patent/AT321996B/de
Priority to NL7106597A priority patent/NL7106597A/xx
Priority to GB1481571A priority patent/GB1307038A/en
Priority to SE06280/71A priority patent/SE365652B/xx
Priority to CA113024A priority patent/CA938737A/en
Priority to JP3235971A priority patent/JPS55905B1/ja
Priority to FR7117480A priority patent/FR2088564B1/fr
Priority to FR7141084A priority patent/FR2115206B2/fr
Priority to NL7115991A priority patent/NL7115991A/xx
Publication of DE2023680A1 publication Critical patent/DE2023680A1/de
Priority to US380161A priority patent/US3878555A/en
Publication of DE2023680B2 publication Critical patent/DE2023680B2/de
Application granted granted Critical
Publication of DE2023680C3 publication Critical patent/DE2023680C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE19702023680 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben Expired DE2023680C3 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
DE19702023680 DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben
DE19702057126 DE2057126C3 (de) 1970-05-14 1970-11-20 Anordnung und Verfahren zur Kontaktierung von Halbleiterbauelementen
CH552271A CH524247A (de) 1970-05-14 1971-04-16 Anordnung mit Halbleiterbauelementen und einem Träger
AT370971A AT321996B (de) 1970-05-14 1971-04-29 Anordnung zur kontaktierung von halbleiterbauelementen
SE06280/71A SE365652B (US06559137-20030506-C00071.png) 1970-05-14 1971-05-13
GB1481571A GB1307038A (en) 1970-05-14 1971-05-13 Semiconductor arrangements
NL7106597A NL7106597A (US06559137-20030506-C00071.png) 1970-05-14 1971-05-13
JP3235971A JPS55905B1 (US06559137-20030506-C00071.png) 1970-05-14 1971-05-14
FR7117480A FR2088564B1 (US06559137-20030506-C00071.png) 1970-05-14 1971-05-14
CA113024A CA938737A (en) 1970-05-14 1971-05-14 Semiconductor arrangements
FR7141084A FR2115206B2 (US06559137-20030506-C00071.png) 1970-05-14 1971-11-17
NL7115991A NL7115991A (US06559137-20030506-C00071.png) 1970-05-14 1971-11-19
US380161A US3878555A (en) 1970-05-14 1973-07-18 Semiconductor device mounted on an epoxy substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702023680 DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Publications (3)

Publication Number Publication Date
DE2023680A1 DE2023680A1 (de) 1971-11-25
DE2023680B2 DE2023680B2 (de) 1974-12-19
DE2023680C3 true DE2023680C3 (de) 1975-07-24

Family

ID=5771149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702023680 Expired DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Country Status (8)

Country Link
JP (1) JPS55905B1 (US06559137-20030506-C00071.png)
AT (1) AT321996B (US06559137-20030506-C00071.png)
CA (1) CA938737A (US06559137-20030506-C00071.png)
CH (1) CH524247A (US06559137-20030506-C00071.png)
DE (1) DE2023680C3 (US06559137-20030506-C00071.png)
GB (1) GB1307038A (US06559137-20030506-C00071.png)
NL (1) NL7106597A (US06559137-20030506-C00071.png)
SE (1) SE365652B (US06559137-20030506-C00071.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
JPS63193496U (US06559137-20030506-C00071.png) * 1987-05-30 1988-12-13

Also Published As

Publication number Publication date
JPS55905B1 (US06559137-20030506-C00071.png) 1980-01-10
DE2023680A1 (de) 1971-11-25
CA938737A (en) 1973-12-18
GB1307038A (en) 1973-02-14
DE2023680B2 (de) 1974-12-19
AT321996B (de) 1975-04-25
NL7106597A (US06559137-20030506-C00071.png) 1971-11-16
SE365652B (US06559137-20030506-C00071.png) 1974-03-25
CH524247A (de) 1972-06-15

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977