DE20209131U1 - Hybrid-LED - Google Patents

Hybrid-LED

Info

Publication number
DE20209131U1
DE20209131U1 DE20209131U DE20209131U DE20209131U1 DE 20209131 U1 DE20209131 U1 DE 20209131U1 DE 20209131 U DE20209131 U DE 20209131U DE 20209131 U DE20209131 U DE 20209131U DE 20209131 U1 DE20209131 U1 DE 20209131U1
Authority
DE
Germany
Prior art keywords
hybrid led
glass
led according
phosphor
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20209131U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE20209131U priority Critical patent/DE20209131U1/de
Publication of DE20209131U1 publication Critical patent/DE20209131U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt
Der Beschreibungstext wurde nicht elektronisch erfaßt

Claims (7)

1. Hybrid-LED mit einem strahlungsemittierenden Halbleiterkörper (Chip) (2), der mit elektrischen Anschlüssen (3, 4) verbunden ist und von einem Gehäuse umgeben ist, das zumindest einen Grundkörper (6) und eine Kappe (8) umfasst, wobei der Chip (2) auf dem Grundkörper (6), insbesondere in einer Ausnehmung (5) des Grundkör­ pers, sitzt, und wobei die primäre Strahlung des Chips durch ein Konversionsele­ ment zumindest teilweise in längerwellige Strahlung umgewandelt wird, dadurch ge­ kennzeichnet, dass die Kappe (8) durch einen glasartigen Körper gebildet wird, wo­ bei das Konversionsmittel im glasartigen Körper enthalten ist.
2. Hybrid-LED nach Anspruch 1, dadurch gekennzeichnet, dass der glasartige Körper von Glas oder Glaskeramik oder gebildet ist.
3. Hybrid-LED nach Anspruch 1, dadurch gekennzeichnet, dass das Konversionsmittel ein Leuchtstoff (17) ist, der im Körper dispergiert ist.
4. Hybrid-LED nach Anspruch 1, dadurch gekennzeichnet, dass das Konversionsmittel durch Bestandteile eines lumineszierenden Glases gebildet ist.
5. Hybrid-LED nach Anspruch 3, dadurch gekennzeichnet, dass der Leuchtstoff durch einen sog. anorganischen "intercalation" Leuchtstoff gebildet wird.
6. Hybrid-LED nach Anspruch 1, dadurch gekennzeichnet, dass die Ausnehmung mit einem optisch transparenten Medium (19) mit hohem Brechungsindex gefüllt ist.
7. Hybrid-LED nach Anspruch 1, dadurch gekennzeichnet, dass die Kappe (8; 18) op­ tische Eigenschaften besitzt, insbesondere eine Fresneloptik, eine bifokale Linse, eine plankonvexe oder plankonkave Linse aufweist.
DE20209131U 2001-08-03 2002-06-12 Hybrid-LED Expired - Lifetime DE20209131U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20209131U DE20209131U1 (de) 2001-08-03 2002-06-12 Hybrid-LED

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10137641A DE10137641A1 (de) 2001-08-03 2001-08-03 Hybrid-LED
DE20209131U DE20209131U1 (de) 2001-08-03 2002-06-12 Hybrid-LED

Publications (1)

Publication Number Publication Date
DE20209131U1 true DE20209131U1 (de) 2002-10-17

Family

ID=7693962

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10137641A Withdrawn DE10137641A1 (de) 2001-08-03 2001-08-03 Hybrid-LED
DE20209131U Expired - Lifetime DE20209131U1 (de) 2001-08-03 2002-06-12 Hybrid-LED

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10137641A Withdrawn DE10137641A1 (de) 2001-08-03 2001-08-03 Hybrid-LED

Country Status (5)

Country Link
US (1) US20030025449A1 (de)
JP (1) JP3091911U (de)
DE (2) DE10137641A1 (de)
GB (1) GB2381125B (de)
NL (1) NL1021201C1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329081A1 (de) * 2003-05-30 2004-12-30 Osram Opto Semiconductors Gmbh Lumineszenzdiode
WO2006097868A2 (en) * 2005-03-14 2006-09-21 Koninklijke Philips Electronics N.V. Wavelength-converted semiconductor light-emitting device
EP1605526A3 (de) * 2004-06-09 2009-12-30 Philips Lumileds Lighting Company LLC Strahlungsemittierender Halbleiterkörper mit vorgefertigtem Wellenlängenumwandlungselement
US8748923B2 (en) 2005-03-14 2014-06-10 Philips Lumileds Lighting Company Llc Wavelength-converted semiconductor light emitting device

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US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
DE10311820A1 (de) * 2003-03-13 2004-09-30 Schott Glas Halbleiterlichtquelle
EP2264798B1 (de) 2003-04-30 2020-10-14 Cree, Inc. Hochleistungs-Lichtemitter-Verkapselungen mit kompakter Optik
WO2004109813A2 (de) * 2003-05-30 2004-12-16 Osram Opto Semiconductors Gmbh Lumineszenzdiode
JP4120813B2 (ja) * 2003-06-12 2008-07-16 セイコーエプソン株式会社 光学部品およびその製造方法
DE10351397A1 (de) * 2003-10-31 2005-06-16 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
DE102004019802B4 (de) * 2004-03-11 2007-01-25 Schott Ag Verwendung eines lumineszierenden Glases als Konversionsmedium zur Erzeugung von weißem Licht
US11158768B2 (en) 2004-05-07 2021-10-26 Bruce H. Baretz Vacuum light emitting diode
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
WO2006001316A1 (ja) * 2004-06-24 2006-01-05 Ube Industries, Ltd. 白色発光ダイオード装置
US7420162B2 (en) * 2004-06-30 2008-09-02 Siemens Medical Solutions Usa, Inc. Systems and methods for creating stable camera optics
DE102004045947A1 (de) 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
JP4747726B2 (ja) * 2004-09-09 2011-08-17 豊田合成株式会社 発光装置
TWI256149B (en) * 2004-09-27 2006-06-01 Advanced Optoelectronic Tech Light apparatus having adjustable color light and manufacturing method thereof
DE102004048041B4 (de) 2004-09-29 2013-03-07 Schott Ag Verwendung eines Glases oder einer Glaskeramik zur Lichtwellenkonversion
US20060091414A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J LED package with front surface heat extractor
US7329982B2 (en) * 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
EP1880983A4 (de) * 2005-05-11 2008-07-23 Nippon Electric Glass Co Eine fluoreszierende substanz enthaltendes verbundglas, grünscheibe aus eine fluoreszierende substanz enthaltendem verbundglas und verfahren zur herstellung von eine fluoreszierende substanz enthaltendem verbundglas
DE102005023134A1 (de) * 2005-05-19 2006-11-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lumineszenzkonversions-LED
DE102005031523B4 (de) * 2005-06-30 2015-11-05 Schott Ag Halbleiterlichtquelle mit Lichtkonversionsmedium aus Glaskeramik
KR100665222B1 (ko) * 2005-07-26 2007-01-09 삼성전기주식회사 확산재료를 이용한 엘이디 패키지 및 그 제조 방법
DE102006000476A1 (de) * 2005-09-22 2007-05-24 Lexedis Lighting Gesmbh Lichtemissionsvorrichtung
CA2645231A1 (en) 2006-05-02 2007-11-15 Superbulbs, Inc. Heat removal design for led bulbs
US20070257270A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with wedge-shaped optical element
US20070257271A1 (en) * 2006-05-02 2007-11-08 3M Innovative Properties Company Led package with encapsulated converging optical element
US7525126B2 (en) 2006-05-02 2009-04-28 3M Innovative Properties Company LED package with converging optical element
WO2007130357A2 (en) 2006-05-02 2007-11-15 Superbulbs, Inc. Method of light dispersion and preferential scattering of certain wavelengths of light for light-emitting diodes and bulbs constructed therefrom
US8702257B2 (en) 2006-05-02 2014-04-22 Switch Bulb Company, Inc. Plastic LED bulb
US7953293B2 (en) * 2006-05-02 2011-05-31 Ati Technologies Ulc Field sequence detector, method and video device
US7390117B2 (en) * 2006-05-02 2008-06-24 3M Innovative Properties Company LED package with compound converging optical element
DE102006027307B4 (de) * 2006-06-06 2014-08-07 Schott Ag Verfahren zur Herstellung einer Sinterglaskeramik und deren Verwendung
DE102006027306B4 (de) * 2006-06-06 2013-10-17 Schott Ag Verfahren zur Herstellung einer Glaskeramik mit einer Granatphase und Verwendung der danach hergestellten Glaskeramik
US20080012034A1 (en) * 2006-07-17 2008-01-17 3M Innovative Properties Company Led package with converging extractor
WO2009045438A1 (en) 2007-10-03 2009-04-09 Superbulbs, Inc. Glass led light bulbs
US8415695B2 (en) * 2007-10-24 2013-04-09 Switch Bulb Company, Inc. Diffuser for LED light sources
CN101878540B (zh) 2007-11-29 2013-11-06 日亚化学工业株式会社 发光装置及其制造方法
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
JP5311281B2 (ja) * 2008-02-18 2013-10-09 日本電気硝子株式会社 波長変換部材およびその製造方法
US20090261708A1 (en) * 2008-04-21 2009-10-22 Motorola, Inc. Glass-phosphor capping structure for leds
DE102008021438A1 (de) 2008-04-29 2009-12-31 Schott Ag Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle
EP2482351A4 (de) * 2009-09-25 2013-06-05 Oceans King Lighting Science Lichtemittierendes halbleiterbauelement und verkapselungsverfahren dafür
DE102010008605A1 (de) * 2010-02-19 2011-08-25 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauteil
CN102110764A (zh) * 2010-12-17 2011-06-29 深圳雷曼光电科技股份有限公司 一种led及led支架
DE102011081919A1 (de) 2011-08-31 2013-02-28 Automotive Lighting Reutlingen Gmbh Lichtmodul zum Aussenden von Licht und Kraftfahrzeugbeleuchtungseinrichtung mit mindestens einem solchen Lichtmodul
US8591069B2 (en) 2011-09-21 2013-11-26 Switch Bulb Company, Inc. LED light bulb with controlled color distribution using quantum dots
US9365766B2 (en) * 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
DE102017212030A1 (de) * 2017-07-13 2019-01-17 Tridonic Jennersdorf Gmbh LED/LD-Beleuchtungsvorrichtung mit neuartiger Remote-Leuchtstoff-Konfiguration und Verfahren zur Herstellung einer solchen

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329081A1 (de) * 2003-05-30 2004-12-30 Osram Opto Semiconductors Gmbh Lumineszenzdiode
EP1605526A3 (de) * 2004-06-09 2009-12-30 Philips Lumileds Lighting Company LLC Strahlungsemittierender Halbleiterkörper mit vorgefertigtem Wellenlängenumwandlungselement
WO2006097868A2 (en) * 2005-03-14 2006-09-21 Koninklijke Philips Electronics N.V. Wavelength-converted semiconductor light-emitting device
WO2006097868A3 (en) * 2005-03-14 2007-01-18 Koninkl Philips Electronics Nv Wavelength-converted semiconductor light-emitting device
CN101176212B (zh) * 2005-03-14 2010-05-19 飞利浦拉米尔德斯照明设备有限责任公司 波长转换的半导体发光器件
US8748923B2 (en) 2005-03-14 2014-06-10 Philips Lumileds Lighting Company Llc Wavelength-converted semiconductor light emitting device

Also Published As

Publication number Publication date
GB2381125B (en) 2005-08-31
GB2381125A (en) 2003-04-23
DE10137641A1 (de) 2003-02-20
NL1021201C1 (nl) 2003-02-04
JP3091911U (ja) 2003-02-21
US20030025449A1 (en) 2003-02-06
GB0214391D0 (en) 2002-07-31

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