DE202019005337U1 - Radiator und Kühlvorrichtung - Google Patents
Radiator und Kühlvorrichtung Download PDFInfo
- Publication number
- DE202019005337U1 DE202019005337U1 DE202019005337.9U DE202019005337U DE202019005337U1 DE 202019005337 U1 DE202019005337 U1 DE 202019005337U1 DE 202019005337 U DE202019005337 U DE 202019005337U DE 202019005337 U1 DE202019005337 U1 DE 202019005337U1
- Authority
- DE
- Germany
- Prior art keywords
- ribs
- radiator
- projections
- protrusions
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims description 16
- 239000000110 cooling liquid Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 16
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 description 24
- 239000000463 material Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000005452 bending Methods 0.000 description 9
- 238000004080 punching Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RQMIWLMVTCKXAQ-UHFFFAOYSA-N [AlH3].[C] Chemical compound [AlH3].[C] RQMIWLMVTCKXAQ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018221422A JP7178246B2 (ja) | 2018-11-27 | 2018-11-27 | 放熱器、冷却装置 |
| JP2018-221422 | 2018-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE202019005337U1 true DE202019005337U1 (de) | 2020-07-31 |
Family
ID=70827698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE202019005337.9U Active DE202019005337U1 (de) | 2018-11-27 | 2019-11-25 | Radiator und Kühlvorrichtung |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7178246B2 (ja) |
| CN (1) | CN111223825A (ja) |
| DE (1) | DE202019005337U1 (ja) |
| TW (1) | TWI818106B (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7537199B2 (ja) | 2020-09-15 | 2024-08-21 | 株式会社レゾナック | 放熱器、冷却装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163388A (ja) * | 1996-11-28 | 1998-06-19 | Hokusa:Kk | ヒートシンクおよびその製造方法 |
| TW487298U (en) * | 2000-12-19 | 2002-05-11 | Global Win Technology Co Ltd | Non-uniform heat dissipation fins |
| EP1328019A1 (en) * | 2002-01-10 | 2003-07-16 | Wen-Chen Wei | Leaf piece structure for heat dissipater |
| JP3799477B2 (ja) * | 2003-12-12 | 2006-07-19 | ソニー株式会社 | 放熱フィン、冷却装置、電子機器及び冷却装置の製造方法 |
| CN101528018A (zh) * | 2008-03-07 | 2009-09-09 | 富准精密工业(深圳)有限公司 | 散热装置及其制造方法 |
| CN201199769Y (zh) * | 2008-04-22 | 2009-02-25 | 鸿富锦精密工业（深圳）有限公司 | 散热器 |
| JP5342392B2 (ja) | 2009-09-28 | 2013-11-13 | 古河電気工業株式会社 | 冷却装置 |
| CN202103993U (zh) * | 2011-03-17 | 2012-01-04 | 广达电脑股份有限公司 | 散热鳍片组件及其散热组件 |
| US20130000872A1 (en) * | 2011-06-29 | 2013-01-03 | Chun-Hung Lin | Fin Heat Sink with Improved Structure and Processing Method Thereof |
| CN102917566A (zh) | 2011-08-01 | 2013-02-06 | 富瑞精密组件（昆山）有限公司 | 散热器 |
| US20170273169A1 (en) * | 2014-09-24 | 2017-09-21 | Hewlett Packard Enterprise Development Lp | Heat sink with a load spreading bar |
| US20160227668A1 (en) * | 2015-01-31 | 2016-08-04 | Aic Inc. | Cooling module and heat sink |
| JP6548193B2 (ja) * | 2016-07-01 | 2019-07-24 | 有限会社和氣製作所 | フィン部材および温度調節装置並びにこれらの製造方法 |
-
2018
- 2018-11-27 JP JP2018221422A patent/JP7178246B2/ja active Active
-
2019
- 2019-10-24 TW TW108138424A patent/TWI818106B/zh active
- 2019-11-25 DE DE202019005337.9U patent/DE202019005337U1/de active Active
- 2019-11-26 CN CN201911170449.1A patent/CN111223825A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TWI818106B (zh) | 2023-10-11 |
| CN111223825A (zh) | 2020-06-02 |
| JP7178246B2 (ja) | 2022-11-25 |
| JP2020088198A (ja) | 2020-06-04 |
| TW202021072A (zh) | 2020-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification | ||
| R150 | Utility model maintained after payment of first maintenance fee after three years | ||
| R081 | Change of applicant/patentee |
Owner name: RESONAC CORPORATION, JP Free format text: FORMER OWNER: SHOWA DENKO K.K., TOKYO, JP |