DE202010004870U1 - LED matrix - Google Patents
LED matrix Download PDFInfo
- Publication number
- DE202010004870U1 DE202010004870U1 DE202010004870U DE202010004870U DE202010004870U1 DE 202010004870 U1 DE202010004870 U1 DE 202010004870U1 DE 202010004870 U DE202010004870 U DE 202010004870U DE 202010004870 U DE202010004870 U DE 202010004870U DE 202010004870 U1 DE202010004870 U1 DE 202010004870U1
- Authority
- DE
- Germany
- Prior art keywords
- led
- circuit board
- triangular
- printed circuit
- led module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
LED-Modul bestehend aus mehreren auf einer Leiterplatte (75) angeordneten LED (76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89), welche jeweils eine sogenannte Einbettung mit einer Linse (100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113) aufweisen, mit welchen die jeweilige LED (76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89) aus der Leiterplattenebene vorsteht, dadurch gekennzeichnet, dass die Leiterplatte (75, 75/1) eine dreiecksförmige oder trapezförmige Grundform aufweist.LED module consisting of several on a circuit board (75) arranged LED (76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89), each having a so-called embedding with a lens (100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113), with which the respective LED (76, 77, 78, 79, 80, 81 , 82, 83, 84, 85, 86, 87, 88, 89) protrudes from the circuit board plane, characterized in that the circuit board (75, 75/1) has a triangular or trapezoidal basic shape.
Description
LED-Modul bestehend aus mehreren auf einer Leiterplatte angeordneten LED, welche jeweils eine sogenannte Einbettung mit einer Linse aufweisen, mit welcher die jeweilige LED aus der Leiterplattenebene vorsteht.LED module consisting of several LEDs arranged on a printed circuit board, each having a so-called embedding with a lens, with which the respective LED protrudes from the PCB level.
Lichtquellen bestehend aus mehreren auf einer Leiterplatte angeordneten LED sind schon seit geraumer Zeit bekannt. Eine solche LED besteht aus einem Anoden-Anschluss, einem Kathoden-Anschluss, sowie einem ”Napf”, in welchen ein LED-Kristall eingesetzt ist. Dieser LED-Kristall steht über einen Bonddraht mit dem Anoden-Anschluss in Verbindung. Zum Schutz sowohl des Kathoden-Anschlusses als auch des Anoden-Anschlusses sowie des LED-Kristalls sind diese Bauteile in eine sog. ”Einbettung” eingebettet, welche in der Regel aus einem Kunststoff besteht. Diese Einbettung bildet in der Regel eine Art Linse, so dass der vom LED-Kristall emittierte Lichtstrahl möglichst großflächig abgestrahlt wird, um eine Blendwirkung des Betrachters möglichst zu verringern.light sources consisting of several arranged on a circuit board LED are been known for some time. Such an LED consists of a Anode terminal, a cathode terminal, as well as a "bowl" in which an LED crystal is used. This LED crystal stands above a bonding wire to the anode terminal in connection. To protect both the cathode terminal and the anode terminal as well as the LED crystal, these components are embedded in a so-called "embedding", which usually consists of a plastic. This embedding usually forms a kind of lens, so that of the LED crystal emitted light beam as possible radiated over a large area is to reduce the glare of the observer as possible.
Da solche LED zwischenzeitlich eine auch für Beleuchtungszwecke ausreichende Lichtstärke aufweisen, ist man in jüngster Zeit vermehrt dazu übergegangen, solche LED auch für Leuchten verschiedenster Art einzusetzen. Insbe sondere ist es bekannt, solche LED auf einer langgestreckten Platine mehrfach hintereinander anzuordnen und diese Platine zusammen mit den LED in einem gemeinsamen Gehäuse unterzubringen.There Such LED in the meantime also sufficient for lighting purposes Have light intensity, you are youngest Time has increasingly passed such LED also for Use lights of various kinds. In particular special it is known such LED on an elongated board several times in a row to arrange and place this board together with the LED in a common casing accommodate.
Des Weiteren sind auch LED-Anordnungen bekannt, bei welchen die LED etwa kreisförmig angeordnet sind. Solche Anordnungen sind in der Regel für den Einsatz beispielsweise in einer Taschenlampe vorgesehen. Hier werden diese LED lediglich durch eine klare Scheibe des Leuchtkopfes der Taschenlampe abgedeckt, so dass sich deren Lichtströme gegenseitig überdecken. Die Lichtverteilung ergibt sich hier durch die Ausgestaltung der Linse der LED selbst.Of Furthermore, LED arrangements are also known in which the LED approximately circular are arranged. Such arrangements are usually for use for example, provided in a flashlight. Here are these LED only through a clear lens of the flashlight covered, so that their luminous flux cover each other. The light distribution results here by the design of the Lens of the LED itself.
D. h., dass nach dem Stand der Technik die Leiterplatte mit den darauf angeordneten LED stets an die Form der Leuchte angepasst sind und somit stets nur für bestimmte Einsatzzwecke geeignet sind.D. h., That in the prior art, the circuit board with the on it arranged LED are always adapted to the shape of the lamp and thus always only for certain purposes are suitable.
Demgemäß liegt der Erfindung die Aufgabe zugrunde, ein LED-Modul bestehend aus mehreren auf einer Leiterplatte angeordneten LED zur Verfügung zu stellen, welches variabel für unterschiedliche Einsatzzwecke einsetzbar ist.Accordingly, lies The invention is based on the object, an LED module consisting of several arranged on a printed circuit board LED available which variable for different purposes can be used.
Die Aufgabe wird erfindungsgemäß zusammen mit den Merkmalen des Oberbegriffes des Anspruches 1 dadurch gelöst, dass die Leiterplatte eine dreiecksförmige oder trapezförmige Grundform aufweist.The Task is inventively together solved with the features of the preamble of claim 1, characterized in that the circuit board is a triangular or trapezoidal Basic shape has.
Durch diese Ausgestaltung der Leiterplatte kann diese mit gleichartigen Leiterplatten ”beliebig” bezüglich der erreichbaren äußeren Formgebung kombiniert werden. Durch die Dreiecks- oder Trapezform können die LED-Module in strangförmiger und/oder ringförmiger Anordnung miteinander kombiniert werden. Werden ”nur” zwei dreieckige Leiterplatten ”aneinandergelegt” so entsteht ein vergrößertes etwa viereckiges ausgebildete LED-Modul mit größerer Leuchtstärke, bei noch gleichzeitig relativ geringem Platzbedarf. Es ist erkennbar, dass durch die Grundformen der Leiterplatten diese an die jeweils vorhandene Formgebung eines Lampengehäuses anpassbar und somit äußerst variabel einsetzbar sind.By this embodiment of the circuit board can this with similar Circuit boards "arbitrary" with respect to achievable outer shape combined become. Due to the triangular or trapezoidal shape, the LED modules in strand-shaped and / or annular Arrangement can be combined with each other. If "only" two triangular circuit boards "put together" so arises an enlarged example Square shaped LED module with greater luminosity, at still at the same time relatively little space. It is recognizable that by the basic forms of the circuit boards these to each existing shape of a lamp housing customizable and thus extremely variable can be used.
In Anpassung an die äußere Grundform der Leiterplatte kann gemäß Anspruch 2 vorgesehen sein, dass die LED in einer dreiecksförmigen oder trapezförmigen Matrix auf der Leiterplatte angeordnet sind. Damit ist insbesondere ein gleichmäßige Lichtverteilung durch ein solches LED-Modul erreichbar.In Adaptation to the outer basic form the circuit board can according to claim 2 be provided that the LED in a triangular or trapezoidal matrix are arranged on the circuit board. This is especially one even light distribution reachable by such a LED module.
Weiter können die Kanten der Leiterplatte unter einem Winkel von vorzugsweise 30, 60° oder 120° zueinander verlaufen. Durch diese Ausgestaltung sind die Leiterplatten zu unterschiedlich gestalteten Gesamtformen miteinander kombinierbar.Further can the edges of the circuit board at an angle of preferably 30, 60 ° or 120 ° to each other run. By this configuration, the circuit boards are too different designed overall shapes can be combined.
Anhand der Zeichnung wird nachfolgend die Erfindung beispielhaft näher erläutert. Es zeigt:Based the drawing, the invention is explained in more detail by way of example in the following. It shows:
Des
Weiteren weist die Leiterplatte
Im
montierten Zustand ragen die LED
Des
Weiteren ist aus
Die äußeren Begrenzungskanten
der Leiterplatte
Steht
ein geringerer Einbauraum zur Verfügung, so können auch lediglich nur zwei
Leiterplatte
Ist
ein stabförmiges
bzw. langgestrecktes Leuchtengehäuse
mit LED zu bestücken,
so können mehrere
Leiterplatten
Auch
ist eine trapezförmige
Ausgestaltung einer Leiterplatte
Durch
die erfindungsgemäße Formgebung der
Leiterplatte
Claims (3)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202010004870U DE202010004870U1 (en) | 2010-04-11 | 2010-04-11 | LED matrix |
JP2011084155A JP2011222514A (en) | 2010-04-11 | 2011-04-06 | Led lighting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202010004870U DE202010004870U1 (en) | 2010-04-11 | 2010-04-11 | LED matrix |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202010004870U1 true DE202010004870U1 (en) | 2010-07-29 |
Family
ID=42372109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202010004870U Expired - Lifetime DE202010004870U1 (en) | 2010-04-11 | 2010-04-11 | LED matrix |
Country Status (1)
Country | Link |
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DE (1) | DE202010004870U1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011012132B3 (en) * | 2011-02-24 | 2012-06-28 | Schmalenberger Gmbh & Co. Kg | Underwater spotlight for use in walls of swimming pools, has housing in which light modules are arranged, where circumferential edge of modules is formed in polygonal-shape and sides of modules are formed in same length along its edges |
EP2640171A3 (en) * | 2012-01-30 | 2014-03-05 | Siteco Beleuchtungstechnik GmbH | Circuit board with a regular LED assembly |
DE102014104339A1 (en) * | 2014-03-27 | 2015-10-01 | Osram Gmbh | Central brightening element for LED lights |
JP2016015352A (en) * | 2011-01-11 | 2016-01-28 | 東芝ライテック株式会社 | Lighting fixture |
WO2017076575A1 (en) * | 2015-11-03 | 2017-05-11 | TRüTZSCHLER GMBH & CO. KG | Lighting unit for a device for identifying foreign parts during preparation for the spinning process |
CN113115514A (en) * | 2021-04-12 | 2021-07-13 | 深圳市科彤科技有限公司 | COB display panel protective structure |
-
2010
- 2010-04-11 DE DE202010004870U patent/DE202010004870U1/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016015352A (en) * | 2011-01-11 | 2016-01-28 | 東芝ライテック株式会社 | Lighting fixture |
DE102011012132B3 (en) * | 2011-02-24 | 2012-06-28 | Schmalenberger Gmbh & Co. Kg | Underwater spotlight for use in walls of swimming pools, has housing in which light modules are arranged, where circumferential edge of modules is formed in polygonal-shape and sides of modules are formed in same length along its edges |
EP2640171A3 (en) * | 2012-01-30 | 2014-03-05 | Siteco Beleuchtungstechnik GmbH | Circuit board with a regular LED assembly |
DE102014104339A1 (en) * | 2014-03-27 | 2015-10-01 | Osram Gmbh | Central brightening element for LED lights |
DE102014104339B4 (en) * | 2014-03-27 | 2017-06-08 | Osram Gmbh | Central brightening element for LED lights |
WO2017076575A1 (en) * | 2015-11-03 | 2017-05-11 | TRüTZSCHLER GMBH & CO. KG | Lighting unit for a device for identifying foreign parts during preparation for the spinning process |
CN113115514A (en) * | 2021-04-12 | 2021-07-13 | 深圳市科彤科技有限公司 | COB display panel protective structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20100902 |
|
R163 | Identified publications notified |
Effective date: 20110218 |
|
R156 | Lapse of ip right after 3 years |
Effective date: 20131101 |