DE202009018428U1 - Vorrichtung zum Vorbehandeln und Beschichten von Körpern - Google Patents

Vorrichtung zum Vorbehandeln und Beschichten von Körpern Download PDF

Info

Publication number
DE202009018428U1
DE202009018428U1 DE202009018428U DE202009018428U DE202009018428U1 DE 202009018428 U1 DE202009018428 U1 DE 202009018428U1 DE 202009018428 U DE202009018428 U DE 202009018428U DE 202009018428 U DE202009018428 U DE 202009018428U DE 202009018428 U1 DE202009018428 U1 DE 202009018428U1
Authority
DE
Germany
Prior art keywords
hppms
magnetron
electrode
magnetrons
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202009018428U
Other languages
German (de)
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cemecon AG
Original Assignee
Cemecon AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cemecon AG filed Critical Cemecon AG
Priority to DE202009018428U priority Critical patent/DE202009018428U1/de
Publication of DE202009018428U1 publication Critical patent/DE202009018428U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3444—Associated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3473—Composition uniformity or desired gradient

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
DE202009018428U 2008-04-28 2009-04-28 Vorrichtung zum Vorbehandeln und Beschichten von Körpern Expired - Lifetime DE202009018428U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE202009018428U DE202009018428U1 (de) 2008-04-28 2009-04-28 Vorrichtung zum Vorbehandeln und Beschichten von Körpern

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008021128.1 2008-04-28
DE102008021128 2008-04-28
DE202009018428U DE202009018428U1 (de) 2008-04-28 2009-04-28 Vorrichtung zum Vorbehandeln und Beschichten von Körpern

Publications (1)

Publication Number Publication Date
DE202009018428U1 true DE202009018428U1 (de) 2011-09-28

Family

ID=40885977

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202009018428U Expired - Lifetime DE202009018428U1 (de) 2008-04-28 2009-04-28 Vorrichtung zum Vorbehandeln und Beschichten von Körpern

Country Status (6)

Country Link
US (1) US9812299B2 (enExample)
EP (1) EP2272080B1 (enExample)
JP (1) JP5448232B2 (enExample)
CN (1) CN102027564B (enExample)
DE (1) DE202009018428U1 (enExample)
WO (1) WO2009132822A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014008984A1 (de) * 2012-07-10 2014-01-16 Oerlikon Trading Ag, Trübbach Hochleistungsimpulsbeschichtungsmethode

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008050499B4 (de) 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substrate
DE202010001497U1 (de) * 2010-01-29 2010-04-22 Hauzer Techno-Coating B.V. Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle
JP5765627B2 (ja) * 2010-09-27 2015-08-19 日立金属株式会社 耐久性に優れる被覆工具およびその製造方法
DE102011117177A1 (de) 2011-10-28 2013-05-02 Oerlikon Trading Ag, Trübbach Verfahren zur Bereitstellung sequenzieller Leistungspulse
HUE025643T2 (en) * 2011-04-20 2016-04-28 Oerlikon Surface Solutions Ag Truebbach Procedure for securing successive power pulses
BRPI1102335A2 (pt) 2011-05-27 2013-06-25 Mahle Metal Leve Sa elemento dotado de pelo menos uma superfÍcie de deslizamento com um revestimento para uso em um motor de combustço interna ou em um compressor
EP2761050B1 (en) * 2011-09-30 2021-08-25 CemeCon AG Coating of substrates using hipims
DE102011117994A1 (de) * 2011-11-09 2013-05-16 Oerlikon Trading Ag, Trübbach HIPIMS-Schichten
JP5344204B2 (ja) * 2012-03-05 2013-11-20 三菱マテリアル株式会社 表面被覆切削工具
US9264150B2 (en) * 2012-03-28 2016-02-16 Globalfoundries Inc. Reactive metal optical security device and methods of fabrication and use
US9126273B2 (en) 2012-12-17 2015-09-08 Kennametal Inc Tool for the cutting machining of workpieces and process for coating substrate bodies
EP2784799B1 (en) * 2013-03-28 2022-12-21 CemeCon AG Dense, hard coatings on substrates using HIPIMS
DE102013106351A1 (de) * 2013-06-18 2014-12-18 Innovative Ion Coatings Ltd. Verfahren zur Vorbehandlung einer zu beschichtenden Oberfläche
US9677168B2 (en) 2013-10-08 2017-06-13 TPK America, LLC Touch panel and method for manufacturing the same
US20150354054A1 (en) * 2014-06-06 2015-12-10 Applied Materials, Inc. Cooled process tool adapter for use in substrate processing chambers
FR3025929B1 (fr) * 2014-09-17 2016-10-21 Commissariat Energie Atomique Gaines de combustible nucleaire, procedes de fabrication et utilisation contre l'oxydation.
DE102014115492A1 (de) 2014-10-24 2016-04-28 Cemecon Ag Verfahren und Vorrichtung zur Erzeugung einer elektronischen Entladung
US9812305B2 (en) * 2015-04-27 2017-11-07 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
US11049702B2 (en) 2015-04-27 2021-06-29 Advanced Energy Industries, Inc. Rate enhanced pulsed DC sputtering system
KR102369132B1 (ko) * 2015-11-10 2022-02-28 산드빅 인터렉츄얼 프로퍼티 에이비 코팅용 표면을 전처리하는 방법
BR112018009585B1 (pt) 2015-11-12 2022-12-27 Oerlikon Surface Solutions Ag, Pfãffikon Arranjo de pulverização e método de pulverização para distribuição otimizada do fluxo de energia
US10612132B2 (en) 2015-11-27 2020-04-07 Cemecon Ag Coating a body with a diamond layer and a hard material layer
US20180108519A1 (en) * 2016-10-17 2018-04-19 Applied Materials, Inc. POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)
KR101885123B1 (ko) * 2017-03-31 2018-08-03 한국알박(주) 마그네트론 스퍼터링 장치의 자석 제어 시스템
CN109112496B (zh) * 2018-09-26 2020-11-24 武汉华星光电半导体显示技术有限公司 磁控溅射设备及去除基板上氧化层的方法
DE102019124616A1 (de) 2019-09-12 2021-03-18 Cemecon Ag Mehrlagige Beschichtung
WO2021215953A1 (ru) * 2020-04-20 2021-10-28 Акционерное Общество "Твэл" Способ ионно-плазменного нанесения коррозионностойких пленочных покрытий на изделия из циркониевых сплавов
CN112708854A (zh) * 2020-12-19 2021-04-27 合肥开泰机电科技有限公司 一种用于大面积钎焊的真空镀膜结构
WO2023099757A1 (en) * 2021-12-03 2023-06-08 Université De Namur A process for depositing a coating on a substrate by means of pvd methods and the coating obtained by said process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998040632A1 (en) 1997-03-11 1998-09-17 Alec Campbell James A support device
WO1998040532A1 (en) 1997-03-11 1998-09-17 Chemfilt R & D Aktiebolag A method and apparatus for magnetically enhanced sputtering
EP1609882A1 (de) 2004-06-24 2005-12-28 METAPLAS IONON Oberflächenveredelungstechnik GmbH Kathodenzerstäubungsvorrichtung und -verfahren

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635811A (en) * 1967-11-06 1972-01-18 Warner Lambert Co Method of applying a coating
US4098452A (en) * 1975-03-31 1978-07-04 General Electric Company Lead bonding method
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US5962923A (en) * 1995-08-07 1999-10-05 Applied Materials, Inc. Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches
WO1998046807A1 (en) * 1997-04-14 1998-10-22 Cemecon-Ceramic Metal Coatings-Dr.-Ing. Antonius Leyendecker Gmbh Method and device for pvd coating
US20020046944A1 (en) * 2000-06-28 2002-04-25 Ehood Geva Method and apparatus for reducing noise in a sputtering chamber
SE525231C2 (sv) 2001-06-14 2005-01-11 Chemfilt R & D Ab Förfarande och anordning för att alstra plasma
JP4101554B2 (ja) * 2001-08-17 2008-06-18 株式会社神戸製鋼所 スパッタ装置及び方法
US7172681B2 (en) * 2003-02-05 2007-02-06 Bridgestone Corporation Process for producing rubber-based composite material
DE10318364A1 (de) * 2003-04-23 2004-11-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Einrichtung zum Beschichten eines stationär angeordneten Substrats durch Puls-Magnetron-Sputtern
US7663319B2 (en) 2004-02-22 2010-02-16 Zond, Inc. Methods and apparatus for generating strongly-ionized plasmas with ionizational instabilities
SE0402644D0 (sv) * 2004-11-02 2004-11-02 Biocell Ab Method and apparatus for producing electric discharges
JP2006161088A (ja) * 2004-12-06 2006-06-22 Canon Inc スパッタ装置
US20060260938A1 (en) * 2005-05-20 2006-11-23 Petrach Philip M Module for Coating System and Associated Technology
DE102005033769B4 (de) 2005-07-15 2009-10-22 Systec System- Und Anlagentechnik Gmbh & Co.Kg Verfahren und Vorrichtung zur Mehrkathoden-PVD-Beschichtung und Substrat mit PVD-Beschichtung
DE102006017382A1 (de) * 2005-11-14 2007-05-16 Itg Induktionsanlagen Gmbh Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen
GB0608582D0 (en) 2006-05-02 2006-06-07 Univ Sheffield Hallam High power impulse magnetron sputtering vapour deposition
DE102006021994B4 (de) * 2006-05-10 2017-08-03 Cemecon Ag Beschichtungsverfahren

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998040632A1 (en) 1997-03-11 1998-09-17 Alec Campbell James A support device
WO1998040532A1 (en) 1997-03-11 1998-09-17 Chemfilt R & D Aktiebolag A method and apparatus for magnetically enhanced sputtering
US6296742B1 (en) 1997-03-11 2001-10-02 Chemfilt R & D Aktiebolag Method and apparatus for magnetically enhanced sputtering
EP1609882A1 (de) 2004-06-24 2005-12-28 METAPLAS IONON Oberflächenveredelungstechnik GmbH Kathodenzerstäubungsvorrichtung und -verfahren

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
D. J. Christie erläutert in "Target material pathways model for high Power pulsed magnetron sputtering" in J. Vac. Sci. Tech. A, 23(2) (2005) 330

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014008984A1 (de) * 2012-07-10 2014-01-16 Oerlikon Trading Ag, Trübbach Hochleistungsimpulsbeschichtungsmethode
US10060026B2 (en) 2012-07-10 2018-08-28 Oerlikon Surface Solutions Ag, Pfäffikon High-power pulse coating method

Also Published As

Publication number Publication date
CN102027564B (zh) 2013-05-22
CN102027564A (zh) 2011-04-20
US20110180389A1 (en) 2011-07-28
JP2011518950A (ja) 2011-06-30
EP2272080A2 (de) 2011-01-12
US9812299B2 (en) 2017-11-07
EP2272080B1 (de) 2012-08-01
WO2009132822A2 (de) 2009-11-05
JP5448232B2 (ja) 2014-03-19
WO2009132822A3 (de) 2010-01-21

Similar Documents

Publication Publication Date Title
EP2272080B1 (de) Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern
DE102008021912C5 (de) Beschichtungsverfahren
EP0755461B1 (de) Verfahren und einrichtung für die ionengestützte vakuumbeschichtung
DE19702187C2 (de) Verfahren und Einrichtung zum Betreiben von Magnetronentladungen
EP2529386A1 (de) Beschichtungsvorrichtung mit einer hipims-leistungsquelle
EP2439763B1 (de) Magnetron-Vorrichtung und Verfahren zum gepulsten Betreiben einer Magnetron-Vorrichtung
EP2175044B1 (de) PVD-Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens und nach dem Verfahren beschichtete Substanzen
DE4228499C1 (de) Verfahren und Einrichtung zur plasmagestützten Beschichtung von Substraten
DE102016116762B4 (de) Verfahren zum Abscheiden einer Schicht mittels einer Magnetronsputtereinrichtung
DE19753684C1 (de) Einrichtung zur Behandlung von Werkstücken in einem Niederdruck-Plasma
DE102006021994B4 (de) Beschichtungsverfahren
DE102008022145B4 (de) Vorrichtung und Verfahren zum Hochleistungs-Puls-Gasfluß-Sputtern
EP0725161B1 (de) Verfahren zur Plasmabehandlung von Werkstücken
EP3900010B1 (de) Elektrodenanordnung für eine plasmaquelle zur durchführung von plasmabehandlungen
DE102020124032A1 (de) Beschichtungsvorrichtung und Beschichtungsverfahren mit unterteilten Pulsen
DE102010007516A1 (de) Großflächige Kathode für Plasmaprozesse mit hohem Ionisierungsgrad
WO2003105543A2 (de) Verfahren und einrichtung zur reduzierung der zündspannung von plasmen
DE102012111186A1 (de) Verfahren und Vorrichtung zum Erzeugen einer Magnetron-Entladung
DE102012107163A1 (de) Verfahren zur Beschichtung eines Substrats mittels Hochenergieimpulsmagnetronsputtern
EP3283664B1 (de) Bipolares arc-beschichtungsverfahren
DE102013106351A1 (de) Verfahren zur Vorbehandlung einer zu beschichtenden Oberfläche
DE102010007515A1 (de) Verfahren zum Betreiben einer großflächigen Kathode für Plasmaprozesse mit hohem Ionisierungsgrad
DE102008060838A1 (de) Beschichtungsverfahren, Vorrichtung zur Durchführung des Verfahrens
DE102014105414A1 (de) Verfahren zum Erzeugen eines Plasmas
DE102004012847A1 (de) Vorrichtung zum Plasmaätzen von flächenbehafteten Objekten mit hoher Abtragsrate

Legal Events

Date Code Title Description
R074 Re-establishment allowed
R409 Internal rectification of the legal status completed
R074 Re-establishment allowed
R409 Internal rectification of the legal status completed
R207 Utility model specification

Effective date: 20120119

R150 Utility model maintained after payment of first maintenance fee after three years
R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20120508

R082 Change of representative

Representative=s name: KALKOFF & PARTNER PATENTANWAELTE, DE

Representative=s name: ,

R157 Lapse of ip right after 6 years
R082 Change of representative

Representative=s name: KALKOFF & PARTNER PATENTANWAELTE MBB, DE

Representative=s name: KALKOFF & PARTNER PATENTANWAELTE, DE