DE2015643A1 - Verfahren zur Herstellung von Mehrschi cht-Stromkreispaneelen - Google Patents
Verfahren zur Herstellung von Mehrschi cht-StromkreispaneelenInfo
- Publication number
- DE2015643A1 DE2015643A1 DE19702015643 DE2015643A DE2015643A1 DE 2015643 A1 DE2015643 A1 DE 2015643A1 DE 19702015643 DE19702015643 DE 19702015643 DE 2015643 A DE2015643 A DE 2015643A DE 2015643 A1 DE2015643 A1 DE 2015643A1
- Authority
- DE
- Germany
- Prior art keywords
- process according
- insulating material
- conductive material
- layer
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000010410 layer Substances 0.000 claims description 78
- 239000004020 conductor Substances 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 20
- 239000011810 insulating material Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000011241 protective layer Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 claims 1
- 230000035876 healing Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000344 soap Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 241001133900 Tarne Species 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000003605 opacifier Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003711 photoprotective effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000011410 subtraction method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81270069A | 1969-04-02 | 1969-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2015643A1 true DE2015643A1 (de) | 1970-11-05 |
Family
ID=25210373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19702015643 Pending DE2015643A1 (de) | 1969-04-02 | 1970-04-02 | Verfahren zur Herstellung von Mehrschi cht-Stromkreispaneelen |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS502059B1 (enrdf_load_html_response) |
| DE (1) | DE2015643A1 (enrdf_load_html_response) |
| FR (1) | FR2042059A5 (enrdf_load_html_response) |
| GB (1) | GB1262245A (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3315615A1 (de) * | 1983-04-29 | 1984-10-31 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zur herstellung einer multilayer-schaltung |
| EP0190490A3 (en) * | 1985-01-31 | 1987-01-28 | Gould Inc. | Thin-film electrical connections for integrated circuits |
| DE3735959A1 (de) * | 1987-10-23 | 1989-05-03 | Bbc Brown Boveri & Cie | Mehrlagige duennschichtschaltung sowie verfahren zu deren herstellung |
| US4996584A (en) * | 1985-01-31 | 1991-02-26 | Gould, Inc. | Thin-film electrical connections for integrated circuits |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5398650U (enrdf_load_html_response) * | 1977-01-14 | 1978-08-10 | ||
| JPS543202U (enrdf_load_html_response) * | 1977-06-08 | 1979-01-10 | ||
| JPS6224739U (enrdf_load_html_response) * | 1985-07-30 | 1987-02-14 | ||
| JPH01268504A (ja) * | 1988-04-21 | 1989-10-26 | Cleanup Corp | 多用途家具 |
| DE69637655D1 (de) * | 1995-10-23 | 2008-10-02 | Ibiden Co Ltd | Aufgebaute mehrschichtige Leiterplatte |
| WO2000025355A1 (fr) * | 1998-10-26 | 2000-05-04 | Hitachi, Ltd. | Procede de fabrication de dispositifs a semi-conducteurs |
| JP6447075B2 (ja) * | 2014-12-10 | 2019-01-09 | 凸版印刷株式会社 | 配線基板、半導体装置及び半導体装置の製造方法 |
-
1970
- 1970-02-19 FR FR7006068A patent/FR2042059A5/fr not_active Expired
- 1970-03-13 JP JP2096270A patent/JPS502059B1/ja active Pending
- 1970-03-20 GB GB1367370A patent/GB1262245A/en not_active Expired
- 1970-04-02 DE DE19702015643 patent/DE2015643A1/de active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3315615A1 (de) * | 1983-04-29 | 1984-10-31 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zur herstellung einer multilayer-schaltung |
| EP0190490A3 (en) * | 1985-01-31 | 1987-01-28 | Gould Inc. | Thin-film electrical connections for integrated circuits |
| US4996584A (en) * | 1985-01-31 | 1991-02-26 | Gould, Inc. | Thin-film electrical connections for integrated circuits |
| DE3735959A1 (de) * | 1987-10-23 | 1989-05-03 | Bbc Brown Boveri & Cie | Mehrlagige duennschichtschaltung sowie verfahren zu deren herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2042059A5 (enrdf_load_html_response) | 1971-02-05 |
| GB1262245A (en) | 1972-02-02 |
| JPS502059B1 (enrdf_load_html_response) | 1975-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E77 | Valid patent as to the heymanns-index 1977 |