DE20010044U1 - One-hand soldering device with integrated solder depot and meterable solder range - Google Patents

Description

NEYMEYER & PARTNER GbR, Patent Attorneys '! '·.. I Il ·· I I · ! 78052 VilUngen-Schwenningen (DE)

MN/mn 07. June 2000

Applicant ref.: I

Applicant: Bach, Friedrich-Wilhelm Prof. Dr.-Ing.,

Krendelstr. 53

30916 Isernhagen and

Siegfried Feinler

Dreifaltigkeitsbergstrasse 4

78549 Spaichingen
Applicant No.:

Description: One-hand soldering device with integrated solder depot and adjustable solder supply

Description

The invention relates to a one-hand soldering device with a heatable soldering tip, via which solder material is supplied from a solder depot to a joint between two components.

One-hand soldering devices of the generic type are known, for example from DE 44 35 323 C2, which are provided with a heatable soldering tip, via which solder material can be fed from a solder depot to a joint between two components. The object of DE 44 35 323 C2, referred to as a hand soldering device, consists of a heat-insulated handle part, a soldering tip and a heating device, by means of which the soldering tip can be heated to a certain soldering temperature in order to carry out a soldering process. In particular, in this known hand soldering device, a receiving chamber is provided in the area of the heating device, from which solder material can be fed to the soldering tip via a feed channel.

NEYMEYER & PARTNER GbR, patent attorneys '! '," I I!.. I Il I 78052 Villingen-Schwenningen (DE)

1*1 I ' I

MN/mn · ! 1*1 Il I ' I Il I June 7, 2000

In the area of the actual heating device, a solder chamber is provided for holding solder material. This solder chamber is thermally coupled to the heating element, so that during operation the solder material in the solder chamber is brought to a molten state by the heating element. To dispense the solder material in the solder chamber, a soldering press piston is provided in the solder chamber, which is pushed axially into the solder chamber by a pressure stamp of a working cylinder to reduce the chamber volume of the solder chamber. A solder material feed channel leads from this solder chamber to the outer end of the soldering tip. So that the solder material can pass through this solder material feed channel when heated, the soldering tip as a whole is made of a material that can be wetted with solder material.

The aim of this well-known hand soldering device when feeding solder is to apply solder in adjusted, metered quantities to the joint between two components, depending on the respective soldering task. This means that the soldering press piston is moved axially to dispense the solder and, in order to be able to stop the solder flow in the solder feed channel, the soldering press piston is locked in its respective position. However, tests have shown that stopping the solder flow

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NEYMEYER & PARTNER GbR, Patent Attorneys 'Jt.. I II·· 1 1 · I 78052 Villingen-Schwenningen (DE)

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MN/mn ·· 07 June 2000

through the solder material supply channel is not defined even when the soldering iron is locked. It has
It has been shown that a soldering tip designed in this way with its solder material supply channel always drips, so that a defined supply quantity through a soldering tip designed in this way in connection with a solder depot designed in this way is only partially suitable for soldering tasks, in particular for
tasks in the fine soldering area.

To prevent such dripping, further

One-hand soldering devices have become known in which a porous material, in particular a sintered material, is to be used for the soldering tip. In this regard, reference is made in particular to US 1,760,519, US 3,651,306 and US 3,439,857. All of these known

One-hand soldering devices or the soldering tips intended for one-hand soldering devices have in common that the solder deposit is particularly due to the porous structure of the soldering tip itself
or a cavity in the soldering tip is to be formed. The capillary effect of the pores of the porous material is intended to ensure that the soldering tip only releases solder when it comes into contact with the components to be joined. However, it has also been shown in this case that these soldering tips made of porous material always drip. Furthermore, it can also be observed that the service life and the possible uses
such soldering tips made of porous material are extremely

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NEYMEYER & PARTNER GbR, patent attorneys 'J |” I II., I Il I 78052 Villingen-Schwenningen (DE)

MN/mn Il I ' I Il I' I Il I 07.J«ni2000

is or are limited because the materials used in the specified publications lose their ability to absorb solder extremely quickly and thus the production of a large number of solder joints is only possible to a very limited extent.

The invention is therefore based on the object of designing a one-hand soldering device in such a way that solder material can be fed from a solder depot to a joint between two components via a soldering tip in a targeted manner and in precisely predefinable quantities without dripping from the soldering tip, while at the same time providing the possibility of producing a large number of soldering points.

The object is achieved according to the invention in that the soldering tip has at least one capillary which connects the solder deposit to the surface of the soldering tip and can be wetted with solder material, and in that the surface of the soldering tip in the area surrounding the solder outlet opening of the capillary has solder-repellent properties which cannot be wetted with solder material or can only be wetted with difficulty.

The inventive design of the one-hand soldering device enables a metered supply of solder material from a solder depot to a joint between two components in predetermined quantities without any dripping of solder material.

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NEYMEYER & PARTNER GbR, patent attorneys * J J,

MN/mn

78052 VUUngen-Schwenningen (DE) 07 June 2000

Soldering tip provided which has a capillary which can be wetted with solder material. This capillary connects the solder deposit to the surface of the soldering tip. In the area surrounding the solder outlet opening of the capillary, the surface of the soldering tip has solder-repellent properties which are not or only with difficulty wettable with solder material. Such properties can be achieved in different ways. For example, in this area the surface of the soldering tip can be coated with a solder-repellent material with corresponding properties, such as a chrome coating or any other material with the corresponding properties. The solder outlet opening is essentially completely enclosed in its surrounding area by such a material so that the solder material emerging from the capillary cannot spread at all or only to a limited extent on the surface of the soldering tip. The capillary pressure within the capillary constantly feeds solder material to the solder outlet opening so that a more or less large drop of solder forms on the soldering tip or in the area of the solder outlet opening. Due to the properties of the solder material, this solder drop has a certain surface tension, which creates a counteracting force to the capillary pressure. As the size of the solder drop increases, the surface tension increases.

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NEYMEYER & PARTNER GbR, patent attorneys *!;., ', JJ.. II ', I 78052 Vilnngen-Schwenningen (DE)

MN/mn Il I * '. Il 1*1 *.'. I June 7, 2000

tension, so that the counterforces counteracting the capillary pressure also become larger. With a predetermined drop size, a balance is established between the counterforce due to the surface tension of the solder drop and the capillary pressure within the capillary, so that when the solder drop reaches this specific size, further flow of solder material from the capillary to the solder outlet opening is prevented. This in turn means that the solder drop can only assume a predetermined size and thus does not break off from the soldering tip, so that it does not "drip". The size of the solder drop to be achieved depends essentially on the size of the area surrounding the solder outlet opening on the surface of the soldering tip that can still be wetted with solder material. The larger this wettable area around the solder outlet opening on the surface of the soldering tip, the larger the solder drop can form. Furthermore, the size of this solder drop also depends on the passage cross-section of the capillary inside the soldering tip, which determines the size of the capillary forces. This means that the larger the capillary cross-section, the larger the solder drop will be in the area of the solder outlet opening.

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NEYMEYER & PARTNER GbR, patent attorneys 'JJ.. J &Sgr;&Idigr;..', Il I ⁷⁸⁰⁵² Villingen-Schwenningen (DE)

MN/mn Il ! * I &Sgr;&Ggr;&Sgr; *J HI 07.JUIÜ2000

Through this special inventive design of a capillary wettable with solder material in conjunction with the surface of the soldering tip located in the area surrounding the solder outlet opening, which is not or only with difficulty wettable with solder material, a predefinable size of a solder droplet that forms can be achieved, so that the amount of solder available for a soldering process can be precisely defined by appropriate design of both the capillary and the area surrounding the solder outlet opening.

If a soldering process is now initiated, the solder droplet that forms at the end of the soldering tip is brought into contact with the joint between two components, so that this joint is brought to the desired soldering temperature. When the desired soldering temperature is reached at the joint, the solder droplet bonds with the joint, so that the existing surface tension is reduced and any amount of solder material can be fed from the capillary to the joint. If the soldering tip according to the invention is removed from the joint, a solder droplet of a predetermined size forms again until the surface tension and the capillary pressure within the capillary are again in hydrostatic equilibrium. This reliably prevents the soldering tip from dripping. Furthermore, a well-defined amount of solder can be brought to the joint.

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NEYMEYER & PARTNER GbR, patent attorneys * JJ _{# t}

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78052 Villingen-Schwenningen (DE) 07 June 2000

so that perfect soldering points can be reached safely. With the automatic formation of a new drop of solder on the soldering tip, it can be used again immediately for another soldering process. The number of solder joints that can be produced depends essentially on the amount of solder required for each solder joint and the size of the solder deposit.

According to claim 2, the capillary of the soldering tip can be formed by a hole leading from the solder deposit to the outer end of the soldering tip. The diameter of this hole can be chosen to be extremely small, whereby the capillary forces at the end of the hole are also extremely low and thus only an extremely small drop of solder can form. This inventive design according to claim 2 makes it extremely easy to manufacture the capillary and thus the entire soldering tip. In this special design, the base body of the soldering tip, in which the capillary is arranged, can be made of a copper alloy that can be wetted with solder material, for example, so that the capillary can also be wetted with solder material. The base body is provided with a coating that cannot be wetted with solder material in the area of the solder outlet opening of the capillary, so that the drop of solder that forms in the area of the solder outlet opening cannot flow freely.

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NEYMEYER & PARTNER GbR, Patent Attorneys "JJ ₄ , I II,, I Ji i 78052 Villingen-Schwenningen (DE)

MN/mn Il I * I Il I ' IHI June 7, 2000

spread over the soldering tip and can only assume a predefined size.

A further simple and therefore cost-effective manufacture of the soldering tip is achieved by the design according to claim 3. The soldering tip has a base body which consists of a non-wettable material. This means that the surface of the base body, particularly in the area surrounding the capillary, does not have to be coated separately. The capillary is formed according to claim 3 by a capillary tube inserted into the base body which consists of a material which can be wetted with solder material. Such a material can be, for example, a copper alloy or any other material combination which has excellent properties which can be wetted with solder material. In the design according to claim 3, for example, the surface of the soldering tip which is located in the area surrounding the solder outlet opening and which can still be wetted with solder material can be determined in a simple manner by the wall thickness of the capillary tube used. Due to this wall thickness, the capillary tube forms an annular surface which can be wetted with solder material in the area of the solder outlet opening, the total surface of which determines the size of the solder drop which forms. In the same way, by specifying the clear

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NEYMEYER & PARTNER GbR, patent attorneys 'J '”, i &idigr; Δ.. II*, I 78052 Villingen-Schwemiingen (DE)

MN/mn Il 1*1 Il 1*1 HI June 7, 2000

The size of the resulting solder drop can be determined by the diameter of the capillary tube.

Another possibility for forming the capillary of the soldering tip is the combination of features according to claim 4. The soldering tip consists of two tip parts lying on top of each other, the contact surfaces of which can be wetted with solder material. These contact surfaces form the actual capillary of the soldering tip. This capillary is of course connected to a corresponding solder depot, which can also be integrated into the soldering tip. In order to achieve a defined application of solder material and also a defined size of a solder outlet opening located, for example, at the outer end of the soldering tip, the two tip parts cannot be wetted with solder material on their outer surfaces, which, as already mentioned above, can be achieved by appropriately coating these outer surfaces.

According to claim 5, the two tip parts can be held together by an elastic spring element. This elastic spring element determines the contact pressure of the two tip parts with their contact surfaces. During operation, this contact pressure counteracts the capillary pressure acting in the capillary. The capillary pressure can thus be controlled by the elastic spring pressure.

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NEYMEYER & PARTNER GbR, Patent Attorneys 'J · I !·. J &Idigr;&Idigr;; 78052 VUlingen-Schwenningen (DE)

MN/mn Il I ' \ \\ \ * 1 H 1 June 7, 2000

and thus the desired supply quantity of solder material can be adjusted via the spring force of the spring element.

For this purpose, according to claim 6, the spring force of the spring element, with which the tip parts are pressed against each other via their contact surfaces, is variably adjustable.

In order to form a defined solder receiving surface in the area of the solder outlet opening, which can be wetted with solder material, according to claim 7 one tip part of the soldering tip projects at least minimally beyond the other tip part towards the free end of the soldering tip. In this case, one contact surface of the protruding part of one tip part forms a solder receiving surface that can be wetted with solder material. By choosing the size of this solder receiving surface, the size of the solder drop that forms can be influenced in a simple manner. The larger the solder receiving surface, the larger the solder drop and vice versa. It is only necessary to ensure that the solder receiving surface does not become too large, so that the size of the solder drop that forms also remains limited in size so that it cannot detach itself from the solder receiving surface. The size of this solder receiving surface can be up to about 2.5 mm ² , which essentially depends on the soldering task to be performed on the one hand and on the design on the other.

Neymeyer & PARTPiER GbR, patent attorneys MN/mn

78052 Vülingen-Schwenningen (DE) 07 June 2000

formation of the capillary and thus the resulting capillary pressure.

In order to be able to adapt the soldering tip to different soldering tasks, the projection of the protruding part of one tip part relative to the other tip part can be variably adjusted according to claim 8. This variable adjustability of the projection also determines the size of the solder receiving surface, which also adjusts the size of the solder drop that forms.

According to claim 9, the soldering tip can also be constructed in the manner of a fountain pen nib. This is particularly advantageous for carrying out extremely fine soldering work, since with this special design only extremely small drops of solder can form at the end of the soldering tip. For this purpose, the soldering tip has a base body to which a soldering nib designed in the manner of a fountain pen nib is attached. This soldering nib has a solder gap that forms the capillary. This solder gap extends to the outer end of the soldering nib. In order to prevent undefined flow of solder material, the surface of the soldering nib is made of a non-wettable material, while the inner surfaces of the solder gap facing each other can be wetted with solder material. Such a design can be achieved by a corresponding surface coating of a soldering nib.

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NEYMEYER & PARTNER GbR, Patent Attorneys ¹ JJ _M J JJ,, I *' * 78052 Villingen-Schwennlngen (DE) MN /mn ·&iacgr;·*·&idigr;&idigr;&iacgr;*&idigr;&iacgr;&iacgr;2 June 7, 2000

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Surface coating of a soldering spring can be achieved, the base body of which consists of a material that can be wetted with solder material. This makes it easy to ensure that "the inner surfaces of the solder gap can be wetted with solder material, while the rest of the surface of the soldering spring cannot be wetted with solder material.

According to claim 10, the solder gap of the soldering spring can be connected to the solder deposit via a feed hole and/or a feed capillary. With this design according to claim 10, with appropriate design and arrangement of the soldering spring, it can also be combined, for example, with one of the soldering tips according to the preceding claims 1 to 8.

According to claim 11, different solder springs can also be provided, the outer end of which is designed as a hemispherical or spherical solder ball. These solder balls can have a different diameter and/or have different sized solder receiving surfaces that can be wetted with solder material in the immediate vicinity of the solder gap that continues in the solder ball. These different sized solder receiving surfaces that can be wetted with solder material in turn result in a different sized form of a solder drop that is formed. The size of this solder receiving surface is determined according to claim 11 by a corresponding

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NEYMEYER & PARTNER GbR, Patent Attorneys ·· ^, J *ij". l'jt*'* 78052 ViUingen-Schwenningen (DE)

MN/mn JJ &iacgr; * YYY* Y ' | IJ \ 07.June2000

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The soldering tip is limited by a suitable coating of the soldering spring that cannot be wetted with solder material and that delimits this solder receiving surface in a circle, for example. These different soldering springs make it very easy to adapt the one-handed soldering device according to the invention to a wide variety of soldering conditions, particularly in the area of fine soldering. The larger the solder receiving surface or the solder ball, the larger the solder droplet that forms on the solder ball. Thus, by simply exchanging the soldering springs on the base body of the soldering tip, different sizes of solder droplets can be achieved and the one-handed soldering device can be easily adapted to different soldering tasks.

According to claim 12, the solder deposit can be formed from a cavity arranged in the soldering tip and open to the outside. This design provides a solder deposit that is located in the immediate vicinity of the capillary and can thus be thermally coupled to the heating device of the one-hand soldering device in an extremely simple manner. Because the cavity is openly accessible to the outside, refilling of used solder material is also easy to carry out.

For this purpose, the cavern has a filling opening according to claim 13. According to claim 13, the filling opening can be

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NEYMEYER & PARTNER GbR, Patent Attorneys "! ;,, * Jj,. J \\ J 78052 Vaiingen-Schwenningen (DE)

MN/mn Il 1*1 I i' J * J *» · June 7, 2000

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be designed in such a way that an additional solder cartridge can be replaced. This additional solder cartridge can therefore increase the volume of solder material available, so that the number of soldering jobs that can be carried out can be increased considerably. The solder cartridge is thermally coupled to the soldering tip when attached, so that melting of the solder material in the solder cartridge is ensured.

To further expand the application area, in particular to increase the number of soldering tasks that can be carried out, the solder depot can be formed from a solder cartridge that can be exchangeably arranged in the soldering tip or in the area of a heating device of the one-hand soldering device. This solder cartridge is connected to the capillary via a supply channel to supply the solder material. This solder cartridge is also designed to be exchangeable according to claim 14, which also significantly expands the application area with regard to the soldering tasks that can be carried out.

According to claim 15, a flux capillary can be provided in the area of the soldering tip, through which flux can be supplied to the joint from a flux depot. The clear width of this flux capillary is selected so that the flux can flow through the capillary

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NEYMEYER & PARTNER GbR, Patent Attorneys * J J., I II·» I Il I 78052 Vülingen-Schwenningen (DE)

MN/mn I I I*! II 1*1 II I 07.JUIÜ2000

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lar effect through the flux capillary to a corresponding outlet opening of the flux capillary and only a small drop of flux forms there due to the surface tension of the flux. In this state, there is a hydrostatic equilibrium between the surface tension and the capillary pressure within the flux capillary so that the flux cannot escape from the capillary and drip off uncontrollably. Only when the flux capillary with its outlet opening or with the flux drop is brought into contact with another object is the surface tension removed so that the flux continues to flow due to the capillary forces acting in the flux capillary.

For this purpose, according to claim 16, the flux capillary consists of a heat-resistant capillary tube which can be brought into contact with the joint and/or with the soldering tip in order to supply flux. In order to be able to bring the flux capillary with its outlet opening into contact with the soldering tip, the capillary tube can be pivotally mounted, for example, in the area of a handle part of the one-hand soldering device or with appropriate thermal insulation on the soldering tip itself, so that it can be pivoted with its outlet opening onto the soldering tip. The flux emerges as soon as the outlet opening or the

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Neymeyer & Partner GbR, Patent Attorneys 'JJ.. I ·!·« · ♦· · 78052 Villingen-Schwenningen (DE)

MN/mn JI I ⁹ IHI' I X I June 7, 2000

The flux droplets that form there come into contact with the soldering tip in a continuous flow out of the flux capillary and, in this embodiment, flow via the soldering tip to the joint.

In the case that the soldering tip is designed in two parts according to claims 4 and 5, one of the tip parts can also be moved towards the outlet opening of the flux capillary, so that the flux drop is brought into contact with the soldering tip and the flux is caused to flow to the joint via the soldering tip. The same applies to the design of the soldering tip as a soldering spring according to claim 9, the elastic flexibility of which can also make contact with the flux drop in the area of the outlet opening of the flux capillary. In these two cases, no pivotable mounting of the flux capillary is necessary.

According to claim 17, the flux capillary can be part of a flux spring designed in the manner of a fountain pen nib. In this embodiment, the flux capillary is designed as a flux gap. This design makes it extremely easy to manufacture the flux capillary.

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MN/mn

78052 Viuingen-Schwenningen (DE) 07 June 2000

In summary, it can be stated that the one-hand soldering device according to the invention can be used extremely variably for a wide variety of soldering tasks. The soldering tip provided according to the invention has a simple geometric design and can be easily adapted to conventional soldering devices.

The invention is explained in more detail below with reference to the drawing. It shows:

Fig. 1 is a partial section through a soldering tip according to the invention with integrated solder depot;

Fig. 2 shows a section II-II of Fig. 1;

Fig. 3 shows an enlarged section III of the soldering tip from Fig. 1;

Fig. 3a is a front view of the solder outlet opening of the soldering tip from Fig. 3;

Fig. 4 a second embodiment of the front

End of the soldering tip from Fig. 1 in enlarged scale;

Fig. 4a is a front view of the solder outlet opening of the soldering tip from Fig. 4;

Fig. 5 shows a third embodiment of the front end of a soldering tip according to Fig. 1 with inte-

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NEYMEYER & PARTNER GbR, patent attorneys * JJ _&bgr;#J

MN/mn

78052 Villingen-Schwenningen (DE) 07 June 2000

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grated capillary tube on an enlarged scale;

Fig. 5a is a front view of the solder outlet opening of the soldering tip from Fig. 5;

Fig. 6 a soldering tip of the type according to the invention with a soldering spring as a solder supply device;

Fig. 7 is an enlarged bottom view VII of the front end of the soldering spring of Fig. 6;

Fig. 8 is a plan view VIII of the soldering tip from Fig. 6;

Fig. 9 a partial section through a two-part soldering tip with integrated solder depot;

Fig. 10 is a side view of the soldering tip from Fig. 9;

Fig. 11 is an enlarged bottom view XI of the front end of the soldering tip of Fig. 10;

Fig. 12 is a partial section XII-XII of Fig. 9;

Fig. 13 a sectional view of a soldering tip with separate, replaceable integrated solder cartridge.

Fig. 1 shows a soldering tip 1 according to the invention, which has a receiving shaft 2 at its rear end region, with which the soldering tip 1 can be inserted into a heating device.

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NeymeYER & PARTNER GbR, patent attorneys *;;,, ; I!.. Ill I ⁷⁸⁰⁵² Villngen-Schwenningen (DE)

MN/mn I ' I ' I Il 1*1 HI June 7, 2000

device of a commercially available one-hand soldering device. The entire
Soldering tip 1 thermally with the heating device of the one-hand soldering device
and thus a total of
required soldering temperature to carry out corresponding
soldering work.

The soldering tip 1 has a cavity 3
Solder deposit, which is integrated in the soldering tip 1. In the present embodiment, this cavity 3 is open at the top. To close
This cavern 3 is a cylindrical outer contour
the soldering tip 1 adapted closure plate 4
provided with an open filling opening 5. As can be seen from Fig. 1 and 2,

the closure plate 4 is detachably attached to the soldering tip 1 by means of two screws 6. At its end opposite the receiving shaft 2, in the present embodiment,
Fig. 1 shows the soldering tip as a cone-shaped, tapered tip and accordingly has a conical soldering cone 7. The soldering cone 7 has
front end a solder outlet opening 8 of a capillary
9 on.

This capillary 9 is in the present embodiment
designed as a hole with a small cross-section
and connects the outer end of the soldering tip 1 with the cable

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NEYMEYER & PAKTNER GbR, patent attorneys *JJ,, ', '.',,, I Il I 78052 Villingen-Schwenningen (DE)

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MN/mn JJ I ' I Il I ' I Il I 07 June 2000

verne 3. The base body 10 of the soldering tip 1 in the embodiment according to Fig. 1 to 3 consists of a material that can be wetted with solder material, such as a copper alloy, so that the capillary 9 itself can also be wetted with solder material over its entire length. As can be seen in particular from Fig. 3, the base body 10 has on its outer surface, in particular in the area surrounding the solder outlet opening 8, a coating 11 that cannot be wetted with solder material, which can be a chromium alloy, for example. In the present embodiment, this coating 11 borders directly on the circumference of the solder outlet opening of the capillary 9, as can be seen in particular from the two rings below the sectional view in Fig. 3a.

Due to this special choice of material and thus the surface properties of the capillary 9, which can be wetted with solder material, and the surface coating 11, which cannot be wetted with solder material, during operation, solder material is conveyed from the cavity 3 to the solder outlet opening 8 in the direction of the arrow 12 due to the capillary forces acting in the capillary 9. When the solder material has reached the solder outlet opening 8, it forms a solder drop 13, as shown in thin lines in Fig. 3. This drop formation is caused by the

NEYMEYER & PARTNER GBR, patent attorneys · JJ _t , MN/nui

78052 VilUngen-Schwenningen (DE) 07 June 2000

Capillary 9 causes capillary forces to act, so that solder drop 13 constantly grows in size. However, capillary drop 13 cannot spread to the surrounding surface or to the surrounding area of the soldering tip or soldering cone 7, since this is provided with a coating 11 which cannot be wetted with solder material. This gives solder drop 13 an approximately spherical shape, which is caused by the surface tension usual in solder materials. This surface tension of solder drop 13 causes a counterforce acting in the opposite direction to arrow 12, which also increases as the size of solder drop 13 increases. For a certain size of solder drop 13, this counterforce corresponds exactly to the capillary forces acting in the direction of arrow 12, so that a hydrostatic equilibrium is brought about between the capillary and the solder drop. When this hydrostatic equilibrium is reached, further supply of solder through the capillary 9 in the direction of the arrow 12 is stopped so that the solder drop 13 cannot grow any further. The size of the capillary 9 is such that only a size of the solder drop 13 can be achieved which ensures that the solder drop 13 cannot detach itself from the solder cone 7.

To carry out soldering work, the soldering cone 7 of the soldering tip 1 is brought into contact with a joint to be soldered.

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NEYMEYER & PARTNER GbR, patent attorneys ⁴ JJ,, '. '.'... II '. t 78052 Villingen-Schwenningen (DE)

MN/mn Il !*! Il 1*1 Il I 07.JUIÜ2000

brought into contact so that the solder drop 13 is transferred to this joint and at the same time its surface tension is reduced. Due to this reduction in surface tension, the hydrostatic equilibrium of the counterforce of the solder drop 13 and the capillary forces of the solder material in the capillary 9 is eliminated so that the solder material in the capillary again begins to flow in the direction of arrow 12. Once the joint has been completed in the desired manner, the soldering tip 1 with its solder cone 7 and thus also with the solder outlet opening 8 is removed from the joint so that a solder drop can form again until a new hydrostatic equilibrium is reached.

It is clear that the design according to the invention, namely on the one hand the wettable design of the capillary 9 and on the other hand the non-wettable design of the area surrounding the solder outlet opening, reliably prevents dripping after completion of a soldering process of the soldering tip 1 according to the invention. Furthermore, it is achieved that, depending on the volume of the cavity 3, a large number of soldering processes can be carried out without the operator having to arrange an external supply of solder to the joint. The one-hand soldering device according to the invention, which is provided with the soldering tip 1 according to the invention, can thus be easily

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NEYMEYER & PARTNER GbR, Patent Attorneys " ₍ J _n J II.· · ♦· · 78052 Villlngen-Schwenningen (DE) MN/mn Il *·' I Il I ' J It &iacgr; June 7, 2000

can be operated with one hand, so that the operator can use the other hand, for example, to fix the components to be joined together.

Fig. 4 shows a second embodiment of a solder cone 7/1, which differs from the solder cone 7 of the embodiment according to Figs. 1 to 3 due to its design at its front end 14. As can be seen in particular in the front view of Fig. 4a shown by the three circular rings, an annular surface 15 is provided in the immediate vicinity of the capillary 9/1 of the solder cone 7/1, which consists of the same material as the base body 10/1 or the solder cone 7/1 of this second embodiment. This annular surface 15 allows a larger solder drop 13/1 to form at the front end 14 of the solder cone 7/1, so that more solder material is available for a soldering process when it is first brought into contact with a joint. The basic functionality of this embodiment is identical to the functionality of the embodiment of Fig. 1 to 3. In the second embodiment of Fig. 4, the capillary 9/1 also leads to a solder outlet opening 8/1 of the solder cone 7/1, where the previously mentioned solder drop 13/1 is formed. Since this solder drop 13/1 can spread out on the ring surface 15, more solder material is required in order to build up the necessary surface tension of the solder drop 13/1.

NEYMEYER & PARTNER GbR, Patent Attorneys · JJ _&phgr;# \ II,,

MN/mn I '', I

78052 Villingen-Schwenningen (DE) 07 June 2000

which, if the solder drop 13/1 is large enough, causes a counterforce to the capillary force, which is caused by the solder material in the capillary 9/1 in the direction of the arrow 12/1. Here too, if the solder drop 13/1 is large enough, a hydrostatic equilibrium of the counterforce to the capillary force is established, so that a further enlargement of the solder drop 13/1 is prevented.

This solder drop 13/1 is also dimensioned in such a way that it cannot detach itself from the ring surface 15 or the solder cone 7/1. As can also be seen from Fig. 4, the ring surface 15 is limited by a coating 11/1 that cannot be wetted with solder material, at least in the area of the outer surface of the solder cone 7/1, so that spreading of the solder drop 13/1 onto the solder cone 7/1 is effectively prevented and thus uncontrolled flow and thus detachment of the solder drop 13/1 is reliably prevented.

Fig. 5 shows an embodiment of a soldering cone 7/2, the base body 10/2 of which is made of a material that cannot be wetted with solder material. The capillary 9/2 of the soldering cone 7/2 is formed in this embodiment by a capillary tube 16, the front face of which forms an annular surface 15/2 at the front end 14/2 of the soldering cone 7/2, as shown by the two circular

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NEYMEYER & Partner GbR, Patent Attorneys 'JJ ₄ , ', l",. _t I Il I 78052 VillJngen-Schwenningen (DE)

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rings from Fig. 5a. This circular ring surface 15/2 corresponds essentially to the circular ring surface 15 of the embodiment from Fig. 4 and forms the immediate surrounding area of the solder outlet opening 8/2 of the soldering cone 7/2. Here too, the basic mode of operation is identical to the previous embodiments, so that in the embodiment of Fig. 5 a solder drop 13/2 of a defined size is also formed. The embodiment according to Fig. 5 has the advantage that the surface of the entire soldering tip or at least in the area of the soldering cone 7/2 does not have to be provided with a coating that cannot be wetted with solder material, so that the costs can be kept extremely low. The capillary tube 16 itself, on the other hand, consists of a material that can be wetted with solder material, so that the same effects arise as in the previously described embodiments.

Fig. 6 shows a partial section of another embodiment of a soldering tip 1/3, which has a base body 10/3, which is made of a material that can be wetted with solder material. In this soldering tip 1/3 or in the base body 10/3, a cavity 3/3 is also provided as a solder depot, the design of which is similar to the cavity 3 from the embodiment according to Fig. 1.

This cavern 3/3 is also closed by a closure that is adapted to the outer contour of the base body 10/3.

Neymeyer & PARTNER GbR, Patent Attorneys ·· · _f · ** _## J JJ I 78052 Villingen-Schwenningen (DE)

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plate 4/3. This closure plate 4/3 is also connected to the base body 10/3 via corresponding screws 6/3 and completely closes the cavern 3/3. The closure plate 4/3 also has a corresponding filling opening 5/3, through which solder material can be introduced into the cavern 3/3.

In the front end area of the base body 10/3, a soldering spring 17 is provided, the special design of which corresponds approximately to the design of a fountain pen nib. This soldering spring 17 is replaceably attached to the base body 10/3 by means of a mounting screw 18. To ensure the correct guidance of the soldering spring 17, it has two side walls 19 and 20, which fit snugly against the base body 10/3, particularly in the area of the mounting screw 18, as can be seen in particular from Fig. 8. The two front end areas 21 and 22 of these two side walls 19 and 20 can diverge from the soldering cone 7/3 shown in dashed lines in Fig. 8 and therefore only serve to vertically stabilize the soldering spring 17.

Due to this special design of the soldering spring 17, it lies flat on a flat surface 23 of the soldering cone 7/3. As can be seen from Fig. 6 and 8, the soldering spring 17 has a solder gap 24 extending to the front end, which is at least

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at least approximately to the rear end of the flat surface 23 of the soldering cone 7/3. In the rear end region 25 in the base body 10/3, a supply channel 26 is provided starting from the flat surface 23, through which a cavity 3/3 forming the solder deposit is connected to the flat surface 23.

During operation, solder material now passes from the cavity 3/3 through the feed channel 26 in the direction of the arrow 12/3 to the solder gap 24 of the solder spring 17 and is conveyed there due to the capillary forces acting in the solder gap 24 to a solder ball 27 provided at the outer end of the solder spring 17, as indicated by the further arrow 12/3.

In this case, the soldering spring 17 in the present embodiment consists of a base material that can be wetted with solder material and which is provided with a coating that cannot be wetted with solder material on its entire surface. By subsequently attaching the soldering gap 24 in the manner shown in Figs. 6 and 8, it is thus achieved that the two inner surfaces of the soldering gap facing each other can also be wetted with solder material, since there is no such coating there. Thus, the soldering gap 24 in this embodiment forms a corresponding capillary 9/3 in which the already mentioned in Figs. 1 to 5

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NEYMEYER & PARTNER GbR, patent attorneys 'JJ ₄ , '. Ht, I l\ I 78052 Villingen-Schwenningen (DE)

MN/mn YY Y*! '.I Y*Y YY '. 07.June2000

capillary forces are effective. In this embodiment, for example, a drop of solder 13/3 forms on the underside of the solder ball 27, as shown in Fig. 6, which is particularly dependent on the cross section of the capillary 9/3 or the solder gap 24.

Furthermore, the size of this solder drop 13/3 can also be influenced by a special design of the underside of the solder ball 27. As can be seen in particular from the enlarged illustration in Fig. 7, this can have a wettable area 28 in the area of the soldering gap 24, which is circular in the present embodiment and is delimited by the coating 29 surrounding this area 28, which is not wettable. This wettable area 28 does not necessarily have to be provided directly below the solder ball 27. The arrangement can also be shifted towards the end in the front tip area. The circular shape of this wettable area 28 is also not mandatory. It can also be provided that, for example, the adjacent areas of the solder gap 24 are provided with a more or less wide strip, as is shown by way of example by the two dashed lines 30 and 31, so that the solder drop 13/3 shown in Fig. 6 can be formed in different shapes and sizes. The total area

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NEYMEYER & PARTNER GbR, Patent Attorneys 'JJ ₄ . J II»» » it ♦ 78052 VilBngen-Schwenningen (DE) MN/mn YY I ' I YY Y * Y YY Y June 7, 2000

the wettable area 28 can be designed variably so that different solder springs 17 with different solder balls 27 and different wettable areas 28 can be provided.

In the present embodiment, the soldering spring 17 is attached to the base body 10/3 via the mounting screw 18. Other types of attachment, such as snap-in connections and the like, are also provided, which simplifies handling, in particular for exchanging different soldering springs 17.

Furthermore, it can also be provided that the soldering spring 17 has a wettable surrounding area on its underside, in particular in the area of its soldering gap 24 in the area of its support on the flat surface 23, as is the case.

in particular from Fig. 8 in dashed lines 32. By such a design of a wettable area around the actual solder gap 24, a capillary effect is also achieved between the solder spring 17 and the solder cone 7/1 in the immediate vicinity of the solder gap 24. As a result, a larger amount of solder material can be supplied to a joint during the soldering process per unit of time. It can also be provided that the solder spring 17 is designed to be elastically flexible, in particular in the area of its solder gap 24, so that by appropriate pressure during the

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NEYMEYER & PARTNER GbR, patent attorneys *JJ., I J &iacgr;·· I Il * 78052 Vfflingen-Schwenningen (DE)

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During the soldering process of the solder ball 27 onto the joint, the solder spring 17 is slightly lifted off the solder cone 7/3, whereby the capillary gap in the region of the soldering gap 24 between the solder spring 17 and the solder cone 7/3 is enlarged at least in some areas. This increases the inflow of solder material and thus accelerates the production of a joint.

Fig. 9 shows a further embodiment 1/4 of a soldering tip intended for a one-hand soldering device. This soldering tip 1/4 consists of a lower tip part 34 forming a base body 10/4, onto which a second, upper tip part 35 is placed. As can be seen from Fig. 12, these two tip parts 34 and 35 form an essentially cylindrical outer shape. The upper tip part 35 is provided with a cavity 3/4 which serves to hold solder material and accordingly forms the solder depot of this embodiment of the soldering tip 1/4. The cavity 3/4 is covered by a closure plate 4/4 adapted to the outer shape of the soldering tip 1/4, which has a corresponding filling opening 5/4 for filling the cavity 3/4.

As can be seen from Fig. 9 and 12, the separation plane 46 between the two tip parts 34 and 35 is located approximately in the area of the longitudinal center axis 36 of the soldering tip 1/4. The closure plate 4/4 is secured by means of a fastening screw

NEYMEYER & PARTNER GbR, Patent Attorneys MN/mn

78052 Villingen-Schwenningen (DE) 07 June 2000

37 is firmly mounted on the upper tip part 35. As can also be seen from Fig. 9, the closure plate 4/4 for the receiving shaft 2/4 of the soldering tip 1/4 has a spring element 38 designed as a leaf spring, by means of which the upper tip part 35 is pressed elastically against the lower tip part 34.

The spring element 38 is attached to the top of the first tip part 34 with a pre-tensioning screw 39. This pre-tensioning screw 39 serves on the one hand to hold the spring element 38 together with the closure plate 4/4 and the upper tip part 35 firmly on the lower tip part 34 and on the other hand to adjust the contact force with which the upper tip part 35 is pressed onto the lower tip part 34. As can also be seen from Fig. 9, the cavity 3/4 has an outlet opening 40 through which solder material reaches the upper contact surface 41 of the lower tip part 34. The lower contact surface 42 lies flat on the upper tip part 35 on this upper contact surface 41 of the lower tip part 34.

In this embodiment according to Fig. 9, the two contact surfaces 41 and 42 of the two tip parts 34 and 35 thus form the capillary 9/4, through which solder material reaches the front end 43 of the soldering tip 1/4 in the heated state.

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NEYMEYER & PARTNER GbR, patent attorneys ¹ JJ., JJ!, _t IMI 78052 Villingen-Schwenningen (DE)

MN/mn I J I' t H I'i ', II June 7, 2000

As can be further seen from Fig. 9 and Fig. 10, the upper tip part 35 projects with its front end beyond the lower tip part 34. The two contact surfaces 41 and 42 of the two tip parts 34 and 35 can be wetted with solder material, so that a capillary pressure is established between these contact surfaces 41 and 42, by means of which solder material is conveyed through the capillary 9/4 formed by these two contact surfaces 41 and 42 to the front end 43 of the soldering tip 1/4.

Since the protruding section 44 of the upper tip part 35 can also be wetted with solder material, a solder drop 13/4 is formed on it, the size of which depends essentially on the size of the receiving surface 45 of the protruding part 44 and on the design of the gap-like capillaries between the contact surfaces 41 and 42, as already described for the previous embodiments. The size of this solder receiving surface 45 can be up to 2.5 mm ² without the solder drop 13/4 that is formed breaking off from the solder receiving surface 45.

With a predeterminable size of the solder drop 13/4, the surface tension of the solder drop 13/4 causes a counterforce to the capillary force in the capillary 9/4 between the two contact surfaces 41 and 42, which counteracts the capillary force in a hydrostatic equilibrium.

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This is achieved by coating the surface of the two tip parts 34 and 35 with a material that cannot be wetted with solder material, so that the solder drop 13/4 cannot spread beyond the solder receiving surface 45 and the necessary surface tension is built up to generate the counterforce.

Furthermore, with regard to the embodiment of the soldering tip 1/4 according to Fig. 9, it is also provided that the upper tip part 35 is designed to be movable relative to the lower tip part 34, so that the size of the solder receiving surface 45 of the front, protruding section 44 of the upper tip part 35 can be variably adjusted. This adjustment option also makes it easy to adjust the size of the solder drop 13/4 that forms, so that the soldering tip 1/4 can also be easily adapted to different requirements for different soldering tasks.

Due to the spring-loaded mounting of the upper tip part 35 on the lower tip part 34, during the soldering process, by applying light pressure from below on the front, protruding section 44 of the upper tip part, the latter can be easily lifted against the spring pressure with its contact surface 42 from the contact surface 41 of the lower tip part 34, which leads to an increase in the

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cross-section of the capillary 9/4. This enlargement
of the cross section of the capillary 9/4, a
increased supply of solder material is achieved during a soldering process, so that a soldering process can be accelerated considerably.

As can be seen from Fig. 12, the closure plate extends
4/4 curved downwards over the parting plane 46 defined by the two contact surfaces 41 and 42
between the two tip parts 34 and 35, so that

due to the non-wettable surface and due to the

Covering the capillary formed by the contact surfaces 41 and 42 prevents accidental leakage of solder material
in a lateral direction is safely prevented. It
It should be noted here that such a lateral cover of the capillary 9/4 is not absolutely necessary.

As further shown in phantom lines in Figs. 9 and 12 by way of example, a solder cartridge 47 can be placed on the cavern 3/4 or on the closure plate 4/4 of the cavern 3/4, the bottom part 48 of which rests flat on the closure plate 4/4 at least in some areas.
Due to this flat support of the solder cartridge 47 on the
The closure plate 4/4 ensures optimum thermal coupling between the soldering tip 1/4 and the solder cartridge 47,
so that the solder material contained therein can be safely melted during operation. The solder pa-

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The solder cartridge 47 has a filler neck 49 on the underside towards the cavity 3/4, through which solder material from the solder cartridge 47 can be fed into the cavity 3/4 during operation if required. By using this solder cartridge 47, the number of solder connections that can be made can be increased considerably. As can be seen in particular from Fig. 12, the solder cartridge 47 can be easily replaced using a spring-elastic retaining clip.

49 must be held on the locking plate 4/4 and thus on the soldering tip 1/4.

Fig. 13 shows a further embodiment of a soldering tip 1/5, which also consists of an upper tip part 50 and a lower tip part 51. The essential difference to the embodiment according to Fig. 9 is that this soldering tip 1/5 does not have a cavity 3/4, but that the supply of solder material via corresponding supply channels 52 and 53 into the two contact surfaces 54 and 55 of the two tip parts

50 and 51 formed capillary 9/5. The supply channel 52, which runs approximately parallel to the longitudinal center axis 56 of the soldering tip 1/5, opens into a cavity 57 of the receiving shaft 2/5 of the soldering tip 1/5. A solder cartridge 58 is inserted in this cavity 57 of the receiving shaft 2/5 in an exchangeable manner. By using this solder cartridge 58, this is located in the area of the receiving shaft 2/5 in the present embodiment, which is in the assembled

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NEYMEYER & PARTNER GbR, Attorneys at Law ··· * * * , 111· 78052 VUlingen-Schwenningen (DE)

MN /mn 111*1111*1111 June 7, 2000

ten state, e.g. inserted into the heating element of a one-hand soldering device (not shown in the drawing). This ensures that the solder material in the solder cartridge 58 is safely melted during operation and is safely fed along the two feed channels 52 and 53 into the capillary 9/5.

The upper tip part 50 of the soldering tip 1/5 is also held elastically on the lower tip part 51 via a corresponding holding element 59. The material properties of the two contact surfaces 54 and 55 correspond to the material properties of the two contact surfaces 41 and 42 of the embodiment from Fig. 9. The same applies to the surfaces of the two tip parts 50 and 51, which are accordingly also coated with a material that cannot be wetted with solder material.

In summary, it can be stated that the soldering tip itself can contain, for example, a cavity designed as a hole, which represents a solder deposit. Thus, for example, a quantity of solder material of a volume of about 1 cm ³ or more, depending on the total size of the entire soldering tip, of molten solder material can be available in the heated soldering tip. The soldering tip can be made of OF copper, for example, and can be divided in such a way that a floating soldering material can be formed on a base body by means of an adjustable spring tension.

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mounted counterpart, whereby these two components form the two tip parts described as examples. The resulting gap in the area of the contact surfaces of these two tip parts represents the capillary through which the molten solder material is conveyed from the solder depot to the solder outlet opening with the help of the so-called capillary ascension as the driving force. The volume flow is limited by the flow resistance in the capillary, so that the volume flow can be adjusted as desired by varying the capillary cross-sectional area, which is caused by the spring tension of the elastic spring element. The solder material flows out of the solder depot until the capillary is completely filled.

The front side at the capillary outlet is provided with a passivated surface that cannot be wetted by the solder material. Such a passivated surface can be achieved, for example, with an appropriate chrome coating. The molten solder material forms an elongated, hemispherical drop along the outlet opening, the surface tension of which counteracts the capillary force and a hydrostatic equilibrium is then established.

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Neymeyer & Partner GbR, patent attorneys · j MN/mn !

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Thus, as already mentioned, the drop size is a function of the capillary force and is determined by the capillary geometry, the wetting ability of the capillary surfaces and the hydrostatic pressure of the solder deposit. This solder drop is now available for the soldering process. If it is guided to the component surfaces to be soldered and these are wetted with the solder material from the solder drop, the surface tension of the non-wettable soldering tip surfaces, which counteracts the capillary pressure, is eliminated and the solder can flow through the suction effect of the joining surface wetting as long as the soldering tip is kept in contact. The solder connection is thus realized.

If the contact between the soldering tip and the joint is interrupted by lifting the tip, the hydrostatic equilibrium described above is immediately restored, so that a new drop of solder is suddenly formed at the capillary outlet until the surface tension, which is also increasing, stops the volume flow of solder material. The original drop of solder is then present again at the capillary outlet and a new soldering process can be carried out.

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Claims (17)

1. One-hand soldering device with a heatable soldering tip ( 1 , 1 / 3 , 1 / 4 , 1 / 5 ), via which solder material is supplied from a solder depot ( 3 , 3 / 3 , 3 / 4 , 58 ) to a joint between two components,
characterized in that the soldering tip ( 1 , 1 / 3 , 1 / 4 , 1 / 5 ) has at least one capillary ( 9 , 9 / 1 , 9 / 2 , 9 / 3 , 9 / 4 , 9 / 5 ) connecting the solder deposit ( 3 , 3 / 3 , 3 / 4 , 58 ) to the surface of the soldering tip ( 1 , 1 / 3 , 1 / 4 , 1 / 5 ) and wettable with solder material , and
that the surface of the soldering tip ( 1 , 1 / 3 , 1 / 4 , 1 / 5 ) in the area surrounding the solder outlet opening ( 8 , 8 / 1 , 8 / 2 , 8 / 3 , 27 , 45 ) of the capillary ( 9 / 1 , 9 / 2 , 9 / 3 , 9 / 4 , 9 / 5 ) has solder-repellent properties that are not wettable or can only be wetted with solder material with difficulty. 2. One-hand soldering device according to claim 1, characterized in that the capillary of the soldering tip ( 1 ) is formed by a bore ( 9 , 9/1 , 9/2 ) leading from the solder depot ( 3 ) to the outer end of the soldering tip ( 1 ) . 3. One-hand soldering device according to claim 1 or 2, characterized in that the soldering tip ( 1 ) has a base body ( 10/2 ) which consists of a non-wettable material, and that the capillary ( 9/2 ) is formed by a capillary tube ( 16 ) inserted into the base body ( 10/2 ) which consists of a material which can be wetted with solder material. 4. One-hand soldering device according to claim 1 , characterized in that the soldering tip ( 1/4 , 1/5 ) is formed from two superimposed tip parts ( 34 , 35 , 50 , 51 ), and
that the contact surfaces ( 41 , 42 , 54 , 55 ) of the tip parts ( 34 , 35 , 50 , 51 ) are wettable with solder material, and
that the outer surfaces of the tip parts ( 34 , 35 , 50 , 51 ) are not wettable with solder material, and
that the two superimposed tip parts ( 34 , 35 , 50 , 51 ) with their contact surfaces ( 41 , 42 , 54 , 55 ) form the capillary ( 9/4 , 9/5 ). 5. One-hand soldering device according to claim 4, characterized in that the two tip parts ( 34 , 35 , 50 , 51 ) are held in connection with one another by an elastic spring element ( 38 , 59 ). 6. One-hand soldering device according to claim 5, characterized in that the spring force of the spring element ( 38 , 59 ) with which the tip parts ( 34 , 35 , 50 , 51 ) are pressed against one another via their contact surfaces ( 41 , 42 , 54 , 55 ) is variably adjustable. 7. One-hand soldering device according to claim 4, 5 or 6, characterized in that the one tip part ( 35 ) of the soldering tip ( 1/4 ) projects at least minimally beyond the other tip part ( 34 ) towards the free end ( 44 ) and the contact surface ( 42 ) of the projecting section ( 44 ) of the one tip part ( 35 ) forms a solder receiving surface ( 45 ) which can be wetted with solder material. 8. One-hand soldering device according to claim 7, characterized in that the projection of the projecting section ( 44 ) of one tip part ( 35 ) relative to the other tip part ( 34 ) is variably adjustable. 9. One-hand soldering device according to claim 1, characterized in that the soldering tip ( 1/3 ) has a base body ( 10/3 ) to which a soldering spring ( 17 ) designed in the manner of a fountain pen nib is attached, and
that the soldering spring ( 17 ) has a solder gap ( 24 ) forming the capillary ( 9 / 3 ) which extends to the outer end of the soldering spring ( 17 ), and
that the surface of the soldering spring ( 17 ) consists of a non-wettable material, and
that the mutually facing inner surfaces of the solder gap ( 24 ) are designed to be wettable with solder material. 10. One-hand soldering device according to claim 9, characterized in that the solder gap ( 24 ) of the soldering spring ( 17 ) is connected to the solder depot ( 3/3 ) via a feed bore ( 26 ) and/or a feed capillary. 11. One-hand soldering device according to claim 9 or 10, characterized in that different soldering springs ( 17 ) are provided, the outer end of which is designed as a hemispherical or spherical soldering ball ( 27 ), and
that the solder balls ( 27 ) of the different solder springs ( 17 ) have different diameters and/or different sized solder receiving surfaces ( 28 ) wettable with solder material in the immediate vicinity of the solder gap ( 24 ), and
that the solder receiving surface ( 28 ) is limited by a coating ( 29 ) of the soldering spring ( 17 ) which cannot be wetted with solder material. 12. One-hand soldering device according to one of claims 1 to 11 , characterized in that the solder deposit is formed from a cavity ( 3 , 3/3 , 3/4 ) arranged in the soldering tip ( 1 , 1/3 , 1/4 ) and fillable from the outside with solder material. 13. One-hand soldering device according to claim 12 , characterized in that the cavity ( 3 , 3/3 , 3/4 ) has a filling opening ( 5 , 5/3 , 5/4 ) onto which an additional solder cartridge ( 47 ) can be exchangeably placed, and
that the solder cartridge ( 47 ) is thermally coupled to the soldering tip ( 1 , 1 / 3 , 1 / 4 ) when attached. 14. One-hand soldering device according to one of claims 1 to 11, characterized in that the solder deposit is formed from a solder cartridge ( 58 ) which is arranged replaceably in the soldering tip ( 1/5 ) or in the region of a heating device of the one- hand soldering device and which is connected to the capillary ( 9/5 ) via a solder channel ( 52 , 53 ). 15. One-hand soldering device according to one of claims 1 to 14, characterized in that in the region of the soldering tip at least one flux capillary is provided, via which flux can be supplied to the joint from a flux depot. 16. One-hand soldering device according to claim 15, characterized in that the flux capillary consists of a heat-resistant capillary tube which can be brought into contact with the joint and/or with the soldering tip for supplying flux. 17. One-hand soldering device according to claim 15, characterized in that the flux capillary is a component of a flux spring designed in the manner of a nib of a fountain pen and that the flux capillary is designed as a flux gap.