DE19983782T1 - Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch - Google Patents
Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem ZusammenbruchInfo
- Publication number
- DE19983782T1 DE19983782T1 DE19983782T DE19983782T DE19983782T1 DE 19983782 T1 DE19983782 T1 DE 19983782T1 DE 19983782 T DE19983782 T DE 19983782T DE 19983782 T DE19983782 T DE 19983782T DE 19983782 T1 DE19983782 T1 DE 19983782T1
- Authority
- DE
- Germany
- Prior art keywords
- lasers
- application
- material processing
- optical breakdown
- breakdown
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12738898A IL127388A0 (en) | 1998-12-03 | 1998-12-03 | Material processing applications of lasers using optical breakdown |
PCT/IL1999/000655 WO2000032349A1 (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
Publications (1)
Publication Number | Publication Date |
---|---|
DE19983782T1 true DE19983782T1 (de) | 2001-10-18 |
Family
ID=11072219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19983782T Withdrawn DE19983782T1 (de) | 1998-12-03 | 1999-12-02 | Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch |
Country Status (6)
Country | Link |
---|---|
AU (1) | AU1408000A (de) |
CA (1) | CA2352868A1 (de) |
DE (1) | DE19983782T1 (de) |
GB (1) | GB2360008A (de) |
IL (1) | IL127388A0 (de) |
WO (1) | WO2000032349A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
DE10122335C1 (de) | 2001-05-08 | 2002-07-25 | Schott Glas | Verfahren und Vorrichtung zum Markieren von Glas mit einem Laser |
DE10140578A1 (de) * | 2001-08-18 | 2003-02-27 | Munser Norbert | Räumliches Innenschneiden (-trennen) von Materialien mittels Strahlung |
EP2194575B1 (de) | 2002-03-12 | 2017-08-16 | Hamamatsu Photonics K.K. | Verfahren zum Vereinzelnen eines Substrates |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
ES2784538T3 (es) * | 2003-05-30 | 2020-09-28 | Siemens Medical Solutions Usa Inc | Método para la fabricación de un componente de detector utilizando tecnología láser |
US7284396B2 (en) * | 2005-03-01 | 2007-10-23 | International Gemstone Registry Inc. | Method and system for laser marking in the volume of gemstones such as diamonds |
US20110073563A1 (en) * | 2009-09-25 | 2011-03-31 | Industrial Technology Research Institute | Patterning Method for Carbon-Based Substrate |
DE102010037273A1 (de) | 2010-09-02 | 2012-03-08 | Schott Ag | Verfahren und Vorrichtung zum Markieren von Glas |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4126626C2 (de) * | 1990-08-15 | 1994-08-04 | United Distillers Plc | Markierter Materialkörper und Verfahren zu dessen Herstellung |
AU5872994A (en) * | 1992-12-18 | 1994-07-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
IL108059A (en) * | 1993-12-17 | 1998-02-22 | Laser Ind Ltd | Method and device for placing a laser beam on a work surface, especially for tissue ablation |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
-
1998
- 1998-12-03 IL IL12738898A patent/IL127388A0/xx unknown
-
1999
- 1999-12-02 GB GB0113167A patent/GB2360008A/en not_active Withdrawn
- 1999-12-02 AU AU14080/00A patent/AU1408000A/en not_active Abandoned
- 1999-12-02 WO PCT/IL1999/000655 patent/WO2000032349A1/en active Application Filing
- 1999-12-02 CA CA002352868A patent/CA2352868A1/en not_active Abandoned
- 1999-12-02 DE DE19983782T patent/DE19983782T1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CA2352868A1 (en) | 2000-06-08 |
GB0113167D0 (en) | 2001-07-25 |
AU1408000A (en) | 2000-06-19 |
GB2360008A (en) | 2001-09-12 |
WO2000032349A1 (en) | 2000-06-08 |
IL127388A0 (en) | 1999-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |