DE19983782T1 - Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch - Google Patents

Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch

Info

Publication number
DE19983782T1
DE19983782T1 DE19983782T DE19983782T DE19983782T1 DE 19983782 T1 DE19983782 T1 DE 19983782T1 DE 19983782 T DE19983782 T DE 19983782T DE 19983782 T DE19983782 T DE 19983782T DE 19983782 T1 DE19983782 T1 DE 19983782T1
Authority
DE
Germany
Prior art keywords
lasers
application
material processing
optical breakdown
breakdown
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19983782T
Other languages
English (en)
Inventor
Vladimir Dmitriev
Nikolaj Guletskij
Sergej Osemkov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UNIVERSAL CRYSTAL Ltd
Original Assignee
UNIVERSAL CRYSTAL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UNIVERSAL CRYSTAL Ltd filed Critical UNIVERSAL CRYSTAL Ltd
Publication of DE19983782T1 publication Critical patent/DE19983782T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
DE19983782T 1998-12-03 1999-12-02 Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch Withdrawn DE19983782T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL12738898A IL127388A0 (en) 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown
PCT/IL1999/000655 WO2000032349A1 (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown

Publications (1)

Publication Number Publication Date
DE19983782T1 true DE19983782T1 (de) 2001-10-18

Family

ID=11072219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983782T Withdrawn DE19983782T1 (de) 1998-12-03 1999-12-02 Anwendung von Lasern zur Materialbearbeitung unter Verwendung von optischem Zusammenbruch

Country Status (6)

Country Link
AU (1) AU1408000A (de)
CA (1) CA2352868A1 (de)
DE (1) DE19983782T1 (de)
GB (1) GB2360008A (de)
IL (1) IL127388A0 (de)
WO (1) WO2000032349A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE10122335C1 (de) 2001-05-08 2002-07-25 Schott Glas Verfahren und Vorrichtung zum Markieren von Glas mit einem Laser
DE10140578A1 (de) * 2001-08-18 2003-02-27 Munser Norbert Räumliches Innenschneiden (-trennen) von Materialien mittels Strahlung
EP2194575B1 (de) 2002-03-12 2017-08-16 Hamamatsu Photonics K.K. Verfahren zum Vereinzelnen eines Substrates
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
ES2784538T3 (es) * 2003-05-30 2020-09-28 Siemens Medical Solutions Usa Inc Método para la fabricación de un componente de detector utilizando tecnología láser
US7284396B2 (en) * 2005-03-01 2007-10-23 International Gemstone Registry Inc. Method and system for laser marking in the volume of gemstones such as diamonds
US20110073563A1 (en) * 2009-09-25 2011-03-31 Industrial Technology Research Institute Patterning Method for Carbon-Based Substrate
DE102010037273A1 (de) 2010-09-02 2012-03-08 Schott Ag Verfahren und Vorrichtung zum Markieren von Glas
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126626C2 (de) * 1990-08-15 1994-08-04 United Distillers Plc Markierter Materialkörper und Verfahren zu dessen Herstellung
AU5872994A (en) * 1992-12-18 1994-07-19 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
IL108059A (en) * 1993-12-17 1998-02-22 Laser Ind Ltd Method and device for placing a laser beam on a work surface, especially for tissue ablation
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses

Also Published As

Publication number Publication date
CA2352868A1 (en) 2000-06-08
GB0113167D0 (en) 2001-07-25
AU1408000A (en) 2000-06-19
GB2360008A (en) 2001-09-12
WO2000032349A1 (en) 2000-06-08
IL127388A0 (en) 1999-10-28

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee