GB2360008A - Material processing applications of lasers using optical breakdown - Google Patents
Material processing applications of lasers using optical breakdownInfo
- Publication number
- GB2360008A GB2360008A GB0113167A GB0113167A GB2360008A GB 2360008 A GB2360008 A GB 2360008A GB 0113167 A GB0113167 A GB 0113167A GB 0113167 A GB0113167 A GB 0113167A GB 2360008 A GB2360008 A GB 2360008A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ultra
- optical breakdown
- fine
- material processing
- lasers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
New methods for laser material processing in optically transparent materials are described using the volume optical breakdown phenomenon. This occurs when ultra-short pulses of the order of tens of picoseconds or less, are focused into the volume of the material by means of a high quality focusing objective lens. A focal spot close to the diffraction limit for the laser wavelength is obtained within the material. A number of processing techniques are described which are impossible to perform with hitherto available methods, including ultra-fine hole drilling, ultra-fine cutting processes, ultra-fine resolution marking or image formation applied to the interior of a sample, including diamonds, and the formation of deep black images in plastic materials.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12738898A IL127388A0 (en) | 1998-12-03 | 1998-12-03 | Material processing applications of lasers using optical breakdown |
PCT/IL1999/000655 WO2000032349A1 (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0113167D0 GB0113167D0 (en) | 2001-07-25 |
GB2360008A true GB2360008A (en) | 2001-09-12 |
Family
ID=11072219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0113167A Withdrawn GB2360008A (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
Country Status (6)
Country | Link |
---|---|
AU (1) | AU1408000A (en) |
CA (1) | CA2352868A1 (en) |
DE (1) | DE19983782T1 (en) |
GB (1) | GB2360008A (en) |
IL (1) | IL127388A0 (en) |
WO (1) | WO2000032349A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4659300B2 (en) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | Laser processing method and semiconductor chip manufacturing method |
DE10122335C1 (en) * | 2001-05-08 | 2002-07-25 | Schott Glas | Process for marking glass comprises selecting the marking position along a drawing process having a glass transition temperature above the transformation temperature |
DE10140578A1 (en) * | 2001-08-18 | 2003-02-27 | Munser Norbert | Method for cutting complex profiled shapes from transparent materials uses focussed laser radiation to reduce the amount of waste material |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
CN100485902C (en) | 2002-03-12 | 2009-05-06 | 浜松光子学株式会社 | Substrate dividing method |
TWI520269B (en) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
EP1654111B1 (en) * | 2003-05-30 | 2020-02-12 | Siemens Medical Solutions USA, Inc. | Method for fabrication of a detector component using laser technology |
US7284396B2 (en) * | 2005-03-01 | 2007-10-23 | International Gemstone Registry Inc. | Method and system for laser marking in the volume of gemstones such as diamonds |
US20110073563A1 (en) * | 2009-09-25 | 2011-03-31 | Industrial Technology Research Institute | Patterning Method for Carbon-Based Substrate |
DE102010037273A1 (en) | 2010-09-02 | 2012-03-08 | Schott Ag | Method and device for marking glass |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206496A (en) * | 1990-08-15 | 1993-04-27 | United Distillers, Plc | Sub-surface marking |
US5575936A (en) * | 1992-12-18 | 1996-11-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
US5582752A (en) * | 1993-12-17 | 1996-12-10 | Laser Industries, Ltd. | Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
-
1998
- 1998-12-03 IL IL12738898A patent/IL127388A0/en unknown
-
1999
- 1999-12-02 CA CA002352868A patent/CA2352868A1/en not_active Abandoned
- 1999-12-02 AU AU14080/00A patent/AU1408000A/en not_active Abandoned
- 1999-12-02 GB GB0113167A patent/GB2360008A/en not_active Withdrawn
- 1999-12-02 DE DE19983782T patent/DE19983782T1/en not_active Withdrawn
- 1999-12-02 WO PCT/IL1999/000655 patent/WO2000032349A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206496A (en) * | 1990-08-15 | 1993-04-27 | United Distillers, Plc | Sub-surface marking |
US5575936A (en) * | 1992-12-18 | 1996-11-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
US5582752A (en) * | 1993-12-17 | 1996-12-10 | Laser Industries, Ltd. | Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
Also Published As
Publication number | Publication date |
---|---|
AU1408000A (en) | 2000-06-19 |
IL127388A0 (en) | 1999-10-28 |
CA2352868A1 (en) | 2000-06-08 |
DE19983782T1 (en) | 2001-10-18 |
WO2000032349A1 (en) | 2000-06-08 |
GB0113167D0 (en) | 2001-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) | ||
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |