WO2000032349A1 - Material processing applications of lasers using optical breakdown - Google Patents
Material processing applications of lasers using optical breakdown Download PDFInfo
- Publication number
- WO2000032349A1 WO2000032349A1 PCT/IL1999/000655 IL9900655W WO0032349A1 WO 2000032349 A1 WO2000032349 A1 WO 2000032349A1 IL 9900655 W IL9900655 W IL 9900655W WO 0032349 A1 WO0032349 A1 WO 0032349A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pulses
- laser radiation
- sample
- moving
- focal point
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU14080/00A AU1408000A (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
CA002352868A CA2352868A1 (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
DE19983782T DE19983782T1 (en) | 1998-12-03 | 1999-12-02 | Application of lasers for material processing using optical breakdown |
GB0113167A GB2360008A (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL12738898A IL127388A0 (en) | 1998-12-03 | 1998-12-03 | Material processing applications of lasers using optical breakdown |
IL127388 | 1998-12-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000032349A1 true WO2000032349A1 (en) | 2000-06-08 |
Family
ID=11072219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IL1999/000655 WO2000032349A1 (en) | 1998-12-03 | 1999-12-02 | Material processing applications of lasers using optical breakdown |
Country Status (6)
Country | Link |
---|---|
AU (1) | AU1408000A (en) |
CA (1) | CA2352868A1 (en) |
DE (1) | DE19983782T1 (en) |
GB (1) | GB2360008A (en) |
IL (1) | IL127388A0 (en) |
WO (1) | WO2000032349A1 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10122335C1 (en) * | 2001-05-08 | 2002-07-25 | Schott Glas | Process for marking glass comprises selecting the marking position along a drawing process having a glass transition temperature above the transformation temperature |
DE10140578A1 (en) * | 2001-08-18 | 2003-02-27 | Munser Norbert | Method for cutting complex profiled shapes from transparent materials uses focussed laser radiation to reduce the amount of waste material |
US7284396B2 (en) * | 2005-03-01 | 2007-10-23 | International Gemstone Registry Inc. | Method and system for laser marking in the volume of gemstones such as diamonds |
CN101670493A (en) * | 2000-09-13 | 2010-03-17 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
US20110073563A1 (en) * | 2009-09-25 | 2011-03-31 | Industrial Technology Research Institute | Patterning Method for Carbon-Based Substrate |
US8470214B2 (en) * | 2003-05-30 | 2013-06-25 | Siemens Medical Solutions Usa, Inc. | Method for fabrication of a detector component using laser technology |
US8865566B2 (en) | 2002-12-03 | 2014-10-21 | Hamamatsu Photonics K.K. | Method of cutting semiconductor substrate |
US8872870B2 (en) | 2010-09-02 | 2014-10-28 | Schott Ag | Method and apparatus for marking glass |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206496A (en) * | 1990-08-15 | 1993-04-27 | United Distillers, Plc | Sub-surface marking |
US5575936A (en) * | 1992-12-18 | 1996-11-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
US5582752A (en) * | 1993-12-17 | 1996-12-10 | Laser Industries, Ltd. | Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
-
1998
- 1998-12-03 IL IL12738898A patent/IL127388A0/en unknown
-
1999
- 1999-12-02 DE DE19983782T patent/DE19983782T1/en not_active Withdrawn
- 1999-12-02 GB GB0113167A patent/GB2360008A/en not_active Withdrawn
- 1999-12-02 AU AU14080/00A patent/AU1408000A/en not_active Abandoned
- 1999-12-02 WO PCT/IL1999/000655 patent/WO2000032349A1/en active Application Filing
- 1999-12-02 CA CA002352868A patent/CA2352868A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5206496A (en) * | 1990-08-15 | 1993-04-27 | United Distillers, Plc | Sub-surface marking |
US5575936A (en) * | 1992-12-18 | 1996-11-19 | Firebird Traders Ltd. | Process and apparatus for etching an image within a solid article |
US5582752A (en) * | 1993-12-17 | 1996-12-10 | Laser Industries, Ltd. | Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue |
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
Cited By (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8946592B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US10796959B2 (en) | 2000-09-13 | 2020-10-06 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
CN111633349A (en) * | 2000-09-13 | 2020-09-08 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
US9837315B2 (en) | 2000-09-13 | 2017-12-05 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
CN101670493A (en) * | 2000-09-13 | 2010-03-17 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
CN106825940A (en) * | 2000-09-13 | 2017-06-13 | 浜松光子学株式会社 | Laser processing and laser processing device |
US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
CN103537796A (en) * | 2000-09-13 | 2014-01-29 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
CN103537796B (en) * | 2000-09-13 | 2016-03-02 | 浜松光子学株式会社 | Laser processing and laser processing device |
CN103551747A (en) * | 2000-09-13 | 2014-02-05 | 浜松光子学株式会社 | Laser beam machining method and laser beam machining device |
CN103612338A (en) * | 2000-09-13 | 2014-03-05 | 浜松光子学株式会社 | Machining method |
CN105108348A (en) * | 2000-09-13 | 2015-12-02 | 浜松光子学株式会社 | Laser processing method and laser processing apparatus |
CN103612338B (en) * | 2000-09-13 | 2015-07-15 | 浜松光子学株式会社 | Machining method |
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
US8937264B2 (en) | 2000-09-13 | 2015-01-20 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US8946591B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of manufacturing a semiconductor device formed using a substrate cutting method |
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
CN103551738A (en) * | 2000-09-13 | 2014-02-05 | 浜松光子学株式会社 | Laser beam machining method and laser beam machining device |
US6674043B2 (en) | 2001-05-08 | 2004-01-06 | Schott Glas | Method and apparatus for marking glass with a laser |
DE10122335C1 (en) * | 2001-05-08 | 2002-07-25 | Schott Glas | Process for marking glass comprises selecting the marking position along a drawing process having a glass transition temperature above the transformation temperature |
DE10140578A1 (en) * | 2001-08-18 | 2003-02-27 | Munser Norbert | Method for cutting complex profiled shapes from transparent materials uses focussed laser radiation to reduce the amount of waste material |
US9543256B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
US10622255B2 (en) | 2002-03-12 | 2020-04-14 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9711405B2 (en) | 2002-03-12 | 2017-07-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9287177B2 (en) | 2002-03-12 | 2016-03-15 | Hamamatsu Photonics K.K. | Substrate dividing method |
US11424162B2 (en) | 2002-03-12 | 2022-08-23 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543207B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9548246B2 (en) | 2002-03-12 | 2017-01-17 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9553023B2 (en) | 2002-03-12 | 2017-01-24 | Hamamatsu Photonics K.K. | Substrate dividing method |
US10068801B2 (en) | 2002-03-12 | 2018-09-04 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8865566B2 (en) | 2002-12-03 | 2014-10-21 | Hamamatsu Photonics K.K. | Method of cutting semiconductor substrate |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
US8470214B2 (en) * | 2003-05-30 | 2013-06-25 | Siemens Medical Solutions Usa, Inc. | Method for fabrication of a detector component using laser technology |
EP1654111A4 (en) * | 2003-05-30 | 2016-09-07 | Siemens Medical Solutions | Method for fabrication of a detector component using laser technology |
US7284396B2 (en) * | 2005-03-01 | 2007-10-23 | International Gemstone Registry Inc. | Method and system for laser marking in the volume of gemstones such as diamonds |
US20110073563A1 (en) * | 2009-09-25 | 2011-03-31 | Industrial Technology Research Institute | Patterning Method for Carbon-Based Substrate |
US8872870B2 (en) | 2010-09-02 | 2014-10-28 | Schott Ag | Method and apparatus for marking glass |
US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11219966B1 (en) | 2018-12-29 | 2022-01-11 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
US11826846B2 (en) | 2018-12-29 | 2023-11-28 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US11901181B2 (en) | 2018-12-29 | 2024-02-13 | Wolfspeed, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
US11911842B2 (en) | 2018-12-29 | 2024-02-27 | Wolfspeed, Inc. | Laser-assisted method for parting crystalline material |
US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11034056B2 (en) | 2019-05-17 | 2021-06-15 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
US11654596B2 (en) | 2019-05-17 | 2023-05-23 | Wolfspeed, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
Also Published As
Publication number | Publication date |
---|---|
GB2360008A (en) | 2001-09-12 |
GB0113167D0 (en) | 2001-07-25 |
DE19983782T1 (en) | 2001-10-18 |
CA2352868A1 (en) | 2000-06-08 |
IL127388A0 (en) | 1999-10-28 |
AU1408000A (en) | 2000-06-19 |
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