IL127388A0 - Material processing applications of lasers using optical breakdown - Google Patents

Material processing applications of lasers using optical breakdown

Info

Publication number
IL127388A0
IL127388A0 IL12738898A IL12738898A IL127388A0 IL 127388 A0 IL127388 A0 IL 127388A0 IL 12738898 A IL12738898 A IL 12738898A IL 12738898 A IL12738898 A IL 12738898A IL 127388 A0 IL127388 A0 IL 127388A0
Authority
IL
Israel
Prior art keywords
lasers
material processing
processing applications
optical breakdown
breakdown
Prior art date
Application number
IL12738898A
Original Assignee
Universal Crystal Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Crystal Ltd filed Critical Universal Crystal Ltd
Priority to IL12738898A priority Critical patent/IL127388A0/en
Publication of IL127388A0 publication Critical patent/IL127388A0/en
Priority to DE19983782T priority patent/DE19983782T1/en
Priority to PCT/IL1999/000655 priority patent/WO2000032349A1/en
Priority to CA002352868A priority patent/CA2352868A1/en
Priority to GB0113167A priority patent/GB2360008A/en
Priority to AU14080/00A priority patent/AU1408000A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
IL12738898A 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown IL127388A0 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IL12738898A IL127388A0 (en) 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown
DE19983782T DE19983782T1 (en) 1998-12-03 1999-12-02 Application of lasers for material processing using optical breakdown
PCT/IL1999/000655 WO2000032349A1 (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown
CA002352868A CA2352868A1 (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown
GB0113167A GB2360008A (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown
AU14080/00A AU1408000A (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL12738898A IL127388A0 (en) 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown

Publications (1)

Publication Number Publication Date
IL127388A0 true IL127388A0 (en) 1999-10-28

Family

ID=11072219

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12738898A IL127388A0 (en) 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown

Country Status (6)

Country Link
AU (1) AU1408000A (en)
CA (1) CA2352868A1 (en)
DE (1) DE19983782T1 (en)
GB (1) GB2360008A (en)
IL (1) IL127388A0 (en)
WO (1) WO2000032349A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (en) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
DE10122335C1 (en) 2001-05-08 2002-07-25 Schott Glas Process for marking glass comprises selecting the marking position along a drawing process having a glass transition temperature above the transformation temperature
DE10140578A1 (en) * 2001-08-18 2003-02-27 Munser Norbert Method for cutting complex profiled shapes from transparent materials uses focussed laser radiation to reduce the amount of waste material
ATE362653T1 (en) 2002-03-12 2007-06-15 Hamamatsu Photonics Kk METHOD FOR SEPARATING SUBSTRATES
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (en) 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate
US8470214B2 (en) * 2003-05-30 2013-06-25 Siemens Medical Solutions Usa, Inc. Method for fabrication of a detector component using laser technology
US7284396B2 (en) * 2005-03-01 2007-10-23 International Gemstone Registry Inc. Method and system for laser marking in the volume of gemstones such as diamonds
US20110073563A1 (en) * 2009-09-25 2011-03-31 Industrial Technology Research Institute Patterning Method for Carbon-Based Substrate
DE102010037273A1 (en) 2010-09-02 2012-03-08 Schott Ag Method and device for marking glass
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL99170A0 (en) * 1990-08-15 1992-07-15 United Distillers Plc Method and apparatus for sub-surface marking
AU5872994A (en) * 1992-12-18 1994-07-19 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
IL108059A (en) * 1993-12-17 1998-02-22 Laser Ind Ltd Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses

Also Published As

Publication number Publication date
CA2352868A1 (en) 2000-06-08
AU1408000A (en) 2000-06-19
GB0113167D0 (en) 2001-07-25
GB2360008A (en) 2001-09-12
WO2000032349A1 (en) 2000-06-08
DE19983782T1 (en) 2001-10-18

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