DE19782034T1 - Verfahren und Vorrichtungen zum Messen und Abgeben von Behandlungslösungen an eine CMP-Maschine - Google Patents

Verfahren und Vorrichtungen zum Messen und Abgeben von Behandlungslösungen an eine CMP-Maschine

Info

Publication number
DE19782034T1
DE19782034T1 DE19782034T DE19782034T DE19782034T1 DE 19782034 T1 DE19782034 T1 DE 19782034T1 DE 19782034 T DE19782034 T DE 19782034T DE 19782034 T DE19782034 T DE 19782034T DE 19782034 T1 DE19782034 T1 DE 19782034T1
Authority
DE
Germany
Prior art keywords
measuring
methods
devices
treatment solutions
cmp machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782034T
Other languages
English (en)
Inventor
Gregory A Olsen
Carey R Smith
Wayne Pratt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Corp filed Critical Speedfam Corp
Publication of DE19782034T1 publication Critical patent/DE19782034T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
    • G01F15/02—Compensating or correcting for variations in pressure, density or temperature
    • G01F15/022—Compensating or correcting for variations in pressure, density or temperature using electrical means
    • G01F15/024—Compensating or correcting for variations in pressure, density or temperature using electrical means involving digital counting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
    • G01F1/78—Direct mass flowmeters
    • G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
    • G01F1/84—Coriolis or gyroscopic mass flowmeters
    • G01F1/8409—Coriolis or gyroscopic mass flowmeters constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
    • G01F1/78—Direct mass flowmeters
    • G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
    • G01F1/84—Coriolis or gyroscopic mass flowmeters
    • G01F1/8409—Coriolis or gyroscopic mass flowmeters constructional details
    • G01F1/8413—Coriolis or gyroscopic mass flowmeters constructional details means for influencing the flowmeter's motional or vibrational behaviour, e.g., conduit support or fixing means, or conduit attachments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
    • G01F1/78—Direct mass flowmeters
    • G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
    • G01F1/84—Coriolis or gyroscopic mass flowmeters
    • G01F1/8409—Coriolis or gyroscopic mass flowmeters constructional details
    • G01F1/844—Coriolis or gyroscopic mass flowmeters constructional details microfluidic or miniaturised flowmeters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/76—Devices for measuring mass flow of a fluid or a fluent solid material
    • G01F1/78—Direct mass flowmeters
    • G01F1/80—Direct mass flowmeters operating by measuring pressure, force, momentum, or frequency of a fluid flow to which a rotational movement has been imparted
    • G01F1/84—Coriolis or gyroscopic mass flowmeters
    • G01F1/845—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits
    • G01F1/8468—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits
    • G01F1/8472—Coriolis or gyroscopic mass flowmeters arrangements of measuring means, e.g., of measuring conduits vibrating measuring conduits having curved measuring conduits, i.e. whereby the measuring conduits' curved center line lies within a plane

Landscapes

  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Measuring Volume Flow (AREA)
DE19782034T 1996-10-02 1997-10-01 Verfahren und Vorrichtungen zum Messen und Abgeben von Behandlungslösungen an eine CMP-Maschine Withdrawn DE19782034T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/720,744 US5857893A (en) 1996-10-02 1996-10-02 Methods and apparatus for measuring and dispensing processing solutions to a CMP machine
PCT/US1997/017825 WO1998014305A1 (en) 1996-10-02 1997-10-01 Methods and apparatus for measuring and dispensing processing solutions to a cmp machine

Publications (1)

Publication Number Publication Date
DE19782034T1 true DE19782034T1 (de) 1999-09-02

Family

ID=24895125

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782034T Withdrawn DE19782034T1 (de) 1996-10-02 1997-10-01 Verfahren und Vorrichtungen zum Messen und Abgeben von Behandlungslösungen an eine CMP-Maschine

Country Status (7)

Country Link
US (1) US5857893A (de)
JP (1) JP2001515412A (de)
KR (1) KR20000048817A (de)
DE (1) DE19782034T1 (de)
GB (1) GB2333257B (de)
TW (1) TW370612B (de)
WO (1) WO1998014305A1 (de)

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US8447534B2 (en) 1997-11-26 2013-05-21 Invensys Systems, Inc. Digital flowmeter
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US7784360B2 (en) 1999-11-22 2010-08-31 Invensys Systems, Inc. Correcting for two-phase flow in a digital flowmeter
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TW396441B (en) * 1998-06-02 2000-07-01 United Microelectronics Corp A slurry non-stop supply method and apparatus
US6123602A (en) * 1998-07-30 2000-09-26 Lucent Technologies Inc. Portable slurry distribution system
DE19845241A1 (de) * 1998-10-01 2000-04-13 Politec Gmbh Ges Fuer Schleif Verfahren zum Dosieren von fließfähigen Poliermitteln und Dosiervorrichtung hierfür
US20030010792A1 (en) 1998-12-30 2003-01-16 Randy Forshey Chemical mix and delivery systems and methods thereof
US6183341B1 (en) * 1999-02-09 2001-02-06 Strasbaugh, Inc. Slurry pump control system
US6099386A (en) * 1999-03-04 2000-08-08 Mosel Vitelic Inc. Control device for maintaining a chemical mechanical polishing machine in a wet mode
US6048256A (en) * 1999-04-06 2000-04-11 Lucent Technologies Inc. Apparatus and method for continuous delivery and conditioning of a polishing slurry
US6589872B1 (en) * 1999-05-03 2003-07-08 Taiwan Semiconductor Manufacturing Company Use of low-high slurry flow to eliminate copper line damages
EP1094506A3 (de) 1999-10-18 2004-03-03 Applied Materials, Inc. Schutzschicht für Filme mit besonders kleiner Dielektrizitätskonstante
US6544109B1 (en) 2000-08-31 2003-04-08 Micron Technology, Inc. Slurry delivery and planarization systems
US6409051B1 (en) * 2000-09-28 2002-06-25 Lam Research Corporation Method and apparatus for dispensing a fluid media
US6431950B1 (en) * 2000-10-18 2002-08-13 Micron Technology, Inc. Point-of-use fluid regulating system for use in the chemical-mechanical planarization of semiconductor wafers
US6561381B1 (en) 2000-11-20 2003-05-13 Applied Materials, Inc. Closed loop control over delivery of liquid material to semiconductor processing tool
JP2002170792A (ja) * 2000-11-29 2002-06-14 Mitsubishi Electric Corp 研磨液供給装置及び研磨液供給方法、研磨装置及び研磨方法、並びに、半導体装置の製造方法
US6416392B1 (en) * 2000-11-30 2002-07-09 Seh America, Inc. Sound enhanced lapping process
US6749086B2 (en) 2000-12-01 2004-06-15 Applied Materials Inc. Pressurized liquid delivery module
US6957749B2 (en) * 2000-12-01 2005-10-25 Applied Materials, Inc. Liquid delivery system
US6949466B2 (en) * 2001-09-18 2005-09-27 Oriol Inc. CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
US7292993B2 (en) * 2001-02-08 2007-11-06 Uzzo Anthony M System for remotely managing bulk product storage
US6756308B2 (en) * 2001-02-13 2004-06-29 Ekc Technology, Inc. Chemical-mechanical planarization using ozone
JP2002313753A (ja) * 2001-04-19 2002-10-25 Tokyo Seimitsu Co Ltd ダイシング装置の切削水供給管理装置
US6652366B2 (en) 2001-05-16 2003-11-25 Speedfam-Ipec Corporation Dynamic slurry distribution control for CMP
US6572445B2 (en) 2001-05-16 2003-06-03 Speedfam-Ipec Multizone slurry delivery for chemical mechanical polishing tool
US6893321B1 (en) * 2001-11-02 2005-05-17 Buehler Ltd. Modular fluid-dispensing system
US7070067B1 (en) 2001-11-02 2006-07-04 Buehler, Ltd. Modular fluid-dispensing system
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
US6606917B2 (en) * 2001-11-26 2003-08-19 Emerson Electric Co. High purity coriolis mass flow controller
US20030098069A1 (en) * 2001-11-26 2003-05-29 Sund Wesley E. High purity fluid delivery system
US6464562B1 (en) * 2001-12-19 2002-10-15 Winbond Electronics Corporation System and method for in-situ monitoring slurry flow rate during a chemical mechanical polishing process
US6855031B2 (en) * 2002-02-08 2005-02-15 Applied Materials, Inc. Slurry flow rate monitoring in chemical-mechanical polisher using pressure transducer
CN1305115C (zh) * 2002-09-29 2007-03-14 台湾积体电路制造股份有限公司 利用复合控制模式的研浆流量控制方法及系统
US20040184890A1 (en) * 2003-03-19 2004-09-23 Shin-Tong Wu Fluid transport system with vibrators
JP4718107B2 (ja) * 2003-05-20 2011-07-06 株式会社荏原製作所 基板保持装置及び研磨装置
JP4719692B2 (ja) * 2004-02-06 2011-07-06 セヨニック エス．アー． ピペット検査装置及びそれを取り付けたピペット
KR100625323B1 (ko) 2005-08-23 2006-09-15 세메스 주식회사 급변하는 공정에서 실시간으로 인터락 제어를 위한 반도체제조 설비 및 그 방법
KR100673787B1 (ko) * 2005-10-28 2007-01-24 동부일렉트로닉스 주식회사 씨엠피 장치용 슬러리 공급 장치
US8360817B2 (en) * 2009-04-01 2013-01-29 Ebara Corporation Polishing apparatus and polishing method
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JP2015134393A (ja) * 2014-01-17 2015-07-27 株式会社荏原製作所 キャリブレーション装置、及び基板処理装置

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Also Published As

Publication number Publication date
GB9906709D0 (en) 1999-05-19
GB2333257B (en) 2000-12-20
GB2333257A (en) 1999-07-21
WO1998014305A1 (en) 1998-04-09
TW370612B (en) 1999-09-21
US5857893A (en) 1999-01-12
JP2001515412A (ja) 2001-09-18
KR20000048817A (ko) 2000-07-25

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: SPEEDFAM-IPEC CORP.(N.D.GES.D.STAATES DELAWARE), C

8607 Notification of search results after publication
8139 Disposal/non-payment of the annual fee