DE19729851C2 - Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection - Google Patents

Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Info

Publication number
DE19729851C2
DE19729851C2 DE1997129851 DE19729851A DE19729851C2 DE 19729851 C2 DE19729851 C2 DE 19729851C2 DE 1997129851 DE1997129851 DE 1997129851 DE 19729851 A DE19729851 A DE 19729851A DE 19729851 C2 DE19729851 C2 DE 19729851C2
Authority
DE
Germany
Prior art keywords
compression spring
contact surface
attachment
electronic component
cooling contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1997129851
Other languages
German (de)
Other versions
DE19729851A1 (en
Inventor
Heinz Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE1997129851 priority Critical patent/DE19729851C2/en
Publication of DE19729851A1 publication Critical patent/DE19729851A1/en
Application granted granted Critical
Publication of DE19729851C2 publication Critical patent/DE19729851C2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

Die Erfindung betrifft die Befestigung eines elektronischen Bauteils auf der ebenen Kühlkontaktfläche eines Aluminium-Strangpressprofils mittels einer aus Flachmaterial gebogenen Druckfeder nach dem Oberbegriff des Anspruchs 1. Eine derartige Befestigung ist aus der deutschen Offenlegungsschrift 41 41 650 bekannt.The invention relates to the attachment of an electronic component on the plane Cooling contact surface of an extruded aluminum profile by means of a flat material curved compression spring according to the preamble of claim 1. Such an attachment is known from German Offenlegungsschrift 41 41 650.

Bei dieser bekannten gattungsgemäßen Befestigung ist in die wärmeaufnehmende Fläche des Kühlkörpers (Kühlkontaktfläche) eine über ihre gesamte Tiefe schräg verlaufende schlitzförmige Aufnahmeöffnung eingeformt, in die das im wesentlichen eben ausgebildete eine Schenkelende der Druckfeder (Andruckklammer) einschiebbar ist und wobei der andere Schenkel der Druckfeder das elektronische Bauteil gegen die wärmeaufnehmende Fläche presst.In this known generic attachment is in the heat-absorbing surface Heatsink (cooling contact surface) a sloping over its entire depth slot-shaped receiving opening formed in which the substantially flat one leg end of the compression spring (pressure clip) can be inserted and the other Leg of the compression spring the electronic component against the heat-absorbing surface pressed.

Nachteilig dabei ist, dass die in der schlitzförmigen Aufnahmeöffnung lediglich reibschlüssig gehaltene Druckfeder bei Vibrationsbeanspruchung aus dieser Aufnahmeöffnung auswandern kann.The disadvantage here is that in the slot-shaped receiving opening only frictionally If the compression spring is subjected to vibrations, move it out of this receiving opening can.

Soweit bei diesem Stand der Technik eine weitere Ausführungsform mit Schnappsitz offenbart ist, ist dieser in einer zur wärmeaufnehmenden Fläche senkrechten Seitenfläche ausgebildet derart, dass die Druckfeder mit ihrem im wesentlichen spiralig bzw σ-förmig gebogenen Ende an der in die breite Aufnahmeöffnung ragende (erste) Nase aufgebogen wird und in die Hinterschneidung hinter dieser Nase einschnappt. Nachteilig dabei ist, dass ein derartiger Schnappsitz einen hohen Platzbedarf hat.As far as in this prior art another embodiment with a snap fit is disclosed, this is in a side surface perpendicular to the heat-absorbing surface formed in such a way that the compression spring with its essentially spiral or σ-shaped bent end at the (first) nose protruding into the wide receiving opening and snaps into the undercut behind that nose. The disadvantage here is that a such snap fit has a high space requirement.

Es ist auch bekannt, elektronische Bauteile auf Alu-Strang­ preßkühlprofile mittels Schrauben zu befestigen, ebenso ist Stand der Technik, Druckfedern in Nuten per Werkzeug zu pressen und Andruckfedern über Schraubkanäle zu ver­ schrauben. Dabei ist es allerdings nötig, eine Vielzahl an Werkzeugen und Vorleistungen bereitzustellen.It is also known to cast electronic components on aluminum Press cooling profiles to be fastened by means of screws State of the art, compression springs in grooves using a tool presses and pressure springs via screw channels Screw. However, it is necessary to offer a variety of To provide tools and advance services.

Der Erfindung liegt demgegenüber das Problem zugrunde, eine sichere Befestigung elektronischer Bauteile auf der Kühlkontaktfläche eines Aluminium-Strangpressprofils insbesondere auch bei Vibrationsbeanspruchung auf einfache, kostengünstige Weise und ohne Werkzeug zu schaffen, die ein variables Positionieren der Bauteile auf der Kühlkontaktfläche sowohl beim Einbau als auch beim Auswechseln ermöglicht.The invention is based on the problem of secure attachment electronic components on the cooling contact surface of an aluminum extruded profile especially in the case of vibration stress in a simple, inexpensive manner and without  To create tools that allow variable positioning of the components on the cooling contact surface both when installing and when replacing.

Dieses Problem wird durch die im Patentanspruch 1 angegebenen Merkmale gelöst.This problem is solved by the features specified in claim 1.

Ein vorteilhafte Weiterbildung der Erfindung ist im Patentanspruch 2 angegeben.An advantageous development of the invention is specified in claim 2.

Die mit der Erfindung erzielten Vorteile bestehen insbe­ sondere darin, daß außer der Druckfeder keine weiteren Ver­ bindungselemente erforderlich sind, und keine Vorarbeiten, wie Ge­ winde schneiden, zu leisten sind; außerdem sind keine An­ zugsmomente einzuhalten und zu kontrollieren. Die Kühlflä­ che bleibt als plane Fläche erhalten und somit ohne Ein­ schränkung nutzbar.The advantages achieved with the invention are in particular special in that apart from the compression spring no further Ver Binding elements are required, and no preparatory work, such as Ge cut winds to be performed; also there are no on Comply with and control tensile torques. The cooling surface surface remains as a flat surface and therefore without an on restriction usable.

Vorteilhaft wirkt sich auch aus, daß die Montagearbeiten durch eine Hilfskraft durchzuführen sind.Also advantageous is that the assembly work to be carried out by an assistant.

Ein Ausführungsbeispiel ist in der Zeichnung dargestellt und wird folgend näher beschrieben:An embodiment is shown in the drawing and is described in more detail below:

Fig. 1 zeigt die Einzelteile (Auswahl)
Alu-Strangpreßprofil (1)
Druckfeder (2)
elektronisches Bauteil (3)
Nut (4) Fig. 1 shows the individual parts (selection)
Extruded aluminum profile ( 1 )
Compression spring ( 2 )
electronic component ( 3 )
Groove ( 4 )

Fig. 2 zeigt die Montage der Teile.
Das elektronische Bauteil (3) wird auf das Alu-Strangpreßprofil (1) aufgelegt, die Druckfeder (2) in die Nut (4) eingelegt, durch Drücken auf die Federoberkante (F) in einem Winkel von ca. 30° zur Bauteilebene wird die Feder vorgespannt, bis sie hörbar einrastet. Fig. 2 shows the assembly of the parts.
The electronic component ( 3 ) is placed on the extruded aluminum profile ( 1 ), the compression spring ( 2 ) is inserted in the groove ( 4 ), by pressing the upper edge of the tongue (F) at an angle of approx. 30 ° to the component level The spring is biased until you hear it click into place.

Fig. 3 zeigt die komplette Befestigung. Fig. 3 shows the complete attachment.

Claims (2)

1. Befestigung eines elektronischen Bauteils (3) auf der ebenen Kühlkontaktfläche eines Aluminium-Strangpreßprofils (1) mittels einer aus Flachmaterial gebogenen Druckfeder (2), wobei das freie Ende des einen Schenkels der Druckfeder (2) in eine über die Kühlkontaktfläche sich erstreckende schmale Nut (4) eindrückbar ist und der andere Schenkel das Bauteil (3) gegen die Kühlkontaktfläche presst, dadurch gekennzeichnet, dass die Nut (4) in ihrem oberen Teil zur Kühlkontaktfläche hin senkrecht abgesetzt ist und in ihrem unteren Teil zur Kühlkontaktfläche schräg zum anzupressenden Bauteil (3) hin verläuft und dass das freie Ende des einen Druckfeder-Schenkels abgewinkelt ist derart, dass die Druckfeder (2) beim Eindrücken in die Nut (4) vorgespannt wird, bis sie selbsthemmend in der Nut (4) einrastet und eine lösbare Schnappverbindung bildet.1. Attachment of an electronic component ( 3 ) on the flat cooling contact surface of an aluminum extruded profile ( 1 ) by means of a compression spring ( 2 ) bent from flat material, the free end of one leg of the compression spring ( 2 ) extending into a narrow one extending over the cooling contact surface Groove ( 4 ) can be pressed in and the other leg presses the component ( 3 ) against the cooling contact surface, characterized in that the groove ( 4 ) is offset vertically in its upper part towards the cooling contact surface and in its lower part obliquely to the cooling contact surface to the component to be pressed ( 3 ) runs and that the free end of one compression spring leg is angled such that the compression spring ( 2 ) is biased when pressed into the groove ( 4 ) until it snaps into the groove ( 4 ) and a releasable snap connection forms. 2. Befestigung eines elektronischen Bauteils nach Anspruch 1, dadurch gekennzeichnet, dass die Kühlkontaktfläche zwei voneinander beabstandete, sich parallel erstreckende Nuten (4) aufweist.2. Attachment of an electronic component according to claim 1, characterized in that the cooling contact surface has two spaced apart, parallel grooves ( 4 ).
DE1997129851 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection Expired - Lifetime DE19729851C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997129851 DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997129851 DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Publications (2)

Publication Number Publication Date
DE19729851A1 DE19729851A1 (en) 1999-01-14
DE19729851C2 true DE19729851C2 (en) 2003-03-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997129851 Expired - Lifetime DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Country Status (1)

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DE (1) DE19729851C2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10326458B4 (en) 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Cooling arrangement for electronic components
DE102007050985A1 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Crab
ITPS20100019A1 (en) * 2010-07-16 2012-01-17 Gorini S R L HEAT SINK WITH QUICK CONNECTING MEANS FOR ELECTRONIC COMPONENTS
CN106711107B (en) * 2015-07-23 2019-02-15 江苏宏微科技股份有限公司 Screwless fastening type power module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8910677U1 (en) * 1989-09-07 1989-10-19 Asea Brown Boveri Ag, 6800 Mannheim, De
DE4141650A1 (en) * 1991-12-17 1993-06-24 Vero Electronics Gmbh Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8910677U1 (en) * 1989-09-07 1989-10-19 Asea Brown Boveri Ag, 6800 Mannheim, De
DE4141650A1 (en) * 1991-12-17 1993-06-24 Vero Electronics Gmbh Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
07-302867 A *
JP Patent Abstracts of Japan: 08-139239 A *

Also Published As

Publication number Publication date
DE19729851A1 (en) 1999-01-14

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
OP8 Request for examination as to paragraph 44 patent law
8122 Nonbinding interest in granting licences declared
8304 Grant after examination procedure
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE

8381 Inventor (new situation)

Inventor name: ERNST, HEINZ, 94369 RAIN, DE

R071 Expiry of right