DE8910677U1 - - Google Patents

Info

Publication number
DE8910677U1
DE8910677U1 DE8910677U DE8910677U DE8910677U1 DE 8910677 U1 DE8910677 U1 DE 8910677U1 DE 8910677 U DE8910677 U DE 8910677U DE 8910677 U DE8910677 U DE 8910677U DE 8910677 U1 DE8910677 U1 DE 8910677U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8910677U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
Asea Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri AG Germany filed Critical Asea Brown Boveri AG Germany
Priority to DE8910677U priority Critical patent/DE8910677U1/de
Publication of DE8910677U1 publication Critical patent/DE8910677U1/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8910677U 1989-09-07 1989-09-07 Expired DE8910677U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8910677U DE8910677U1 (en) 1989-09-07 1989-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8910677U DE8910677U1 (en) 1989-09-07 1989-09-07

Publications (1)

Publication Number Publication Date
DE8910677U1 true DE8910677U1 (en) 1989-10-19

Family

ID=6842626

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8910677U Expired DE8910677U1 (en) 1989-09-07 1989-09-07

Country Status (1)

Country Link
DE (1) DE8910677U1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9004903U1 (en) * 1990-04-30 1990-07-05 Ing. Rolf Seifert Electronic Gmbh, 5828 Ennepetal, De
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
DE19514619A1 (en) * 1995-04-25 1996-12-12 Duerrwaechter E Dr Doduco Power semiconductor heat-sink arrangement
DE19729851A1 (en) * 1997-07-11 1999-01-14 Heinz Ernst Compression spring fastener for electronic component
WO2005050738A1 (en) * 2003-11-18 2005-06-02 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Cooling device for an electric component
WO2009053159A2 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Fixing clamp

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9004903U1 (en) * 1990-04-30 1990-07-05 Ing. Rolf Seifert Electronic Gmbh, 5828 Ennepetal, De
DE4218224A1 (en) * 1992-06-03 1993-12-09 Asea Brown Boveri Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
DE19514619A1 (en) * 1995-04-25 1996-12-12 Duerrwaechter E Dr Doduco Power semiconductor heat-sink arrangement
DE19729851A1 (en) * 1997-07-11 1999-01-14 Heinz Ernst Compression spring fastener for electronic component
DE19729851C2 (en) * 1997-07-11 2003-03-06 Heinz Ernst Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection
WO2005050738A1 (en) * 2003-11-18 2005-06-02 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Cooling device for an electric component
DE10353849B4 (en) * 2003-11-18 2009-05-07 Infineon Technologies Ag Pressing element for pressing an electrical pre-cooling part to be cooled against a cooling element, system for cooling an electrical component, and component arrangement with an electrical component to be cooled
WO2009053159A2 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Fixing clamp
WO2009053159A3 (en) * 2007-10-25 2009-06-25 Bosch Gmbh Robert Fixing clamp

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