DE19729851A1 - Compression spring fastener for electronic component - Google Patents
Compression spring fastener for electronic componentInfo
- Publication number
- DE19729851A1 DE19729851A1 DE1997129851 DE19729851A DE19729851A1 DE 19729851 A1 DE19729851 A1 DE 19729851A1 DE 1997129851 DE1997129851 DE 1997129851 DE 19729851 A DE19729851 A DE 19729851A DE 19729851 A1 DE19729851 A1 DE 19729851A1
- Authority
- DE
- Germany
- Prior art keywords
- compression spring
- fastening
- attachment
- electronic component
- oblique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000006835 compression Effects 0.000 title claims abstract description 7
- 238000007906 compression Methods 0.000 title claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000001125 extrusion Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 210000003813 thumb Anatomy 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Es ist bekannt, elektronische Bauteile auf Alu-Strangpreßkühlprofile mittels Schrauben zu befestigen, ebenso ist Stand der Technik Druckfedern in Nuten per Werkzeug zu pressen und Andruckfedern über Schraubkanäle zu verschrauben. Dabei ist es allerdings nötig, eine Vielzahl an Werkzeugen und Vorleistungen bereitzustellen.It is known to fasten electronic components on aluminum extrusion cooling profiles by means of screws, as is State of the art to press compression springs in grooves using a tool and pressure springs via screw channels screw together. However, it is necessary to provide a variety of tools and upfront services.
Der im Patentanspruch 1 angegebenen Erfindung liegt das Problem zugrunde die Befestigung der elektronischen Bauteile zu vereinfachen, einen Bauteilewechsel einfach zu ermöglichen und die Kühlfläche nicht durch Stege ein zuschränken.The invention specified in claim 1 is based on the problem of fastening the electronic Simplify components, make it easy to change components and the cooling surface is not blocked by webs to restrict.
Dieses Problem wird durch die im Patentanspruch 1 aufgeführten Merkmale gelöst.This problem is solved by the features listed in claim 1.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß außer der Druckfeder keine weiteren Verbindungselemente erforderlich, und Vorarbeiten wie Gewinde schneiden, zu leisten sind, außerdem sind keine Anzugsmomente einzuhalten und zu kontrollieren, die Kühlfläche bleibt als plane Fläche erhalten und somit ohne Einschränkung nutzbar.The advantages achieved by the invention are, in particular, that none other than the compression spring Fasteners are required, and preparatory work such as tapping is to be done, and none are Maintaining and checking tightening torques, the cooling surface remains as a flat surface and therefore without Restriction can be used.
Vorteilhaft wirkt sich auch aus, daß die Montagearbeiten durch eine Hilfskraft durchzuführen sind.It is also advantageous that the assembly work must be carried out by an assistant.
Ein Ausführungsbeispiel ist in der Zeichnung dargestellt und wird folgend näher besehrieben.An embodiment is shown in the drawing and will be described in more detail below.
Fig. 1 die Einzelteile (Auswahl)
Alu-Strangpreßprofil (1)
Druckfeder (2)
elektr. Bauteil (3)
Nut (4) Fig. 1, items (selection)
Extruded aluminum profile ( 1 )
Compression spring ( 2 )
electr. Component ( 3 )
Groove ( 4 )
Fig. 2 die Montage der Teile.
Das elektr. Bauteil (3) wird auf das Alu-Strangpreßprofil (1) aufgelegt, die
Druckfeder (2) in die Nut (4) eingelegt, durch Drucken auf die Federoberkante (F) in einem
Winkel von ca. 30° zur Bauteilebene wird die Feder vorgespannt, bis sie hörbar einrastet. Fig. 2 assembly of the parts.
The electr. Component ( 3 ) is placed on the extruded aluminum profile ( 1 ), the compression spring ( 2 ) is inserted in the groove ( 4 ), and the spring is pretensioned by pressing on the upper edge of the tongue (F) at an angle of approx. 30 ° to the component level until you hear it click into place.
Fig. 3 zeigt die komplette Befestigung. Fig. 3 shows the complete attachment.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997129851 DE19729851C2 (en) | 1997-07-11 | 1997-07-11 | Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997129851 DE19729851C2 (en) | 1997-07-11 | 1997-07-11 | Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19729851A1 true DE19729851A1 (en) | 1999-01-14 |
DE19729851C2 DE19729851C2 (en) | 2003-03-06 |
Family
ID=7835462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997129851 Expired - Lifetime DE19729851C2 (en) | 1997-07-11 | 1997-07-11 | Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE19729851C2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326458A1 (en) * | 2003-06-12 | 2005-01-20 | Phoenix Contact Gmbh & Co. Kg | Heat sink for heat dissipation for electronic components |
WO2009053159A2 (en) * | 2007-10-25 | 2009-04-30 | Robert Bosch Gmbh | Fixing clamp |
ITPS20100019A1 (en) * | 2010-07-16 | 2012-01-17 | Gorini S R L | HEAT SINK WITH QUICK CONNECTING MEANS FOR ELECTRONIC COMPONENTS |
CN106711107A (en) * | 2015-07-23 | 2017-05-24 | 江苏宏微科技股份有限公司 | Bolt-free fastening power module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8910677U1 (en) * | 1989-09-07 | 1989-10-19 | Asea Brown Boveri AG, 6800 Mannheim | Device for mounting a power component on a heat sink |
DE4141650A1 (en) * | 1991-12-17 | 1993-06-24 | Vero Electronics Gmbh | Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink |
US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
-
1997
- 1997-07-11 DE DE1997129851 patent/DE19729851C2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8910677U1 (en) * | 1989-09-07 | 1989-10-19 | Asea Brown Boveri AG, 6800 Mannheim | Device for mounting a power component on a heat sink |
DE4141650A1 (en) * | 1991-12-17 | 1993-06-24 | Vero Electronics Gmbh | Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink |
US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
Non-Patent Citations (2)
Title |
---|
07-302867 A * |
JP Patent Abstracts of Japan: 08-139239 A * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326458A1 (en) * | 2003-06-12 | 2005-01-20 | Phoenix Contact Gmbh & Co. Kg | Heat sink for heat dissipation for electronic components |
DE10326458B4 (en) * | 2003-06-12 | 2006-05-04 | Phoenix Contact Gmbh & Co. Kg | Cooling arrangement for electronic components |
US7185696B2 (en) | 2003-06-12 | 2007-03-06 | Phoenix Contact Gmbh & Co., Kg | Cooling element for heat dissipation in electronic components |
US7984754B2 (en) | 2003-06-12 | 2011-07-26 | Phoenix Contact Gmbh & Co. Kg | Cooling element for heat dissipation in electronic components |
WO2009053159A2 (en) * | 2007-10-25 | 2009-04-30 | Robert Bosch Gmbh | Fixing clamp |
WO2009053159A3 (en) * | 2007-10-25 | 2009-06-25 | Bosch Gmbh Robert | Fixing clamp |
ITPS20100019A1 (en) * | 2010-07-16 | 2012-01-17 | Gorini S R L | HEAT SINK WITH QUICK CONNECTING MEANS FOR ELECTRONIC COMPONENTS |
CN106711107A (en) * | 2015-07-23 | 2017-05-24 | 江苏宏微科技股份有限公司 | Bolt-free fastening power module |
CN106711107B (en) * | 2015-07-23 | 2019-02-15 | 江苏宏微科技股份有限公司 | Screwless fastening type power module |
Also Published As
Publication number | Publication date |
---|---|
DE19729851C2 (en) | 2003-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
OP8 | Request for examination as to paragraph 44 patent law | ||
8122 | Nonbinding interest in granting licences declared | ||
8304 | Grant after examination procedure | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE |
|
8381 | Inventor (new situation) |
Inventor name: ERNST, HEINZ, 94369 RAIN, DE |
|
R071 | Expiry of right |