DE19729851A1 - Compression spring fastener for electronic component - Google Patents

Compression spring fastener for electronic component

Info

Publication number
DE19729851A1
DE19729851A1 DE1997129851 DE19729851A DE19729851A1 DE 19729851 A1 DE19729851 A1 DE 19729851A1 DE 1997129851 DE1997129851 DE 1997129851 DE 19729851 A DE19729851 A DE 19729851A DE 19729851 A1 DE19729851 A1 DE 19729851A1
Authority
DE
Germany
Prior art keywords
compression spring
fastening
attachment
electronic component
oblique
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE1997129851
Other languages
German (de)
Other versions
DE19729851C2 (en
Inventor
Heinz Ernst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE1997129851 priority Critical patent/DE19729851C2/en
Publication of DE19729851A1 publication Critical patent/DE19729851A1/en
Application granted granted Critical
Publication of DE19729851C2 publication Critical patent/DE19729851C2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The compression spring (2) secures the electronic component (3) on an Al extruded profile (1) for heat convection in an oblique, vertically stepped groove (4). The spring shape provides a self-fastening seat under a presettable pressure in the Al extruded profile groove. The component is thus firmly pressed against the Al support, while the fastening permits complete utilisation of the cooling surface. Preferably the fastening is simple and permits secure fastening with defined force.

Description

Es ist bekannt, elektronische Bauteile auf Alu-Strangpreßkühlprofile mittels Schrauben zu befestigen, ebenso ist Stand der Technik Druckfedern in Nuten per Werkzeug zu pressen und Andruckfedern über Schraubkanäle zu verschrauben. Dabei ist es allerdings nötig, eine Vielzahl an Werkzeugen und Vorleistungen bereitzustellen.It is known to fasten electronic components on aluminum extrusion cooling profiles by means of screws, as is State of the art to press compression springs in grooves using a tool and pressure springs via screw channels screw together. However, it is necessary to provide a variety of tools and upfront services.

Der im Patentanspruch 1 angegebenen Erfindung liegt das Problem zugrunde die Befestigung der elektronischen Bauteile zu vereinfachen, einen Bauteilewechsel einfach zu ermöglichen und die Kühlfläche nicht durch Stege ein­ zuschränken.The invention specified in claim 1 is based on the problem of fastening the electronic Simplify components, make it easy to change components and the cooling surface is not blocked by webs to restrict.

Dieses Problem wird durch die im Patentanspruch 1 aufgeführten Merkmale gelöst.This problem is solved by the features listed in claim 1.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß außer der Druckfeder keine weiteren Verbindungselemente erforderlich, und Vorarbeiten wie Gewinde schneiden, zu leisten sind, außerdem sind keine Anzugsmomente einzuhalten und zu kontrollieren, die Kühlfläche bleibt als plane Fläche erhalten und somit ohne Einschränkung nutzbar.The advantages achieved by the invention are, in particular, that none other than the compression spring Fasteners are required, and preparatory work such as tapping is to be done, and none are Maintaining and checking tightening torques, the cooling surface remains as a flat surface and therefore without Restriction can be used.

Vorteilhaft wirkt sich auch aus, daß die Montagearbeiten durch eine Hilfskraft durchzuführen sind.It is also advantageous that the assembly work must be carried out by an assistant.

Ein Ausführungsbeispiel ist in der Zeichnung dargestellt und wird folgend näher besehrieben.An embodiment is shown in the drawing and will be described in more detail below.

Fig. 1 die Einzelteile (Auswahl)
Alu-Strangpreßprofil (1)
Druckfeder (2)
elektr. Bauteil (3)
Nut (4) Fig. 1, items (selection)
Extruded aluminum profile ( 1 )
Compression spring ( 2 )
electr. Component ( 3 )
Groove ( 4 )

Fig. 2 die Montage der Teile.
Das elektr. Bauteil (3) wird auf das Alu-Strangpreßprofil (1) aufgelegt, die Druckfeder (2) in die Nut (4) eingelegt, durch Drucken auf die Federoberkante (F) in einem Winkel von ca. 30° zur Bauteilebene wird die Feder vorgespannt, bis sie hörbar einrastet. Fig. 2 assembly of the parts.
The electr. Component ( 3 ) is placed on the extruded aluminum profile ( 1 ), the compression spring ( 2 ) is inserted in the groove ( 4 ), and the spring is pretensioned by pressing on the upper edge of the tongue (F) at an angle of approx. 30 ° to the component level until you hear it click into place.

Fig. 3 zeigt die komplette Befestigung. Fig. 3 shows the complete attachment.

Claims (2)

1. Befestigung elektronischer Bauteile zur Wärmeableitung auf einem Alu-Strangpreßkühlprofil mittels Druckfeder in einer schrägen, senkrecht abgesetzten Nut, dadurch gekennzeichnet, daß die Feder durch ihre Form selbsthemmend mit einem vorher bestimmbaren Druck in eine schräge, senkrecht abgesetzte Nut im Alu-Strangpreßprofil einrastet und das Bauteil auf die Unterlage preßt. Die Befestigung läßt ei­ ne vollständige Nutzung der Kühlfläche zu.1. Attachment of electronic components for heat dissipation on an aluminum extrusion cooling profile by means of a compression spring in an oblique, vertically offset groove, characterized in that the spring snaps into an oblique, vertically offset groove in the aluminum extrusion profile by its shape self-locking with a predetermined pressure presses the component onto the base. The attachment allows ei ne full use of the cooling surface. 2. Befestigung elektronischer Bauteile nach Patentanspruch 1, dadurch gekennzeichnet, daß es mit einfachen Hilfsmitteln (auch mit dem Daumen) möglich ist, eine sichere kraftdefinierbare Befestigung herbeizuführen.2. Attachment of electronic components according to claim 1, characterized, that it is possible with simple aids (also with the thumb), a secure, force-definable attachment bring about.
DE1997129851 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection Expired - Lifetime DE19729851C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997129851 DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997129851 DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Publications (2)

Publication Number Publication Date
DE19729851A1 true DE19729851A1 (en) 1999-01-14
DE19729851C2 DE19729851C2 (en) 2003-03-06

Family

ID=7835462

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997129851 Expired - Lifetime DE19729851C2 (en) 1997-07-11 1997-07-11 Attachment of an electronic component by means of a compression spring on an extruded aluminum profile using a detachable snap connection

Country Status (1)

Country Link
DE (1) DE19729851C2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10326458A1 (en) * 2003-06-12 2005-01-20 Phoenix Contact Gmbh & Co. Kg Heat sink for heat dissipation for electronic components
WO2009053159A2 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Fixing clamp
ITPS20100019A1 (en) * 2010-07-16 2012-01-17 Gorini S R L HEAT SINK WITH QUICK CONNECTING MEANS FOR ELECTRONIC COMPONENTS
CN106711107A (en) * 2015-07-23 2017-05-24 江苏宏微科技股份有限公司 Bolt-free fastening power module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8910677U1 (en) * 1989-09-07 1989-10-19 Asea Brown Boveri Ag, 6800 Mannheim, De
DE4141650A1 (en) * 1991-12-17 1993-06-24 Vero Electronics Gmbh Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8910677U1 (en) * 1989-09-07 1989-10-19 Asea Brown Boveri Ag, 6800 Mannheim, De
DE4141650A1 (en) * 1991-12-17 1993-06-24 Vero Electronics Gmbh Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink
US5466970A (en) * 1992-08-24 1995-11-14 Thermalloy, Inc. Hooked spring clip

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
07-302867 A *
JP Patent Abstracts of Japan: 08-139239 A *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10326458A1 (en) * 2003-06-12 2005-01-20 Phoenix Contact Gmbh & Co. Kg Heat sink for heat dissipation for electronic components
DE10326458B4 (en) * 2003-06-12 2006-05-04 Phoenix Contact Gmbh & Co. Kg Cooling arrangement for electronic components
US7185696B2 (en) 2003-06-12 2007-03-06 Phoenix Contact Gmbh & Co., Kg Cooling element for heat dissipation in electronic components
US7984754B2 (en) 2003-06-12 2011-07-26 Phoenix Contact Gmbh & Co. Kg Cooling element for heat dissipation in electronic components
WO2009053159A2 (en) * 2007-10-25 2009-04-30 Robert Bosch Gmbh Fixing clamp
WO2009053159A3 (en) * 2007-10-25 2009-06-25 Bosch Gmbh Robert Fixing clamp
ITPS20100019A1 (en) * 2010-07-16 2012-01-17 Gorini S R L HEAT SINK WITH QUICK CONNECTING MEANS FOR ELECTRONIC COMPONENTS
CN106711107A (en) * 2015-07-23 2017-05-24 江苏宏微科技股份有限公司 Bolt-free fastening power module
CN106711107B (en) * 2015-07-23 2019-02-15 江苏宏微科技股份有限公司 Screwless fastening type power module

Also Published As

Publication number Publication date
DE19729851C2 (en) 2003-03-06

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
OP8 Request for examination as to paragraph 44 patent law
8122 Nonbinding interest in granting licences declared
8304 Grant after examination procedure
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ROBERT BOSCH GMBH, 70469 STUTTGART, DE

8381 Inventor (new situation)

Inventor name: ERNST, HEINZ, 94369 RAIN, DE

R071 Expiry of right