DE19710225A1 - Kühlelement - Google Patents

Kühlelement

Info

Publication number
DE19710225A1
DE19710225A1 DE1997110225 DE19710225A DE19710225A1 DE 19710225 A1 DE19710225 A1 DE 19710225A1 DE 1997110225 DE1997110225 DE 1997110225 DE 19710225 A DE19710225 A DE 19710225A DE 19710225 A1 DE19710225 A1 DE 19710225A1
Authority
DE
Germany
Prior art keywords
profiles
copper
cooling element
cooling
wedge surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1997110225
Other languages
German (de)
English (en)
Inventor
Markku Puska
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nordic Aluminium Oyj
Original Assignee
Nordic Aluminium Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordic Aluminium Oyj filed Critical Nordic Aluminium Oyj
Publication of DE19710225A1 publication Critical patent/DE19710225A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE1997110225 1996-03-13 1997-03-12 Kühlelement Withdrawn DE19710225A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (fi) 1996-03-13 1996-03-13 Jäähdytyselementti

Publications (1)

Publication Number Publication Date
DE19710225A1 true DE19710225A1 (de) 1997-10-30

Family

ID=8545651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997110225 Withdrawn DE19710225A1 (de) 1996-03-13 1997-03-12 Kühlelement

Country Status (4)

Country Link
DE (1) DE19710225A1 (fi)
FI (1) FI112585B (fi)
FR (1) FR2746251B1 (fi)
SE (1) SE520269C2 (fi)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
DE3415554A1 (de) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Kuehlkoerper fuer leistungselektronische bauelemente
DE8429523U1 (de) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Kühlkörper für elektronische Bauelemente und/oder Geräte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge

Also Published As

Publication number Publication date
FR2746251A1 (fr) 1997-09-19
FI112585B (fi) 2003-12-15
SE520269C2 (sv) 2003-06-17
FR2746251B1 (fr) 2002-12-06
FI961181A (fi) 1997-09-14
SE9700880D0 (sv) 1997-03-12
FI961181A0 (fi) 1996-03-13
SE9700880L (sv) 1997-09-14

Similar Documents

Publication Publication Date Title
DE69400127T2 (de) Wärmeaustauscher für elektronische Bauteile und elektrische Apparate
DE4427854C2 (de) Kühlvorrichtung und Montageverfahren dafür
EP2567423B1 (de) Batteriekühler
EP0658934B1 (de) Kühlkörper
DE19610851A1 (de) Kühleinrichtung für elektronische Bauteile
EP0278240A2 (de) Kühlkörper, insbesondere zum Kühlen elektronischer Bauelemente
DE2417668A1 (de) Waermeaustauscher
DE102018203231A1 (de) Wärmetauscher zum kühlen mehrerer schichten aus elektronischen modulen
DE102015115507A1 (de) Kühlkörper, der mit mehreren Lamellen versehen ist, bei denen das Anbindungsverfahren unterschiedlich ist
DE1764486A1 (de) Waermeableitungsvorrichtung fuer Halbleiter u.dgl.
DE3321321A1 (de) Elektrische schaltungsanordnung
DE3834822A1 (de) Waermetauscher
DE102017222350A1 (de) Wärmetauscher für eine doppelseitige kühlung von elektronikmodulen
CH621435A5 (en) Semiconductor module
EP0514840A2 (de) Kühlvorrichtung für mindestens einen Kondensator und Verfahren zu ihrer Herstellung
DE2460631C3 (de) Kuhlkörper zur Fremdkuhlung von Thyristoren
DE19806978B4 (de) Kühlvorrichtung zur Kühlung durch Konvektion
DE2722142B2 (de) Metallische Gehäusewandung für ein elektronische Bauelemente aufnehmendes Gehäuse
DE102004042154B4 (de) Kühler
EP0585611A2 (de) Leistungswiderstand für Flüssigkeitskühlung
DE19710225A1 (de) Kühlelement
DE1501603B1 (de) Rippenrohrkuehler
DE29805944U1 (de) Stranghohlprofil für wassergekühlte, leistungselektronische Komponenten
DE202018100437U1 (de) Wärmeableiteinheit für Arbeitsspeicher
DE102018118925A1 (de) Lüfter mit Kühlkörper

Legal Events

Date Code Title Description
8141 Disposal/no request for examination