DE1965441A1 - Verfahren zum Aufbringen von Gold auf eine kupferkaschierte Polyaethylenterephthalat-Platte - Google Patents
Verfahren zum Aufbringen von Gold auf eine kupferkaschierte Polyaethylenterephthalat-PlatteInfo
- Publication number
- DE1965441A1 DE1965441A1 DE19691965441 DE1965441A DE1965441A1 DE 1965441 A1 DE1965441 A1 DE 1965441A1 DE 19691965441 DE19691965441 DE 19691965441 DE 1965441 A DE1965441 A DE 1965441A DE 1965441 A1 DE1965441 A1 DE 1965441A1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- gold
- polyethylene terephthalate
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 26
- 229910052737 gold Inorganic materials 0.000 title claims description 26
- 239000010931 gold Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 20
- -1 polyethylene terephthalate Polymers 0.000 title claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 title claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 230000007935 neutral effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229920002799 BoPET Polymers 0.000 description 7
- 239000005041 Mylar™ Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78903268A | 1968-12-31 | 1968-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1965441A1 true DE1965441A1 (de) | 1970-07-16 |
Family
ID=25146365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19691965441 Pending DE1965441A1 (de) | 1968-12-31 | 1969-12-30 | Verfahren zum Aufbringen von Gold auf eine kupferkaschierte Polyaethylenterephthalat-Platte |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS4920704B1 (enrdf_load_stackoverflow) |
| DE (1) | DE1965441A1 (enrdf_load_stackoverflow) |
| GB (1) | GB1233169A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50139307A (enrdf_load_stackoverflow) * | 1974-04-24 | 1975-11-07 |
-
1969
- 1969-11-18 GB GB1233169D patent/GB1233169A/en not_active Expired
- 1969-12-08 JP JP9792569A patent/JPS4920704B1/ja active Pending
- 1969-12-30 DE DE19691965441 patent/DE1965441A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4920704B1 (enrdf_load_stackoverflow) | 1974-05-27 |
| GB1233169A (enrdf_load_stackoverflow) | 1971-05-26 |
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